Agilent ACPF-7001 High Rejection Tx Filter for US PCS Band Data Sheet Features • High rejection from a single filter with no switches required In typical cellular phone architectures, the transmit filter fits between the driver amplifier and the power amplifier. This filter reduces the noise in the Rx band being amplified by the transmit chain, enhancing receiver sensitivity. High rejection keeps unwanted signals out of the receive path. Agilent’s thin-Film Bulk Acoustic Resonator (FBAR) technology makes possible high-Q filters at a fraction of their usual size. Package 1 3.0 ± 0.15 SQ Description This product is a high rejection full band transmit filter designed for US PCS handsets. Its performance rivals splitband surface acoustic wave (SAW) transmit filters. Since the rejection is provided by a single filter, no switches are required, saving board space and external components, eliminating switch loss, and reducing programming complexity. • Passband: 1850 –1910 MHz 33 dB min Attenuation, 1930 – 1990 MHz 3.5 dB max Insertion Loss 2 8 3 4 9 7 6 4: Input 8: Output 1, 2, 3, 5, 6, 7, 9: Grounded Center pad grounded See Figure 10 for details. "x" = date code character 5 • Space saving solution Small footprint: 3 x 3-mm solution Low profile package: 1.0 mm high (typ) 1.15 mm (max) Applications • US PCS band handsets • Wireless data terminals Electrical Specifications, ZO = 50Ω Symbol Parameter Units 25°C Min Typ Max -30° to +25°C Min Typ Max 25° to +70°C Min Typ Max f Passband MHz 1850 1850 1850 IL Insertion Loss 1850-1855 MHz dB 2.0 3.5 3.7 3.2 IL Insertion Loss 1855-1905 MHz dB 1.5 3.0 3.0 3.0 IL Insertion Loss 1905-1910 MHz dB 2.5 3.5 3.2 3.7 ∆S21 Ripple, 1850-1910 MHz dB S21 Min Rejection, 1930-1990 MHz dB 33 S21 Min Rejection, 10-1800 MHz dB 25 S21 Min Rejection, 1990-3820 MHz dB 30 S21 Min Rejection, 3820-5730 MHz dB S11, S22 In-band Return Loss dB 9.0 Pin max Safe Input Power Level dBm 20 1910 1910 1910 2.5 37 33 33 15 11 9.0 11 20 9.0 11 20 Absolute Maximum Ratings [2] Parameter Unit Value Operating Temperature[1] °C –30 to +85 Storage Temperature[1] °C -30 to +100 Notes: 1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board. 2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to the device. 0 0 -10 -1 ATTENUATION (dB) ATTENUATION (dB) Typical Performance, 25°C, ZO = 50Ω -20 -30 -2 -3 -40 -4 -50 1.7 1.80 1.90 2.00 -5 1.83 2.10 1.85 FREQUENCY (GHz) 1.89 1.91 1.93 Figure 2. Insertion Loss vs. Frequency. 0 0 -10 -4 RETURN LOSS (dB) ATTENUATION (dB) Figure 1. Attenuation vs. Frequency. -20 -30 -40 -8 -12 -16 -50 0 1.0 2.0 3.0 4.0 5.0 FREQUENCY (GHz) Figure 3. Attenuation vs. Frequency (Broadband). 2 1.87 FREQUENCY (GHz) 6.0 -20 1.83 1.85 1.87 1.89 1.91 FREQUENCY (GHz) Figure 4. Return Loss vs. Frequency. 1.93 PCB Interface and Mounting Instructions Mounting Consideration and Board Description The ACPF-7001 filter has one input (Pin 4), one output (Pin 8) and 6 grounds (Pins 1, 2, 3, 5, 6, 7). Furthermore, the inside of the filter (center pad Pin 9) is ground-plane; therefore it must be soldered to PCB ground. In summary: • Pins 1, 2, 3, 5, 6, 7, 9 are grounded. (Figure 5) • Demo board uses 10 mil top, 18 mil bottom Greek Coplanar Waveguide Over Ground plane (CPWG) style board. (See board layer Figure 5, 6) Note: For best performance, try to reproduce this board stack up closely. The demoboard uses CPWG transmission lines for high isolation between two ports. It uses via holes to connect the CPWG line from the underside of the board to the filter mounting pads on top. If Ground-SignalGround (GSG) type board is used, better return loss can be achieved since it eliminates connector mismatch. Figure 5. PCB top and bottom views (vias used to connect the underside of the board to the filter mounting pads on top). 3 Ground 1.55 SQ 2 Ground 1 Ground 0.1 9 Ground 4 Input 8 Output 0.28 0.6 0.28 5 6 Ground 0.1 Ground 7 Ground 0.7 1.3 Figure 6a. PCB footprint dimensions, pad nomenclature, stencil dimensions (mm). Demo Boards SMA connectorized Demo boards are available for sampling. (See board drawing in Figure 5). Figure 6b. Board stack up description. 3 0.7 4.0 ± 0.1[2] 2.0 ± 0.1[1] 0.3 ± 0.05 1.75 ± 0.1 φ1.55 ± 0.05 5.5 ± 0.1[3] 3.3 ± 0.1 CL 12.0 ± 0.3 φ1.6 ± 0.1 R 0.3 typ 1.55 ± 0.1 3.3 ± 0.1 8.0 ± 0.1 Notes: 1. Measured from centerline of sprocket hole to centerline of pocket 2. Cumulative tolerance of 10 sprocket holes is ±0.20 All dimensions in millimeters unless otherwise stated. Figure 7. Tape drawing. 13.0 ± 0.5 179.0 ± 1.0 60.00 ± 0.5 1.60 Figure 8. Reel drawing. 4 REEL Ordering Information Specify part number followed by option. For example: ACPF-7001-XXX CARRIER TAPE Bulk or Tape and Reel option Option Descriptions -BLK = Bulk, 100 pcs. per antistatic bag USER FEED DIRECTION -TR1 = Tape and Reel, 1000 devices per 7" reel COVER TAPE Notes: 1. Material polyester and acrylic adhesive layers 2. All dimensions in mm, except tape length. 3. Surface resistivity: 106 to 1012 ohms/sq Figure 9a. Device orientation in the tape. User Feed Direction 11XX TXXX Empty Pocket/Cavity Leader: 125 Pocket - 1 Meter Trailer: 125 Pocket - 1 Meter 11XX TXXX 11XX TXXX Top View End View Figure 9b. Device orientation in the tape. 2 3 0.35 ± 0.15 8X IN 1 1.25 max 0M 0.50 ± 0.15 Orientation Feature 0.3 0.50 ± 0.15 0.30 MIN 3.0 ± 0.15 SQ 9 1.40 SQ 4 8 0.40 0.40 ± 0.15 0.30 DIA 0.20 DIA 7 6 0.60 ± 0.15 5 Castellation height: 0.35 mm Total height: 1.1 mm (typ) 1.25 mm (max) Shaded region: grounded Figure 10. Detailed bottom and side view of package (dimensions in mm). 5 SIDE VIEW Alloy type Melting temp. (oC) Recommended working temperature (oC) Comments Sn42Bi58 138 160 – 180 Lead free Sn43Pb43Bi14 144 – 163 165 – 185 Contains lead – some customers prohibit it Sn63Pb37 183 200 – 240 Contains lead – some customers prohibit it Sn60Pb40 186 200 – 240 Contains lead – some customers prohibit it Sn91/Zn9 199 200 – 240 May have oxidation problems Sn96.2Ag2.5Cu0.8Sb0.5 216 235 – 255 Popular lead free composition Sn95.8Ag3.5Cu0.7 217 235 – 255 Other alloy ratios are available Sn96.5Ag3.5 221 240 – 260 Used in the assembly of filters Sn100 232 260 – 280 Too hot – will melt package assembly Sn95Sb5 235 260 – 280 Too hot – will melt package assembly Sn97Cu3 240 260 – 300 Too hot – will melt package assembly 10 to 20 sec. 250 235°C ± 5°C 217°C 200 60 to 120 sec. Temperature, °C 125°C ± 25°C 150 -6°C/sec. max 3°C/sec. max 100 120 sec. max. Guidelines Tested profile 50 0 0 100 200 300 Time, seconds Figure 11. Recommended solder profile. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-6276EN March 20, 2003 5988-8531EN 400 500 600