ETC QL3025

QL3025 pASIC 3 FPGA Data Sheet
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25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance
and High Density
Device Highlights
High Performance & High Density
• 25,000 Usable PLD Gates with 204 I/Os
• 300 MHz 16-bit Counters,
400 MHz Datapaths
• 0.35 µm four-layer metal non-volatile
CMOS process for smallest die sizes
Easy to Use / Fast Development
Cycles
• 100% routable with 100% utilization and
complete pin-out stability
• Variable-grain logic cells provide high
performance and 100% utilization
• Comprehensive design tools include high
quality Verilog/VHDL synthesis
Four Low-Skew Distributed
Networks
• Two array clock/control networks available
to the logic cell flip-flop clock, set and reset
inputs — each driven by an input-only pin
• Two global clock/control networks available
to the logic cell; F1, clock set, reset inputs
and the input, I/O register clock, reset, and
enable inputs as well as the output enable
control — each driven by an input-only or
I/O pin, or any logic cell output or I/O cell
feedback
High Performance
• Input + logic cell + output total delays
under 6 ns
• Data path speeds over 400 MHz
• Counter speeds over 300 MHz
Advanced I/O Capabilities
• Interfaces with both 3.3 V and 5.0 V devices
• PCI compliant with 3.3 V and 5.0 V buses
for -1/-2/-3/-4 speed grades
• Full JTAG boundary scan
• I/O Cells with individually controlled
Registered Input Path and Output Enables
Total of 204 I/O Pins
• 196 bidirectional input/output pins,
PCI-compliant for 5.0 V and 3.3 V buses for
-1/-2/-3/-4 speed grades
• Four High Drive input-only pins
• Four High Drive input-only/distributed
network pins
Figure 1: 672 pASIC 3 Logic Cells
© 2002 QuickLogic Corporation
www.quicklogic.com
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QL3025 pASIC 3 FPGA Data Sheet Rev E
Architecture Overview
The QL3025 is a 25,000 usable PLD gate member of the pASIC 3 family of FPGAs.
pASIC 3 FPGAs are fabricated on a 0.35 µm four-layer metal process using QuickLogic's
patented ViaLink technology to provide a unique combination of high performance, high
density, low cost, and extreme ease-of-use.
The QL3025 contains 672 logic cells. With a maximum of 204 I/Os, the QL3025 is
available in 144-pin TQFP, 208-pin PQFP, and 256-pin PBGA packages.
Software support for the complete pASIC 3 family, including the QL3025, is available
through three basic packages. The turnkey QuickWorks package provides the most
complete FPGA software solution from design entry to logic synthesis, to place and route,
to simulation. The QuickToolsTM for Workstations package provides a solution for designers
who use Cadence, ExemplarTM, Mentor, Synopsys, Synplicity, ViewlogicTM, AldecTM,
or other third-party tools for design entry, synthesis, or simulation.
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© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Electrical Specifications
AC Characteristics at VCC = 3.3 V, TA = 25°C (K = 1.00)
To calculate delays, multiply the appropriate K factor from Table 7 by the numbers provided
in Table 1 through Table 5.
Table 1: Logic Cells
Symbol
tPD
Propagation Delays (ns) Fanouta
Parameter
Combinatorial Delay
b
1
2
3
4
8
1.4
1.7
1.9
2.2
3.2
tSU
Setup Time b
1.7
1.7
1.7
1.7
1.7
tH
Hold Time
0.0
0.0
0.0
0.0
0.0
tCLK
Clock to Q Delay
0.7
1.0
1.2
1.5
2.5
tCWHI
Clock High Time
1.2
1.2
1.2
1.2
1.2
tCWLO
Clock Low Time
1.2
1.2
1.2
1.2
1.2
tSET
Set Delay
1.0
1.3
1.5
1.8
2.8
tRESET
Reset Delay
0.8
1.1
1.3
1.6
2.6
tSW
Set Width
1.9
1.9
1.9
1.9
1.9
tRW
Reset Width
1.8
1.8
1.8
1.8
1.8
a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and
TA = 25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature
settings as specified in Table 7.
b. These limits are derived from a representative selection of the slowest paths through the
pASIC 3 logic cell including typical net delays. Worst case delay values for specific paths should
be determined from timing analysis of your particular design.
Table 2: Input-Only/Clock Cells
Symbol
Propagation Delays (ns) Fanout a
Parameter
1
2
3
4
8
12
24
tIN
High Drive Input Delay
1.5
1.6
1.8
1.9
2.4
2.9
4.4
tINI
High Drive Input, Inverting Delay
1.6
1.7
1.9
2.0
2.5
3.0
4.5
tISU
Input Register Set-Up Time
3.1
3.1
3.1
3.1
3.1
3.1
3.1
tIH
Input Register Hold Time
0.0
0.0
0.0
0.0
0.0
0.0
0.0
tlCLK
Input Register Clock To Q
0.7
0.8
1.0
1.1
1.6
2.1
3.6
tlRST
Input Register Reset Delay
0.6
0.7
0.9
1.0
1.5
2.0
3.5
tlESU
Input Register clock Enable Set-Up Time
2.3
2.3
2.3
2.3
2.3
2.3
2.3
tlEH
Input Register Clock Enable Hold Time
0.0
0.0
0.0
0.0
0.0
0.0
0.0
a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and
TA = 25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature settings as specified in Table 7.
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QL3025 pASIC 3 FPGA Data Sheet Rev E
Table 3: Clock Cells
Symbol
Propagation Delays (ns) Loads per Half Column a
Parameter
1
2
3
4
8
10
11
tACK
Array Clock Delay
1.2
1.2
1.3
1.3
1.5
1.6
1.7
tGCKP
Global Clock Pin Delay
0.7
0.7
0.7
0.7
0.7
0.7
0.7
tGCKB
Global Clock Buffer Delay
0.8
0.8
0.9
0.9
1.1
1.2
1.3
a. The array distributed networks consist of 40 half columns and the global distributed networks consist of 44 half columns, each driven by an independent buffer. The number of half columns used
does not affect clock buffer delay. The array clock has up to eight loads per half column. The global clock has up to 11 loads per half column.
Table 4: Input-Only I/O Cells
Symbol
Parameter
Propagation Delays (ns) Fanout a
1
2
3
4
8
10
tI/O
Input Delay (bidirectional pad)
1.3
1.6
1.8
2.1
3.1
3.6
tISU
Input Register Set-Up Time
3.1
3.1
3.1
3.1
3.1
3.1
tIH
Input Register Hold Time
0.0
0.0
0.0
0.0
0.0
0.0
tlOCLK
Input Register Clock To Q
0.7
1.0
1.2
1.5
2.5
3.0
tlORST
Input Register Reset Delay
0.6
0.9
1.1
1.4
2.4
2.9
tlESU
Input Register clock Enable Set-Up Time
2.3
2.3
2.3
2.3
2.3
2.3
tlEH
Input Register Clock Enable Hold Time
0.0
0.0
0.0
0.0
0.0
0.0
a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and
TA = 25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature
settings as specified in Table 7.
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QL3025 pASIC 3 FPGA Data Sheet Rev E
Table 5: Output-Only I/O Cells
Symbol
Propagation Delays (ns) Output Load
Capacitance (pF)
Parameter
30
50
75
100
150
tOUTLH
Output Delay Low to High
2.1
2.5
3.1
3.6
4.7
tOUTHL
Output Delay High to Low
2.2
2.6
3.2
3.7
4.8
tPZH
Output Delay Tri-state to High
1.2
1.7
2.2
2.8
3.9
tPZL
Output Delay Tri-state to Low
1.6
2.0
2.6
3.1
4.2
tPHZ
Output Delay High to Tri-State
2.0
-
-
-
-
tPLZ
Output Delay Low to Tri-State
1.2
-
-
-
-
a
a. The following loads presented in Figure 2 are used for tPXZ:
tPHZ
1ΚΩ
5 pF
1ΚΩ
tPLZ
5 pF
Figure 2: Loads used for tPXZ
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QL3025 pASIC 3 FPGA Data Sheet Rev E
DC Characteristics
The DC specifications are provided in Table 6 through Table 8.
Table 6: Absolute Maximum Ratings
Parameter
Value
Parameter
Value
VCC Voltage
-0.5 V to 4.6 V
DC Input Current
±20 mA
VCCIO Voltage
-0.5 V to 7.0 V
ESD Pad Protection
±2000 V
Input Voltage
-0.5 V to VCCIO +0.5 V
Storage Temperature
-65°C to +150°C
Latch-up Immunity
±200 mA
Lead Temperature
300°C
Table 7: Operating Range
Symbol
Military
Industrial
Commercial
Unit
Min
Max
Min
Max
Min
Max
Supply Voltage
3.0
3.6
3.0
3.6
3.0
3.6
V
I/O Input Tolerance Voltage
3.0
5.5
3.0
5.5
3.0
5.25
V
TA
Ambient Temperature
-55
-
-40
85
0
70
°C
TC
Case Temperature
-
125
-
-
-
-
°C
-0 Speed Grade
-
-
0.43
1.90
0.46
1.85
n/a
-1 Speed Grade
0.42
1.64
0.43
1.54
0.46
1.50
n/a
-2 Speed Grade
0.42
1.37
0.43
1.28
0.46
1.25
n/a
-3 Speed Grade
0.43
0.90
0.46
0.88
n/a
-4 Speed Grade
0.43
0.82
0.46
0.80
n/a
VCC
VCCIO
K
6
Parameter
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Delay Factor
© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Table 8: DC Characteristics
Symbol
Parameter
Conditions
Min
Max
Units
VIH
Input HIGH Voltage
0.5 VCC
VCCIO + 0.5
V
VIL
Input LOW Voltage
-0.5
0.3 VCC
V
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
IOH = -12 mA
2.4
V
IOH = -500 µA
0.9 VCC
V
IOL = 16 mAa
0.45
V
IOL = 1.5 mA
0.1 VCC
V
II
I or I/O Input Leakage Current
VI = VCCIO or GND
-10
10
µA
IOZ
3-State Output Leakage Current
VI = VCCIO or GND
-10
10
µA
CI
Input Capacitanceb
10
pF
IOS
Output Short Circuit Currentc
ICC
ICCIO
D.C. Supply Current
d
D.C. Supply Current on VCCIO
VO = GND
-15
-180
mA
VO = VCC
40
210
mA
VI, VIO = VCCIO or GND
0.50 (typ)
2
mA
0
100
µA
a. Applies only to -1/-2/-3/-4 commercial grade devices. These speed grades are also PCI-compliant. All
other devices have 8 mA IOL specifications.
b. Capacitance is sample tested only. Clock pins are 12 pF maximum.
c. Only one output at a time. Duration should not exceed 30 seconds.
d. For -1/-2/-3/-4 commercial grade devices only. Maximum ICC is 3 mA for -0 commercial grade and all
industrial grade devices, and 5 mA for all military grade devices. For AC conditions, contact QuickLogic customer applications group. (See Contact Information).
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QL3025 pASIC 3 FPGA Data Sheet Rev E
Kv and Kt Graphs
Voltage Factor vs. Supply Voltage
1.1000
1.0800
1.0600
Kv
1.0400
1.0200
1.0000
0.9800
0.9600
0.9400
0.9200
3
3.1
3.2
3.3
3.4
3.5
3.6
Supply Voltage (V)
Figure 3: Voltage Factor vs. Supply Voltage
Temperature Factor vs. Operating Temperature
1.15
1.10
1.05
Kt
1.00
0.95
0.90
0.85
-60
-40
-20
0
20
40
60
80
Junction Temperature C
Figure 4: Temperature Factor vs. Operating Temperature
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© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Power-up Sequencing
Voltage
VCCIO
VCC
(VCCIO -VCC)MAX
VCC
400 us
Time
Figure 5: Power-up Requirements
The following requirements must be met when powering up the device (refer to Figure 5):
• When ramping up the power supplies keep (VCCIO -VCC)MAX ≤ 500 mV. Deviation from
this recommendation can cause permanent damage to the device.
• VCCIO must lead VCC when ramping the device.
• The power supply must take greater than or equal to 400 µs to reach VCC. Ramping to
VCC/VCCIO earlier than 400 µs can cause the device to behave improperly.
An internal diode is present in-between VCC and VCCIO, as shown in Figure 6.
V CC
Internal Logic
Cells, RAM
blocks, etc
V CCIO
IO Cells
Figure 6: Internal Diode Between VCC and VCCIO
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QL3025 pASIC 3 FPGA Data Sheet Rev E
JTAG
TCK
TMS
TAp Controller
State Machine
(16 States)
Instruction Decode
&
Control Logic
TRSTB
Instruction Register
RDI
Mux
Mux
TDO
Boundary-Scan Register
(Data Register)
Bypass
Register
Internal
Register
I/O Registers
User Defined Data Register
Figure 7: JTAG Block Diagram
Microprocessors and Application Specific Integrated Circuits (ASICs) pose many design
challenges, not the least of which concerns the accessibility of test points. The Joint Test
Access Group (JTAG) formed in response to this challenge, resulting in IEEE standard
1149.1, the Standard Test Access Port and Boundary Scan Architecture.
The JTAG boundary scan test methodology allows complete observation and control of the
boundary pins of a JTAG-compatible device through JTAG software. A Test Access Port
(TAP) controller works in concert with the Instruction Register (IR); these allow users to run
three required tests, along with several user-defined tests.
JTAG tests allow users to reduce system debug time, reuse test platforms and tools, and reuse
subsystem tests for fuller verification of higher level system elements.
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© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
The 1149.1 standard requires the following three tests:
• Extest Instruction. The Extest instruction performs a PCB interconnect test. This test
places a device into an external boundary test mode, selecting the boundary scan
register to be connected between the TAP's Test Data In (TDI) and Test Data Out (TDO)
pins. Boundary scan cells are preloaded with test patterns (via the Sample/Preload
Instruction), and input boundary cells capture the input data for analysis.
• Sample/Preload Instruction. This instruction allows a device to remain in its
functional mode, while selecting the boundary scan register to be connected between
the TDI and TDO pins. For this test, the boundary scan register can be accessed via a
data scan operation, allowing users to sample the functional data entering and leaving
the device.
• Bypass Instruction. The Bypass instruction allows data to skip a device's boundary
scan entirely, so the data passes through the bypass register. The Bypass instruction
allows users to test a device without passing through other devices. The bypass register
is connected between the TDI and TDO pins, allowing serial data to be transferred
through a device without affecting the operation of the device.
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QL3025 pASIC 3 FPGA Data Sheet Rev E
Pin Descriptions
Table 9: Pin Descriptions
Pin
Function
Description
TDI
Test Data In for JTAG
Hold HIGH during normal operation. Connect to
VCC if not used for JTAG.
TRSTB
Active low Reset for JTAG
Hold LOW during normal operation. Connect to
ground if not used for JTAG.
TMS
Test Mode Select for JTAG
Hold HIGH during normal operation. Connect to
VCC if not used for JTAG.
TCK
Test Clock for JTAG
Hold HIGH or LOW during normal operation.
Connect to VCC or ground if not used for JTAG.
TDO
Test data out for JTAG
STM
Special Test Mode
Output that must be left unconnected if not used for
JTAG.
Must be grounded during normal operation.
I/ACLK
High-drive input and/or array
Can be configured as either or both.
network driver
I/GCLK
High-drive input and/or global
Can be configured as either or both.
network driver
I
High-drive input
Use for input signals with high fanout.
I/O
Input/Output pin
Can be configured as an input and/or output.
VCC
Power supply pin
Connect to 3.3 V supply.
VCCIO
Input voltage tolerance pin
GND
Ground pin
Connect to 5.0 V supply if 5 V input tolerance is
required, otherwise connect to 3.3 V supply.
Connect to ground.
Ordering Information
QL 3025 - 1 PQ208 C
QuickLogic device
pASIC 3 device
part number
Speed Grade
0 = Quick
1 = Fast
2 = Faster
3 = Faster
*4 = Wow
Operating Range
C = Commercial
I = Industrial
M = Military
Package Code
PF144 = 144-pin TQFP
PQ208 = 208-pin PQFP
PB256 = 256-pin PBGA
* Contact QuickLogic regarding availability. (See Contact Information)
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QL3025 pASIC 3 FPGA Data Sheet Rev E
144 TQFP Pinout Diagram
Pin 109
Pin 1
pASIC 3
QL3025-1PF144C
Pin 37
Pin 73
Figure 8: Top View of 144 Pin TQFP
208 PQFP Pinout Diagram
Pin 157
Pin 1
pASIC 3
QL3025-1PQ208C
Pin 53
Pin 105
Figure 9: Top View of 208 Pin PQFP
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QL3025 pASIC 3 FPGA Data Sheet Rev E
144 TQFP & 208 PQFP Pinout Table
Table 10: 144 TQFP & 208 PQFP Pinout Table
14
208
PQFP
144
TQFP
Function
208
PQFP
144
TQFP
Function
208
PQFP
144
TQFP
Function
208
PQFP
144
TQFP
Function
208
PQFP
144
TQFP
Function
1
NC
I/O
43
30
GND
85
60
I/O
127
87
GND
169
117
I/O
2
1
I/O
44
31
I/O
86
61
I/O
128
88
I/O
170
118
I/O
3
2
I/O
45
NC
I/O
87
NC
I/O
129
89
I
171
119
I/O
4
3
I/O
46
32
I/O
88
62
I/O
130
90
ACLK / I
172
120
I/O
5
NC
I/O
47
NC
I/O
89
63
I/O
131
91
VCC
173
NC
I/O
6
4
I/O
48
33
I/O
90
NC
I/O
132
92
I
174
NC
I/O
7
5
I/O
49
NC
I/O
91
NC
I/O
133
93
GCLK / I
175
121
I/O
8
NC
I/O
50
34
I/O
92
64
I/O
134
94
VCC
176
NC
I/O
9
6
I/O
51
35
I/O
93
NC
I/O
135
95
I/O
177
122
GND
10
7
VCC
52
36
I/O
94
65
I/O
136
NC
I/O
178
123
I/O
11
NC
I/O
53
37
I/O
95
66
GND
137
96
I/O
179
124
I/O
12
NC
GND
54
38
TDI
96
67
I/O
138
NC
I/O
180
NC
I/O
13
8
I/O
55
39
I/O
97
NC
VCC
139
97
I/O
181
125
I/O
14
NC
I/O
56
NC
I/O
98
NC
I/O
140
98
I/O
182
126
GND
15
9
I/O
57
40
I/O
99
68
I/O
141
NC
I/O
183
127
I/O
16
NC
I/O
58
NC
I/O
100
69
I/O
142
99
I/O
184
128
I/O
17
10
I/O
59
NC
GND
101
NC
I/O
143
NC
I/O
185
129
I/O
18
11
I/O
60
41
I/O
102
70
I/O
144
100
I/O
186
NC
I/O
19
12
I/O
61
42
VCC
103
71
TRSTB
145
NC
VCC
187
130
VCCIO
20
13
I/O
62
43
I/O
104
72
TMS
146
101
I/O
188
131
I/O
21
NC
I/O
63
NC
I/O
105
NC
I/O
147
102
GND
189
132
I/O
22
14
I/O
64
44
I/O
106
73
I/O
148
103
I/O
190
NC
I/O
23
15
GND
65
45
I/O
107
NC
I/O
149
104
I/O
191
133
I/O
24
16
I/O
66
NC
I/O
108
74
I/O
150
NC
I/O
192
134
I/O
25
17
I
67
46
I/O
109
75
I/O
151
105
I/O
193
NC
I/O
26
18
ACLK / I
68
47
I/O
110
76
I/O
152
106
I/O
194
135
I/O
27
19
VCC
69
48
I/O
111
77
I/O
153
NC
I/O
195
136
I/O
28
20
I
70
NC
I/O
112
NC
I/O
154
107
I/O
196
NC
I/O
29
21
GCLK / I
71
49
I/O
113
78
I/O
155
NC
I/O
197
137
I/O
30
22
VCC
72
NC
I/O
114
79
VCC
156
108
I/O
198
NC
I/O
31
23
I/O
73
50
GND
115
80
I/O
157
109
TCK
199
138
GND
32
NC
I/O
74
51
I/O
116
NC
GND
158
110
STM
200
139
I/O
33
24
I/O
75
52
I/O
117
81
I/O
159
111
I/O
201
NC
VCC
34
NC
I/O
76
NC
I/O
118
82
I/O
160
NC
I/O
202
140
I/O
35
25
I/O
77
53
I/O
119
NC
I/O
161
112
I/O
203
NC
I/O
36
NC
I/O
78
54
GND
120
83
I/O
162
113
I/O
204
141
I/O
37
26
I/O
79
55
I/O
121
NC
I/O
163
NC
GND
205
142
I/O
38
27
I/O
80
56
I/O
122
84
I/O
164
NC
I/O
206
NC
I/O
39
28
I/O
81
NC
I/O
123
85
I/O
165
114
VCC
207
143
TDO
40
NC
I/O
82
57
I/O
124
NC
I/O
166
115
I/O
208
144
I/O
41
NC
VCC
83
58
VCCIO
125
86
I/O
167
116
I/O
42
29
I/O
84
59
I/O
126
NC
I/O
168
NC
I/O
•
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• www.quicklogic.com
•
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© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
256 PBGA Pinout Diagram
pASIC 3
QL3025-1PB256C
BOTTOM View
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PIN A1
CORNER
Figure 10: 256-Pin PBGA Pinout Diagram
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© 2002 QuickLogic Corporation
www.quicklogic.com •• 15
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QL3025 pASIC 3 FPGA Data Sheet Rev E
256 PBGA Pinout Table
Table 11: 256 PBGA Pinout Table
16
256
PBGA
Function
256
Function
256
Function
256
Function
256
Function
256
Function
A1
VSS
C4
I/O
E19
I/O
L2
ACLK / I
T17
I/O
V20
I/O
A2
I/O
C5
I/O
E20
I/O
L3
I
T18
I/O
W1
I/O
A3
I/O
C6
I/O
F1
I/O
L4
GCLK / I
T19
NC
W2
I/O
A4
I/O
C7
I/O
F2
I/O
L17
VCC
T20
I/O
W3
TDI
A5
I/O
C8
I/O
F3
I/O
L18
I/O
U1
I/O
W4
I/O
A6
I/O
C9
VCCIO
F4
VCC
L19
I/O
U2
I/O
W5
I/O
A7
I/O
C10
I/O
F17
VCC
L20
I/O
U3
I/O
W6
I/O
A8
I/O
C11
I/O
F18
NC
M1
I/O
U4
VSS
W7
I/O
A9
I/O
C12
I/O
F19
I/O
M2
I/O
U5
I/O
W8
I/O
A10
I/O
C13
I/O
F20
I/O
M3
I/O
U6
VCC
W9
I/O
A11
I/O
C14
I/O
G1
I/O
M4
NC
U7
I/O
W10
I/O
A12
I/O
C15
I/O
G2
NC
M17
NC
U8
VSS
W11
I/O
A13
I/O
C16
I/O
G3
I/O
M18
I/O
U9
I/O
W12
I/O
A14
I/O
C17
I/O
G4
I/O
M19
I/O
U10
VCC
W13
I/O
A15
I/O
C18
I/O
G17
I/O
M20
I/O
U11
I/O
W14
I/O
A16
I/O
C19
I/O
G18
I/O
N1
I/O
U12
I/O
W15
I/O
A17
I/O
C20
I/O
G19
NC
N2
I/O
U13
VSS
W16
I/O
A18
I/O
D1
I/O
G20
I/O
N3
I/O
U14
I/O
W17
I/O
A19
TCK
D2
I/O
H1
I/O
N4
VSS
U15
VCC
W18
I/O
A20
I/O
D3
I/O
H2
I/O
N17
VSS
U16
I/O
W19
I/O
B1
TDO
D4
VSS
H3
I/O
N18
I/O
U17
VSS
W20
TRSTB
B2
I/O
D5
I/O
H4
VSS
N19
I/O
U18
I/O
Y1
I/O
B3
I/O
D6
VCC
H17
VSS
N20
I/O
U19
I/O
Y2
NC
B4
I/O
D7
I/O
H18
I/O
P1
I/O
U20
I/O
Y3
I/O
B5
I/O
D8
VSS
H19
I/O
P2
I/O
V1
I/O
Y4
I/O
B6
I/O
D9
I/O
H20
I/O
P3
I/O
V2
NC
Y5
I/O
B7
I/O
D10
I/O
J1
I/O
P4
I/O
V3
I/O
Y6
I/O
B8
I/O
D11
VCC
J2
I/O
P17
I/O
V4
I/O
Y7
I/O
B9
I/O
D12
I/O
J3
NC
P18
I/O
V5
I/O
Y8
I/O
B10
I/O
D13
VSS
J4
I/O
P19
NC
V6
I/O
Y9
I/O
B11
I/O
D14
I/O
J17
NC
P20
I/O
V7
I/O
Y10
I/O
B12
I/O
D15
VCC
J18
I/O
R1
NC
V8
I/O
Y11
I/O
B13
I/O
D16
I/O
J19
I/O
R2
I/O
V9
I/O
Y12
I/O
B14
I/O
D17
VSS
J20
GCLK / I
R3
I/O
V10
I/O
Y13
I/O
B15
I/O
D18
I/O
K1
I/O
R4
VCC
V11
I/O
Y14
I/O
B16
I/O
D19
I/O
K2
I/O
R17
VCC
V12
VCCIO
Y15
I/O
B17
NC
D20
I/O
K3
I/O
R18
I/O
V13
I/O
Y16
I/O
B18
STM
E1
NC
K4
VCC
R19
I/O
V14
I/O
Y17
I/O
B19
NC
E2
I/O
K17
I
R20
I/O
V15
I/O
Y18
I/O
B20
I/O
E3
I/O
K18
ACLK / I
T1
NC
V16
I/O
Y19
I/O
C1
I/O
E4
I/O
K19
I
T2
I/O
V17
I/O
Y20
NC
C2
I/O
E17
I/O
K20
NC
T3
I/O
V18
I/O
C3
I/O
E18
I/O
L1
I
T4
NC
V19
TMS
•
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• www.quicklogic.com
•
•
•
© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Contact Information
Telephone: 408 990 4000 (US)
416 497 8884 (Canada)
44 1932 57 9011 (Europe)
49 89 930 86 170 (Germany)
852 8106 9091 (Asia)
81 45 470 5525 (Japan)
E-mail:
[email protected]
Support:
[email protected]
Web site:
http://www.quicklogic.com/
Revision History
Table 12: Revision History
Revision
Date
Comments
A
not avail.
First release.
B
not avail.
C
not avail
D
May 2001
Update of AC/DC Specs and reformat
E
June 2002
Added Kfactor, Power-up, JTAG and mechanical
drawing information. Reformatted.
Copyright Information
Copyright © 2002 QuickLogic Corporation.
All Rights Reserved.
The information contained in this product brief, and the accompanying software programs
are protected by copyright. All rights are reserved by QuickLogic Corporation. QuickLogic
Corporation reserves the right to make periodic modifications of this product without
obligation to notify any person or entity of such revision. Copying, duplicating, selling, or
otherwise distributing any part of this product without the prior written consent of an
authorized representative of QuickLogic is prohibited.
QuickLogic, QuickWorks, pASIC, and ViaLink are registered trademarks of QuickLogic
Corporation.
Verilog is a registered trademark of Cadence Design Systems, Inc.
All trademarks and registered trademarks are the property of their respective owners.
•
© 2002 QuickLogic Corporation
www.quicklogic.com •• 17
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