MS52XX (RoHS*) SMD PRESSURE SENSOR • • • • • • 1 and 12 bar absolute pressure range Uncompensated Piezoresistive silicon micromachined sensor Surface mount 7.6 x 7.6 mm Low noise, high sensitivity, high linearity RoHS-compatible & Pb-free* DESCRIPTION The MS52XX SMD pressure sensor series is designed for pressure sensor systems with highest demands on resolution and accuracy. The device consists of a silicon micromachined pressure sensor die mounted on a 7.6 x 7.6 mm ceramic carrier protected by a metal cap. The MS52XX can be delivered in a highly sensitive version giving a maximal output voltage or in a highly linear version giving a linear output voltage directly proportional to the applied pressure. High Sensitivity Version High Linearity Versions Full Scale Pressure Product Code Full Scale Span / Linearity Product Code Full Scale Span / Linearity 1 bar MS5201-AN 240 mV / ±0.2% FS MS5201-BN 150 mV / ±0.05% FS MS5212-BM 150 mV / ±0.05% FS 12 bar FEATURES • Low cost SMD ceramic package • High reliability, low drift • -40°C to +125 °C operation range • Optional: Gel protection against humidity and water APPLICATIONS • Absolute pressure sensor systems • High resolution altimeters, variometers • Barometers • Engine controls • Diver’s computers • Tire pressure PIN CONFIGURATION 3: VS+ 4: OUT+ 1: OUT- 2: GND * The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 1 PIN DESCRIPTION Pin Name Pin No. Function OUT- 1 Negative output voltage of Wheatstone bridge GND 2 Ground VS+ 3 Supply voltage of Wheatstone bridge OUT+ 4 Positive output voltage of Wheatstone bridge ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure MS5201-AN MS5201-BN MS5212-BM DA52XXYZ_012 000052xx223 ECN0828 Symbol Conditions Min Max -40 - 20 +125 5 10 30 o VS+ TS Ta = 25 C P Ta = 25 oC December 19, 2005 Unit V C o bar 2 ELECTRICAL CHARACTERISTICS HIGH SENSITIVITY VERSION (VS+ = 5 V; Ta = 25°C ) Parameter Min Typ Max Unit 0 - 1 bar Full-scale span (FS) 190 240 290 mV Sensitivity 190 240 290 mV/bar - ±0.15 ±0.4 % FS Operating temperature range -40 - 125 °C Zero pressure offset -40 0 40 mV Pressure hysteresis - - ±0.20 % FS 2, 6 Temperature hysteresis - 0.3 0.8 % FS 3, 6 Repeatability - - ±0.20 % FS 4, 6 3.0 3.4 3.8 kΩ +2’400 -1’500 -80 2’900 -1’900 - +3’300 -2’300 +80 ppm/°C ppm/°C µV/°C Operating pressure range Linearity MS5201-AN Bridge resistance Temperature coefficient of resistance Temperature coefficient of span Temperature coefficient of offset Notes 1, 6 5, 6 5, 6 5, 6 NOTES 1) Deviation at one half full-scale pressure from the least squares best line fit over pressure range. 2) Maximum difference of output voltage after 1 pressure cycle at any pressure within the operating pressure range. 3) Maximum difference in offset after one thermal cycle from -40°C to +125°C. 4) Same as 2) after 10 pressure cycles. 5) Slope of the endpoint straight line from 25°C to 60°C. 6) Not 100% tested. DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 3 ELECTRICAL CHARACTERISTICS (CONT.) HIGH LINEARITY VERSIONS (VS+ = 5 V; Ta = 25°C ) Parameter Min Typ Max Unit 0 - 1 bar Full-scale span (FS) 120 150 180 mV Sensitivity 120 150 180 mV/bar Linearity - ±0.05 ±0.2 % FS Operating pressure range 0 - 12 bar Full-scale span (FS) 120 150 180 mV Sensitivity 10 12.5 15 mV/bar - ±0.05 ±0.2 % FS Operating temperature range -40 - 125 °C Zero pressure offset -40 0 40 mV Pressure hysteresis - - ±0.2 % FS 2, 6 Temperature hysteresis - 0.3 0.8 % FS 3, 6 Repeatability - - ±0.2 % FS 4, 6, 7 3.0 3.4 3.8 kΩ +2’400 -1’500 -80 2’900 -1’900 - +3’300 -2’300 +80 ppm/°C ppm/°C µV/°C Operating pressure range MS5201-BN MS5212-BM Linearity All Ranges Bridge resistance Temperature coefficient of resistance Temperature coefficient of span Temperature coefficient of offset Notes 1, 6 1, 6 5, 6 5, 6 5, 6 NOTES 1) Deviation at one half full-scale pressure from the least squares best line fit over pressure range. 2) Maximum difference of output voltage after 1 pressure cycle at any pressure within the operating pressure range. 3) Maximum difference in offset after one thermal cycle from -40°C to +120°C. 4) Same as 2) after 10 pressure cycles. 5) Slope of the endpoint straight line from 25°C to 60°C. 6) Not 100% tested. 7) MS5212-BM: Max. 0.3% FS. DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 4 APPLICATION INFORMATION GENERAL The MS52XX is a miniaturised absolute pressure sensor series that has been designed for surface mounting applications. Its main advantages are the high reliability of the semiconductor sensor and a design which makes it suitable for applications requiring small-scale and cost-efficient solutions. The sensor element of the MS52XX consists of a micromachined silicone membrane with Pyrex glass waferbonded under vacuum to the backside for reference pressure. Implanted resistors make use of the piezoresistive effect to sense pressure applied to the membrane. The sensor is mounted in a special process allowing best-offset stability making the part suitable for direct PCB assembly. Typical applications for this miniaturised pressure sensor MS52XX are altitude measurements and the measurement of atmospheric reference pressure in medical and industrial equipment as well as in automotive and household applications, consumer electronics and pneumatics. Full Scale Pressure High Sensitivity Version (MS5201-AN) High Linearity Versions (MS5201-BN and MS5212-BM) 1 bar Variometer, Altimeter, Barometer High End Altimeter, Medical Instrumentation 12 bar Pneumatic Brake, Diving Computer LIGHT SENSITIVITY The MS52XX is sensitive to sunlight, especially to infrared light sources. This is due to the strong photo effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final product the sensor cannot be exposed to direct light during operation. This can be achieved for instance by placing mechanical parts with holes in such way that light cannot go trough. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB to connect it. This can be important for applications in watches and other special devices, and will also reduce mechanical stress on the device. For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the solder junctions by covering the rim or the corners of MS52XX ceramic substrate with glue or Globtop-like material. SOLDERING Please refer to the application note AN808 for all soldering issues. CLEANING The MS52XX has been manufactured under cleanroom conditions. Each device has been inspected for the homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor. DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 5 PACKAGE OUTLINES Device package outlines of MS5201-AN and MS5201-BN (Metal cap with nickel finish, gel protection of bonding wires) DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 6 PACKAGE OUTLINES (CONT.) Device package outlines of MS5212-BM (Stainless steel cap, no gel protection of bonding wires) DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 7 RECOMMENDED PAD LAYOUT Recommended pad layout for soldering of the MS52xx on a printed circuit board ORDERING INFORMATION Product Code Product Art.-Nr. Package MS5201-AN Pressure sensor 1 bar High sensitivity 325201002 MS5201-BN Pressure sensor 1 bar High linearity 325201000 SMD hybrid with solder bumps, metal cap with nickel finish, drop of gel on sensor, no gel protection of the bonding wires MS5212-BM transparent gel MS5212-BM white gel Pressure sensor 12 bar High linearity 325212001 325212002 SMD hybrid with solder bumps, Stainless steel cap, Gel protection of sensor and bonding wires Comment Same sensor for both articles, Only the gel protection changes FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 BEVAIX SWITZERLAND Tel. 032 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. DA52XXYZ_012 000052xx223 ECN0828 December 19, 2005 8