INTERFACE MODULE QS SERIES WIRELESS MADE SIMPLE ® SDM-USB-QS-S USB MODULE DATA GUIDE DESCRIPTION The Linx QS Series USB module allows the 0.812" rapid addition of USB to virtually any device. Housed in a compact SMD package, the QS module provides a complete solution for converting between USB and CMOS / TTL logic 0.630" USB MODULE level serial sources. The module can be directly SDM-USB-QS-S connected to virtually any serial device LOT 10000 including microprocessors, RS-232 / RS-485 level converters, or Linx wireless RF modules. The QS module is completely self contained, so it requires no external components, (except a 0.125" USB jack) and includes all necessary firmware and drivers, freeing the designer from complicated programming. Power can be Figure 1: Package Dimensions supplied externally or from the USB bus. Both USB 1.1 and USB 2.0 are supported at data rates up to 3Mbps. FEATURES Single chip USB-to-asynchronous serial data conversion Low cost 3Mbps baud rate Supports low-speed USB Full handshaking support for RS-232 and RS-485 Bus- or self-powered VID, PID, serial number, and descriptors programmed via USB No external components needed (except a USB jack) Compact surface-mount package Drivers and firmware included Supports Windows 98/2000/ME/XP USB 1.1 and 2.0 compatible APPLICATIONS INCLUDE Interface / Upgrade Legacy Peripherals Interfacing Microcontrollers To USB USB to RS-232 / RS-485 Converters Interfacing RF Modules To USB USB Smart Card Readers ORDERING INFORMATION USB Modems PART # DESCRIPTION Robotics SDM-USB-QS-S USB Module USB Instrumentation MDEV-USB-QS Master Development Kit USB Game Controllers USB-to-Serial Converter Cables Revised 1/28/08 ELECTRICAL SPECIFICATIONS Parameter PIN DESCRIPTIONS Designation Min. Typical Max. Units Notes VCC ICC 4.35 – 5.0 26.0 5.25 28.0 VDC mA – – – 0.0003 – 3.0 Mbps – VOL VOH 0.3 3.2 – 0.4 4.1 – 0.6 4.9 1,024 VDC VDC Bits – – – POWER SUPPLY Operating Voltage Supply Current UART SECTION Data Rate Data Output: Logic Low Logic High EEPROM Size USB SECTION Data Output: Logic Low Logic High Single-Ended RX Threshold Differential Common Mode Differential Input Sensitivity Driver Output Impedance ENVIRONMENTAL Operating Temperature Range UVOL UVOH UVSE UCOM UVDIF UDRVZ 0.0 2.8 0.8 0.8 0.2 29 – – – – – – 0.3 3.6 2.0 2.5 – 44 VDC VDC VDC VDC VDC Ω – – – – – – – 0.0 – +70 °C – Pin # Name Description 1 USBDP USB data signal plus 2 USBDM USB data signal minus 3 GND Ground supply 4 VCC Positive power supply 5 SUSP_IND Goes low during USB Suspend Mode. This pin can be used to power down external logic when the host puts the USB bus into suspend mode. 6 RX_IND This line will pulse low when receiving data from the USB bus. This allows for the connection of a LED indicator. 7 TX_IND This line will pulse low when transmitting data on the USB bus. This allows for the connection of a LED indicator. 8 485_TX Transmit enable line for RS-485 applications 9 DTR Data Terminal Ready control / handshake output 10 CTS Clear To Send control / handshake input 11 RTS Request To Send control / handshake output 12 DATA_OUT Transmit asynchronous data output 13 DATA_IN Receive asynchronous data input 14 DSR Data Set Ready control / handshake input 15 DCD Data Carrier Detect control / input 16 RI Ring Indicator control input ABSOLUTE MAXIMUM RATINGS Supply Voltage VCC Any Input or Output Pin Max Current Sourced By Outputs Operating Temperature Storage Temperature Soldering Temperature -0.5 -0.5 to +6.0 to VCC + 0.5 24 0 to +70 -65 to +150 +225°C for 10 seconds VDC VDC mA °C °C *NOTE* Exceeding any of the limits of this section may lead to permanent damage to the device. Furthermore, extended operation at these maximum ratings may reduce the life of this device. *CAUTION* This product incorporates numerous static-sensitive components. Always wear an ESD wrist strap and observe proper ESD handling procedures when working with this device. Failure to observe this precaution may result in module damage or failure. PIN ASSIGNMENTS 1 2 3 4 5 6 7 8 USBDP RI USBDM DCD GND DSR VCC DATA_IN SUSP_IND DATA_OUT RX_IND RTS TX_IND CTS 485_TX DTR 16 15 14 13 12 11 10 9 Figure 2: SDM-USB-QS-S Pinout (Top View) Page 2 Page 3 PAD LAYOUT AUTOMATED ASSEMBLY The following pad layout diagram is designed to facilitate both hand and automated assembly. For high-volume assembly, most users will want to auto-place the modules. The modules have been designed to maintain compatibility with reflow processing techniques; however, due to the their hybrid nature, certain aspects of the assembly process are far more critical than for other component types. 0.065" Following are brief discussions of the three primary areas where caution must be observed. Reflow Temperature Profile 0.610" The single most critical stage in the automated assembly process is the reflow stage. The reflow profile below should not be exceeded, since excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel will need to pay careful attention to the oven’s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by the modules. The figure below shows the recommended reflow oven profile for the modules. 0.070" 0.100" Figure 3: Recommended PCB Layout PRODUCTION GUIDELINES 300 The modules are housed in a hybrid SMD package that supports hand or automated assembly techniques. Since the modules contain discrete components internally, the assembly procedures are critical to ensuring the reliable function of the modules. The following procedures should be reviewed with and practiced by all assembly personnel. Pads located on the bottom of the module are the primary mounting surface. Since these pads are inaccessible during mounting, castellations that run up the side of the module have been provided to facilitate solder wicking to the module’s underside. This allows for very quick hand soldering for prototyping and small volume production. Soldering Iron Tip 217°C 200 185°C 180°C 150 125°C 50 Castellations 0 30 60 90 120 150 180 210 240 270 300 330 360 Time (Seconds) Figure 4: Soldering Technique If the recommended pad guidelines have been followed, the pads will protrude slightly past the edge of the module. Use a fine soldering tip to heat the board pad and the castellation, then introduce solder to the pad at the module’s edge. The solder will wick underneath the module, providing reliable attachment. Tack one module corner first and then work around the device, taking care not to exceed the times listed below. Absolute Maximum Solder Times Hand-Solder Temp. TX +225°C for 10 Seconds Hand-Solder Temp. RX +225°C for 10 Seconds Recommended Solder Melting Point +180°C Reflow Oven: +220°C Max. (See adjoining diagram) Page 4 235°C 100 Solder PCB Pads Recommended Non-RoHS Profile 255°C 250 Temperature (oC) HAND ASSEMBLY Recommended RoHS Profile Max RoHS Profile Figure 19: Maximum Reflow Profile Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the modules not be subjected to shock or vibration during the time solder is liquid. Should a shock be applied, some internal components could be lifted from their pads, causing the module to not function properly. Washability The modules are wash resistant, but are not hermetically sealed. Linx recommends wash-free manufacturing; however, the modules can be subjected to a wash cycle provided that a drying time is allowed prior to applying electrical power to the modules. The drying time should be sufficient to allow any moisture that may have migrated into the module to evaporate, thus eliminating the potential for shorting damage during power-up or testing. If the wash contains contaminants, the performance may be adversely affected, even after drying. Page 5 MODULE DESCRIPTION The Linx SDM-USB-QS-S module will convert USB signals from a host, such as a PC or hub, into TTL logic level signals. This enables the module to be connected directly to microcontrollers (or Linx RF modules for wireless applications) or to RS-232 or RS-485 level converters for communication with legacy devices. The module handles all of the complicated enumeration and bus communication processes, freeing the designer to focus on handling the data. All necessary firmware is included in the module and the device descriptors can easily be changed to customize the device. The host application software can access the USB device by simple, custom functions or by standard Windows Win32 API calls. In addition, Virtual COM Port drivers are available that make the USB module appear to the PC as an additional COM port, without the need for additional system resources, such as an IRQ or address. This allows the designer to program the application software to use standard serial or parallel ports and then simply select the port that represents the USB module. The drivers will automatically direct the data to the USB bus and the device. THEORY OF OPERATION Figure 7 below shows a block diagram of the QS module. SUSP_IND VCC GND TX Buffer 128 Bytes DATA_OUT DATA_IN RTS CTS USBDP USB Transceiver Serial Interface Engine (SIE) USB Protocol Engine USBDM UART FIFO Controller DTR UART DSR DCD RI 485_TX TX_IND RX_IND USB DPLL RX Buffer 384 Bytes INSTALLING THE DRIVERS The drivers for the USB module are included with the module’s development system or may be downloaded from the Linx website at www.linxtechnologies.com. These drivers should be downloaded onto the hard drive of a PC or onto a disk. When the module is attached to the PC for the first time, Windows will automatically detect the device and search for the best driver. Windows will prompt for the location of the drivers, so browse to the folder or the disk, click Next, and Windows will do the rest. Windows XP may return an error window as shown in the figure below. Clock Figure 7: SDM-USB-QS-S Block Diagram The USB transceiver block provides the physical interface for the USB signalling. The USB DPLL locks onto the NRZ data and provides separate recovered clock and data signals to the Serial Interface Engine (SIE). The SIE performs the parallel-to-serial and serial-to-parallel conversion, bitstuffing / un-stuffing, and CRC calculations on the USB data. The USB Protocol Engine manages the data from the USB control endpoint, the USB protocol requests from the USB host controller, and the commands for controlling the functional parameters of the UART. Data from the USB data out endpoint is stored in the TX buffer and removed from the buffer to the UART transmit register under control of the UART FIFO controller. Data from the UART receive register is stored in the RX buffer prior to being removed by the SIE on a USB request for data from the device data in endpoint. The UART FIFO controller handles the transfer of data between the RX and TX buffers and the UART transmit and receive registers. Figure 6: Windows XP Driver Error Window This window is simply a warning that the driver has not gone through Microsoft’s certification process and could potentially pose a problem for the system. The drivers provided for the QS module have been independently tested and should not pose any problems unless modified by the user. Click the Continue Anyway button to finish the installation process. Page 6 The UART performs asynchronous 7 / 8 bit parallel-to-serial and serial-to-parallel conversion of the data on the RS-232 interface. Control signals supported by the UART include RTS, CTS, DSR , DTR, DCD, and RI. The UART provides a transmitter-enable control signal (485_TX) to assist with interfacing to RS-485 transceivers. The UART supports RTS / CTS, DSR / DTR and X-On / X-Off handshaking options. Handshaking, where required, is handled in hardware to ensure fast response times. The UART also supports the RS-232 BREAK setting and detection conditions. Page 7 TYPICAL APPLICATIONS The USB module can be powered in two ways: from the USB bus or from an external source. If necessary, a voltage regulator can be used to supply a clean 5V as the external source, or the VCC pin can be connected to the bus power pin of the USB connector. Using the bus to power the module is an advantage because the module then uses power from the host rather than from the peripheral. This is especially helpful if the peripheral is battery-powered. Figure 8 shows the schematic for a bus-powered device. There are many potential uses for the QS Series modules, three of which will be described here. Figure 9 shows the QS and a MAX213 RS-232 level converter IC from Maxim. This creates a USB-to-RS-232 converter that supports all of the standard handshaking lines. Similarly, RS-485 or RS-422 level converter chips could be used for designs requiring those standards. VCC SDM-USB-QS-S 4 5 6 7 8 USBDM DCD 15 DSR 14 DATA_IN 13 DATA_OUT 12 GND VCC SUSP_IND RX_IND RTS TX_IND CTS 485_TX DTR 0.1uF + 16V 16 TX DATA DTR RTS 11 CTS 9 DCD DSR Figure 8: USB Bus-Powered Schematic RX DATA RI VCC Note: when these drivers are installed on a system with Windows XP, an error message may be displayed stating that these drivers are not certified and could potentially crash the system. As long as no other changes are made to the .inf files, this should not be a concern. Page 8 8 5 26 22 19 25 GSHD GSHD C1- GND V- 17 + C2T1IN T1OUT T2IN T2OUT T3IN T3OUT T4IN T4OUT R1OUT R1IN R2OUT R2IN R3OUT R3IN R4OUT R4IN R5OUT R5IN 0.1uF 16V 2 3 1 SDM-USB-QS-S 1 2 GND MAX213 C2+ 4 3 2 1 GND DAT+ DAT 5V 3 4 GND GND SUSP_IND 5 RI USBDM DCD GND DSR VCC DATA_IN RX_IND 7 8 DTR2 RTS TX_IND CTS 485_TX DTR 220 220 27 23 18 14 13 12 11 10 9 RI DCD DSR RX DATA TX DATA RTS CTS DTR 1 DCD2 VCC 4 16 15 RTS2 28 9 DATA_OUT SUSP_IND 6 TX DATA2 USBDP 6 DSR2 CTS2 TX DATA2 DCD2 RTS2 DSR2 RX DATA2 RX DATA2 CTS2 RI2 DTR2 2 7 3 8 4 9 RI2 EN 5 SHDN GND 10 DB9M Figure 9: RS-232 To USB Converter The QS Series modules can be used with Linx RF modules to create a wireless link between two PCs. Figure 10 shows a design using the ES Series RF modules. An option not shown in the schematic below is that one of the output lines of the QS module (RTS or DTR) could be connected to the PDN lines of the RF modules, enabling the host to turn the RF modules on and off. The QS can be customized to display your product’s name, manufacturer name, and to use different Product Identifiers (PID) and Vendor Identifiers (VID). This allows an end user to see the final product’s name in their Windows Device Manager and when the hardware is first loaded. The PID and VID are set by the USB Implementers Forum and should not be changed unless the final product has gone through the certification process and received its own unique IDs. RXM-XXX-ES 1 1 VCC 2 3 4 5 TXM-XXX-ES PDN ANT LVL ADJ GND LOW V DET GND /CLK SEL DATA /CLK 10 9 8 7 6 VCC 8 GSHD USB Type B Connector GND DAT+ DAT 5V GND 6 Once the module is reprogrammed, some modifications to the driver files may be necessary. If a VID and PID other than the default Linx numbers are used, these numbers will need to be added to the files. This requires modifying several lines in the .inf files and is described in detail in the QS Series Programmer’s Guide. Modifying the name displayed by the Windows Device Manager requires changing only one line, also described in the Programmer’s Guide. 20 24 SUSP_IND CHANGING THE DEVICE DESCRIPTORS The Manufacturer, Description, and Serial Number strings can all be modified using the QS EEPROM Programmer software, which can be downloaded from the Linx web site. This easy-to-use software will reprogram the module via the USB bus and can be done as a part of the final testing procedure. 6 21 10 The USB specification has strict allowances for using power from the bus. A device is allowed to use 100mA before enumeration, 500mA during normal operation, and 500mA in suspend mode. A descriptor stored in the EEPROM will tell the host how much current the device will pull from the bus so that the host can allocate the appropriate power. The modules come programmed for 100mA, but if the final product will draw more than this, then the device descriptors will need to be changed as described below. 7 0.1uF 6.3V GND VCC 220 1 2 3 4 5 6 7 8 SDM-USB-QS-S USBDP RI USBDM DSR GND VCC SUSP_IND DATA_OUT RX_IND RTS TX_IND CTS 485_TX DTR 16 15 14 12 11 10 9 DAT+ DAT 5V 4 3 2 GND GND VCC 220 TX Side NC NC NC NC PDN RSSI DATA AUDIO AREF NC 16 15 14 13 12 11 10 9 GND USB Type B Connector GSHD GND GND 3 RI 13 GSHD GND 16 USBDP + V+ 5 2 14 15 11 VCC C1+ 6 1 GSHD GND 5 4 3 2 1 0.1uF + 6.3V 5 12 6 5 GSHD GSHD USB Type B Connector GND DAT+ DAT 5V USB Type B Connector + 0.1uF 6 POWER SUPPLY GUIDELINES GND 1 2 3 4 5 6 7 8 SDM-USB-QS-S USBDP RI USBDM DCD DSR GND VCC DATA_IN SUSP_IND DATA_OUT RX_IND RTS TX_IND CTS 485_TX DTR 16 15 14 13 12 11 10 9 RX Side Figure 10: Wireless Modem Using ES Series RF Modules Page 9 TYPICAL APPLICATIONS (CONT.) SERIAL NUMBER CONSIDERATIONS Figure 11 below shows the QS module connected to a microprocessor. This is the design used in the QS Master Development Kit and the documentation for the kit describes the connections and software. VCC 220 1 2 3 4 5 6 7 8 9 220 220 RA2/AN2 RA3/AN3 RA4/AN4 MCLR/VPP GND RB0/INT RB1 RB2/RX RB3 18 17 16 15 14 13 12 11 10 RA1/AN1 RA7 RA6 VCC RB7 RB6 RB5/TX RB4 10K VCC SW-PB 200K PIC16F88 With the serial number disabled, Windows will track each device by connection and assign a USB port to a particular device. If the device is moved to another port, it will need to be reinstalled. The problem that arises is that the device will be installed on the same PC multiple times, once for each USB port into which it has been plugged. GSHD SDM-USB-QS-S 4 3 2 1 1 2 3 4 5 6 GSHD USB Type B Connector GND DAT+ DAT 5V 5 220 VCC 220 6 7 8 USBDP RI USBDM DCD GND DSR VCC SUSP_IND DATA_IN DATA_OUT RX_IND RTS TX_IND CTS 485_TX DTR 16 15 14 13 12 11 VCC 220 10 9 220 Figure 11: Interface With A Microprocessor SOFTWARE CONSIDERATIONS The PC needs a set of drivers that tell it how to communicate with the QS module. There are two types available free from the Linx website. The first are Virtual COM Port drivers. These drivers make the QS appear as an extra COM port on the host PC. This allows the application to use standard writes and reads to a serial port, and the drivers will redirect data to the USB device. The second set are the Direct Drivers. These drivers support a series of custom functions that allow more direct control of the QS module. These functions are described in Application Note AN-00200: SDM-USB-QS-S Programmer’s Guide, where examples are given in both Visual Basic and C. The Programmer’s Guide can be downloaded from the Application Notes page in the Support section of the Linx website at www.linxtechnologies.com. Sample software is available on the Software page in the Support section. In addition to the Programmer’s Guide, the QS Master Development System (MDEVUSB-QS) includes example software and sample system source code. This source code provides the driver function declarations, examples of how to use the functions in a program, and other code that may be of use. Page 10 The VID and PID are used by Windows to determine what devices are attached to the bus and which drivers to load in order to communicate with each device. A unique serial number is used to distinguish between different devices of the same type so that the operating system can be sure that it is communicating with the correct one. Windows will view every different combination of VID, PID, and serial number as a new device and will start the “Found New Hardware” wizard for each one. This is an issue in a mass production environment, so the QS modules are shipped with the “Enable Serial Number” option disabled in the EEPROM. This prevents the serial number from being used during ennumeration. It is recommended to set the “Enable Serial Number” option and to use a unique serial number as a part of the final testing procedure of your product. The QS EEPROM Programmer can be downloaded from the Linx website and the EEPROM programming functions can be found in Application Note AN-00200. These can be used as a part of an automated test program at the end of the production line to program custom descriptors and a unique serial number into the product. Avoid using the same serial number for multiple devices, as it can cause a conflict in the operating system. Windows XP has a particular problem with this and may crash if it sees two of the same type of device with the same serial number on the same bus. HELPFUL APPLICATION NOTES FROM LINX It is not the intention of this manual to address in depth many of the issues that should be considered to ensure that the modules function correctly and deliver the maximum possible performance. As you proceed with your design, you may wish to obtain the following application notes. They are available on line at www.linxtechnologies.com or by contacting the Linx literature department. NOTE APPLICATION NOTE TITLE AN-00200 SDM-USB-QS-S Programmer’s Guide AN-00201 Installing the SDM-USB-QS-S Drivers Page 11 WIRELESS MADE SIMPLE ® U.S. CORPORATE HEADQUARTERS LINX TECHNOLOGIES, INC. 159 ORT LANE MERLIN, OR 97532 PHONE: (541) 471-6256 FAX: (541) 471-6251 www.linxtechnologies.com Disclaimer Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. 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