KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES A. HE83138 Introduction HE83138 is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. This IC provides 512 pixels LCD display and built-in OP comparator can be used with light, voice, temperature and humility sensor or used to detect the battery low. The 7-bit current-type D/A converter and PWM drive output provide the complete speech output mechanism. The 48K bytes ROM size can be used to store 15 seconds speech data. It can be applicable to the LCD game, medium level educational toy, lower second voice recording system or used with external command mode SRAM or Flash RAM for higher second voice recording etc. The instruction sets of HE80000 series are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The performance of HE83750S is enough for most of battery operation system. B. HE83138 Features z z z z Operation Voltage: System Clock Clock Source: Dual Clock System： z z z z z z z z z z z z z z z z Operation Mode： Internal ROM: Internal RAM: Watch dog timer. 16 Bi-directional I/O ports. 512 pixels LCD driver with A, B type choice LCD Bias : 1/5 LCD Charge Pump: 1 or 1.5 times of VDD One 7-bits current-type DAC output. One built-in OP comparator. PWM device. Built-in DTMF Generator. Speech recognition function Two external interrupts and three internal timer interrupts. Two 16-bit timers. Instruction set： 32 instructions, 4 addressing mode. 10-bit DATA POINTER for RAM and 16-bit TABLE POINTER for ROM. 2.4V ~ 5.5V 4MHz ~ 8MHz Internal/External Fast clock, Internal/External slow clock Normal (Fast) clock 32.768KHz ~ 8MHz Slow clock 32.768 KHz DUAL、FAST、SLOW、IDLE、SLEEP Mode. 48K Bytes. 1K Bytes. 1 V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES C. Pin Description Pin # Pin name 78 77 FXI, FXO 81 80 SXI, SXO 76 RSTP_N 79 TSTP_P 91,92, 93,1 NC 83:90 PRTD[7:0] I/O Function Description External fast clock input/output Mask Option setting: B, pins are used to connect crystal or MO_FCK/SCKN= 00 : Slow Clock only O RC to generate the 32.768KHz ~ 01 : Illegal 8MHz system clock. 10：Dual Clock 11：Fast Clock only MO_FOSCE= 0：Internal fast clock 1：External fast clock External slow clock input/output MO_FXTAL= 0：R,C OSC. for Fast Clock pins used to connect the 1：Crystal OSC. for Fast Clock I, 32.768KHz crystal to generate MO_SXTAL= 0：R,C OSC. for 32.768K Clock O slow clock for system operation 1：Crystal OSC. for 32.768K Clock。 (slow mode), LCD display or Use OP1 and OP2 to switch among different timer 1 clock source. operation mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Active low and level trigger reset signal. User can also set the mask option MO_PORE=1 to enable the build-in Power-on reset circuit besides using the reset pin. I System reset signal Watch Dog Timer can also be enabled/disabled by the mask option, MO_WDTE = 0：Disable Watch Dog Timer = 1：Enable Watch Dog Timer I Please bond this pin to ground by a 0 ohm resistor to let it accessible when it’s necessary for some testing. IC Test Pin No Connection Pin Bi-directional I/O port D. PRTD B [7:2] also used as wake-up pin, and PRTD [7:6] also used as external interrupt pin. 12..19 PRT17[7:0] B Bi-directional I/O port 17 11..4 COM[15:0] O LCD COM Output 52..59 20..51 SEG[31:0] LCD Data filled from 80H; please refer the LCD RAM map. When LV3=VDD, the charge pump for LCD is turn off. The capacitor between LC1 and LC2 shall be removed to reduce power consumption. O LCD SEG Output 61 60 LC2 LC1 B Charge Pump Switch 1 B Charge Pump Switch 2 63 62 LV3 LV1 B Charge Pump V3 B Charge Pump V1 Mask options setting: MO_DPP [7:0] = 1：Push-pull output. = 0：Open-drain output. Output must be “1” before reading whenever uses them as input (Non tri-state structure). Mask options setting: MO_17PP [7:0] = 1：Push-pull output. = 0：Open-drain output. Output must be “1” before reading whenever uses them as input (Non tri-state structure). LCD common/segment driving pins. Refer to application circuit. 2 V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 Pin # Pin name 64..68 69 LR[4:0] LVG 2 PWMP 3 PWMN 71 VO I/O Function HE83138 HE80000 SERIES Description B LCD Resister level 4 ~ 0 Refer to application circuit. I LCD Virtual Ground Refer to application circuit. The PWM positive output can O drive speaker or buzzer directly. Set the bit2(PWM=1) of VOC register and bit0 of The PWM positive output can PWMC register to turn on PWM O drive speaker or buzzer directly. O Set the bit0(OP=0) and bit1(DA=1) of VOC Voice output. 72 DAO O 73 74 75 82 70 OPIN OPIP OPO VDD GND I I O P P register to turn on VO Set the bit0(OP=1) and bit1(DA=1) of VOC register to turn on DAO DAC Output Built-in OP comparator. OPAMP negative input pin. OPAMP positive input pin. OPAMP output pin. Positive Power Input Power Ground Input Enable DAO to work with OP. Refer to application note for detailed operation. Adding a 0.1 µF capacitor as by-pass capacitor between VDD and GND. D. LCD RAM MAP Page 0 COM0 COM1 COM2 : : COM13 COM14 COM15 SEG [7:0] 80H 81H 82H : : 8DH 8EH 8FH SEG [15:8] 90H 91H 92H : : 9DH 9EH 9FH 3 SEG [23:16] A0H A1H A2H : : ADH AEH AFH SEG [31:24] B0H B1H B2H : : BDH BEH BFH V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES E. Pin Diagram N N N C C C P R T D [0] P R T D [1] P R T D [2] P R T D [3] P R T D [4] P R T D [5] P R T D [6] P R T V S S D D X X [7] D I O T S T P | P R S T O F F P O P X X | P I I O N O P O P I N D A O VO GND NC LVG PWMP LR0 PWMN LR1 COM[8] LR2 COM[9] LR3 COM[10] LR4 COM[11] LV3 LV1 COM[12] Die Size: 3100 µm * 3240 µm。 Substrate connect with GND。 COM[13] COM[14] LC2 LC1 COM[0] COM[15] COM[1] PRT17[7] COM[2] PRT17[6] COM[3] PRT17[5] COM[4] PRT17[4] COM[5] PRT17[3] COM[6] PRT17[2] COM[7] PRT17[1] SEG[0] PRT17[0] SEG[1] SEG[31] SEG[2] SEG[30] SEG[3] SEG[29] SEG[28] SEG[4] Product name SEG[5] SEG[27] S E G [2 6] S E G [2 5] S E G [2 4] S E G [2 3] S E G [2 2] S E G [2 1] S E G [2 0] S E G [1 9] S E G [1 8] S E G [1 7] 4 S E G [1 6] S E G [1 5] S E G [1 4] S E G [1 3] S E G [1 2] S E G [1 1] S E G [1 0] S E G [9] S E G [8] S E G [7] S E G [6] V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES F. Bonding Pad Location PIN PIN X Y PIN PIN X Y Number Name Coordinate Coordinate Number Name Coordinate Coordinate 1 NC X= -1475.80 Y= 1246.95 48 SEG[3] X= 1474.30 Y= -1236.15 2 PWMP X= -1475.80 Y= 1107.20 49 SEG[2] X= 1474.30 Y= -1120.65 3 PWMN X= -1475.80 Y= 943.85 50 SEG[1] X= 1474.30 Y= -1005.15 4 COM[8] X= -1475.80 Y= 804.75 51 SEG[0] X= 1474.30 Y= -889.65 5 COM[9] X= -1475.80 Y= 689.25 52 COM[7] X= 1474.30 Y= -774.15 6 COM[10] X= -1475.80 Y= 573.75 53 COM[6] X= 1474.30 Y= -658.65 7 COM[11] X= -1475.80 Y= 458.25 54 COM[5] X= 1474.30 Y= -543.15 8 COM[12] X= -1475.80 Y= 342.75 55 COM[4] X= 1474.30 Y= -427.65 9 COM[13] X= -1475.80 Y= 227.25 56 COM[3] X= 1474.30 Y= -312.15 10 COM[14] X= -1475.80 Y= 111.75 57 COM[2] X= 1474.30 Y= -196.65 11 COM[15] X= -1475.80 Y= -3.75 58 COM[1] X= 1474.30 Y= -81.15 12 PRT17[7] X= -1475.80 Y= -119.25 59 COM[0] X= 1474.30 Y= 34.35 13 PRT17[6] X= -1475.80 Y= -234.75 60 LC1 X= 1474.30 Y= 149.85 14 PRT17[5] X= -1475.80 Y= -350.25 61 LC2 X= 1474.30 Y= 265.35 15 PRT17[4] X= -1475.80 Y= -465.75 62 LV1 X= 1474.30 Y= 380.85 16 PRT17[3] X= -1475.80 Y= -581.25 63 LV3 X= 1474.30 Y= 496.35 17 PRT17[2] X= -1475.80 Y= -696.75 64 LR4 X= 1474.30 Y= 611.85 18 PRT17[1] X= -1475.80 Y= -812.25 65 LR3 X= 1474.30 Y= 727.35 19 PRT17[0] X= -1475.80 Y= -927.75 66 LR2 X= 1474.30 Y= 842.85 20 SEG[31] X= -1475.80 Y= -1043.25 67 LR1 X= 1474.30 Y= 958.35 21 SEG[30] X= -1475.80 Y= -1158.75 68 LR0 X= 1474.30 Y= 1073.85 22 SEG[29] X= -1475.80 Y= -1274.25 69 LVG X= 1474.30 Y= 1189.35 23 SEG[28] X= -1475.80 Y= -1389.75 70 GND X= 1474.30 Y= 1304.85 24 SEG[27] X= -1475.80 Y= -1505.25 71 VO X= 1474.30 Y= 1438.50 25 SEG[26] X= -1155.05 Y= -1541.50 72 DAO X= 1124.45 Y= 1539.10 26 SEG[25] X= -1039.55 Y= -1541.50 73 OPIN X= 990.80 Y= 1539.10 27 SEG[24] X= -924.05 Y= -1541.50 74 OPIP X= 875.30 Y= 1539.10 28 SEG[23] X= -808.55 Y= -1541.50 75 OPO X= 759.80 Y= 1539.10 29 SEG[22] X= -693.05 Y= -1541.50 76 RSTP_N X= 644.30 Y= 1539.10 30 SEG[21] X= -577.55 Y= -1541.50 77 FXO X= 528.80 Y= 1539.10 31 SEG[20] X= -462.05 Y= -1541.50 78 FXI X= 413.30 Y= 1539.10 32 SEG[19] X= -346.55 Y= -1541.50 79 TSTP_P X= 297.80 Y= 1539.10 33 SEG[18] X= -231.05 Y= -1541.50 80 SXO X= 182.30 Y= 1539.10 34 SEG[17] X= -115.55 Y= -1541.50 81 SXI X= 66.80 Y= 1539.10 35 SEG[16] X= -0.05 Y= -1541.50 82 VDD X= -48.70 Y= 1539.10 36 SEG[15] X= 115.45 Y= -1541.50 83 PRTD[7] X= -164.20 Y= 1539.10 37 SEG[14] X= 230.95 Y= -1541.50 84 PRTD[6] X= -279.70 Y= 1539.10 38 SEG[13] X= 346.45 Y= -1541.50 85 PRTD[5] X= -395.20 Y= 1539.10 39 SEG[12] X= 461.95 Y= -1541.50 86 PRTD[4] X= -510.70 Y= 1539.10 40 SEG[11] X= 577.45 Y= -1541.50 87 PRTD[3] X= -626.20 Y= 1539.10 41 SEG[10] X= 692.95 Y= -1541.50 88 PRTD[2] X= -741.70 Y= 1539.10 42 SEG[9] X= 808.45 Y= -1541.50 89 PRTD[1] X= -857.20 Y= 1539.10 43 SEG[8] X= 923.95 Y= -1541.50 90 PRTD[0] X= -972.70 Y= 1539.10 5 V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 PIN PIN Number Name 44 SEG[7] 45 SEG[6] 46 SEG[5] 47 SEG[4] HE83138 HE80000 SERIES X Y PIN PIN X Y Coordinate Coordinate Number Name Coordinate Coordinate X= 1039.45 Y= -1541.50 91 NC X= -1088.20 Y= 1539.10 X= 1154.95 Y= -1541.50 92 NC X= -1203.70 Y= 1539.10 X= 1474.30 Y= -1467.15 93 NC X= -1319.20 Y= 1539.10 X= 1474.30 Y= -1351.65 G. DC/AC Characteristics Absolute Maximum Rating Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C Condition Recommended Operating Conditions Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature Sym. Rating Vdd 2.4V ~ 5.5V Vih 0.9 Vdd ~ Vdd 0.0V ~ 0.1Vdd Vil Fmax 8MHz 4MHz 0 Top 0 C ~ 700C Tst -500C ~ 1000C 6 Condition Vdd =5.0V Vdd =2.4V V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES Testing condition : TEMP=25℃, VDD=3V+/-10%, GND=0V PARAMETER CONDITION MIN TYP MAX UNIT NORMAL Mode Current System 2M ext. R/C 0.75 1 mA IFast 32.768K X’tal System µA ISlow SLOW Mode Current 10 20 LCD Disable 32.769K X’tal IDLE Mode Current System µA IIdle 6 10 LCD Disable LCD Enable, LCD option=300Kohm 12 20 Extra Current if LCD Voltage-doubler OFF µA System ILCD ON LCD Enable, LCD option=30Kohm, 100 120 Voltage-doubler ON Sleep Mode Current System 1 µA ISleep *2 12 15 mA IoHPWM PWM Output Drive Current PWMP, PWMN VDD=3V; Voh=2V *2 33 40 mA IoLPWM PWM Output Sink Current PWMP, PWMN VDD=3V; VoL=1V mA VO, DAO VDD=3V;VO=0~2V,Data=7F 2.5 3 IoVO DAC Output Current 0.8 V Input High Voltage I/O pins ViH VDD 0.2 Input Low Voltage I/O pins V ViL VDD Threshold=2/3VDD(input from low to high) 1/3 Vhys Input Hysteresis Width I/O, RSTP_N V Threshold=1/3VDD(input VDD from high to low) *1 Output Drive Current I/O pull-high VoL=2.0V 50 µA IoH I/O pull-low*1 VoL=0.4V 1.0 mA IoL_1 Output Sink Current ViL=GND, pull high RSTP_N 20 µA IiL_1 Input Low Current Internally ViL=GND, if pull high I/O 100 µA IiL_2 Input Low Current Internally by user Note: *1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, so user just multiply the number of driver he used to one driver current to get the total amount of current. ( IoHPWM、IoLPWM * N; N=0,1,2,3,4,5) 7 V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES H. Application Circuit Twice Charge Pump is selected LCD Max. Voltage=LV3=3/2*VDD 0.1uF C6 Twice Charge Pump is selected LCD Max. Voltage=LV3=VDD LC1 VDD LC2 LV3 LV1 Floating LC1 C7 0.1uF LV1 C9 0.1uF LV3 No Capacitor LC2 No External Parts is necessary if user adopt Internal Fast RC Clock External Fast Clock: Crystal osc. VDD VDD 3V C1 C2 0.1uF 100uF FXO RSTP_N C3 SW1 0.1uF RESET SXO LV1 FXI 20P FXO SXI FXO 2MHZ 20P SXO External Fast Clock: RC osc. PRT17[7:0] LC1 COM[15:0] LC2 FXI PRTD[7:0] GND LC1 SXI VDD LCD PANEL SEG[31:0] LC2 R > 8.2 KOhm LV1 FXI C: Please Ref. AN016 LV3 1/5 BAIS CONFIGURATION C1 0.1uF LV3 < 9 Volt C2 0.1uF LR4 C3 0.1uF LR3 C4 0.1uF LR2 C5 0.1uF LR1 OPIN OPIP OPO DAO PWMP PWMN LR0 VO LVG ?K Ohm VR1 TSTP_P BATTERY1 FXI R1 50K External Slow Clock: Crystal osc. Buzzer or Speaker Circuit SXI VDD Passive Bias & Q1 NPN Filter Circuit Please Refer AN022 for Speech Output Circuit 20P 32.768K SP1 SXO 20P SPEAKER External Slow Clock: RC osc. SXI R: Please ref. AN016 SXO 8 V1.0 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83138 HE80000 SERIES I. Important Note 1. Please always take in mind that ICE is different from IC which is your target body. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that your target IC didn't have these resources, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resources that don’t exist in your target IC. Please check the following table and refer to the abbreviation in HE80000 user's manual. I.F.C. E.S.C. I.P.R PROM DROM TP TP+1 RAM PP DP ◎ ◎ ◎ 48KB — 16-bit ◎ 1KB 2-bit 8-bit VO DAO OP PWM LCD COM*SEG Bias Rgr ChrgPmp ◎ ◎ ◎ ◎ 512 16*32 1/5 — 1,3/2 I/O DTMF WDT Timer 16 — ◎ T1,T2 LV2 LR LVG REC S.R. — 4:0 ◎ Ext. I 2. LCD driving circuit must be turn off before IC goes into sleep mode. 3. Please bonds the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and probed) as you can, then some testing can be performed on PCB if necessary. The TSTP_P is suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing point with through hole). 4. J. Updated Record Version Date Section Original Content 9 New Content V1.0