KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83149 HE80000 SERIES A. HE83149 Introduction HE83149 is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. Users can choose any one of combination among 【1024 dots LCD Driver + 8 Bit I/O Port】…【768 dots LCD Driver + 24 Bit I/O Port】etc. The 7-bit current-type D/A converter and PWM device provide the complete speech output mechanism. The 256K bytes ROM size can be used in the storage of speech、graphic、text etc.. It can be applicable to the medium systems such as Small-Scale Dictionary, Data Bank, Pocket Dialer, and Educational Toy etc. The instruction sets of HE80000 series are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The performance of HE83750S is enough for most of battery operation system. B. HE83149 Feature z z z z z Operation Voltage: System Clock: Clock Source: Internal ROM: Internal RAM： 2.4V – 5.5V 4MHz ~ 8MHz Internal/External Fast clock, Internal/External slow clock 256K Bytes(64K Program ROM+192K Data ROM) 512 Bytes z Dual Clock System: z Operation Mode: Normal (Fast) clock: 32.768K ~ 8MHz Slow clock: 32.768 KHz DUAL、FAST、SLOW、IDLE、SLEEP Mode. z z 8~24 bit Bi-directional I/O port. Mask Option can select PUSH-PULL or OPEN DRAIN output mode for each I/O pin. 8 of them are shared with LCD segment pins. 1024~768 dots LCD driver (A、B TYPE selectable). z z z z z One 7-bit current-type DAC output. PWM device. Two external interrupts and three internal timer interrupts. Two 16-bit timers and one Time-Base timer. Instruction set： 32 instructions, 4 addressing mode. 9-bit DATA POINTER for RAM and 18-bit TABLE POINTER for ROM. 1 V1.0E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83149 HE80000 SERIES C. Pin Description Pin # 92 91 Pin name FXI, FXO 95 94 SXI, SXO I/O Description Mask Option setting: External fast clock MO_FCK/SCKN= 00 : Slow Clock only input/output pins are used B, to connect crystal or RC to 01 : Illegal O generate the 32.768KHz ~ 10：Dual Clock 8MHz system clock. 11：Fast Clock only MO_FOSCE= 0：Internal fast clock 1：External fast clock External slow clock MO_FXTAL= 0：R,C OSC. for Fast Clock input/output pins used to 1：Crystal OSC. for Fast Clock connect the 32.768KHz MO_SXTAL= 0：R,C OSC. for 32.768K Clock crystal to generate slow 1：Crystal OSC. for 32.768K Clock. clock for system operation I, (slow mode), LCD display Use OP1 and OP2 to switch among different operation O or timer 1 clock source. mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Active low and level trigger reset signal. User can also set the mask option MO_PORE=1 to enable the build-in Power-on reset circuit besides using the reset pin. 90 93 Function System reset signal RSTP_N I TSTP_P I Watch Dog Timer can also be enabled/disabled by the mask option, MO_WDTE = 0：Disable Watch Dog Timer = 1：Enable Watch Dog Timer Please bond this pin to ground by a 0 ohm resistor to let it accessible when it’s necessary for some testing. IC Test Pin Mask options setting: MO_DPP [7:0] = 1：Push-pull output. 97.. PRTD[7:0] = 0：Open-drain output. 104 B Output must be “1” before reading whenever uses them as input (Non tri-state structure). The pin functions are determined by the mask option MO_LIO15[7:0] MO_LIO15 [7:0] = 1：LCD Pin. = 0：I/O Pin. 5.. PRT15[7:0]/ When they are selected as I/O pins, the output driving 8-pin bi-directional I/O port 12 SEG[63:56] type can be set by mask option. that is shared with LCD B/O MO_15PP [7:0] = 1：Push-pull. segment pin. = 0：Open-drain. Output must be “1” before reading whenever uses them as input (Non tri-state structure). The pin functions are determined by the mask option MO_LIO14[7:0] 13... PRT14[7:0]/ MO_LIO14 [7:0] = 1：LCD Pin. 20 SEG[55:48] 8-pin bi-directional I/O port B/O that is shared with LCD = 0：I/O Pin. Bi-directional I/O port D. PRTD [7:2] also used as wake-up pin, and PRTD [7:6] also used as external interrupt pin. 2 V1.0E HE83149 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 Pin # Pin name I/O Function Description segment pin. 4..1 110.. COM[15:0] 107 69..76 21.. 68 SEG[47:0] 78 LC2 77 LC1 81 L V3 80 L V2 79 L V1 82..86 LR[4..0] 87 L VG 105 PWMP O O B B B B B B I O LCD Data filled from F0H, please refer the LCD RAM map. LCD SEG Output Charge Pump Switch 1 Charge Pump Switch 2 Charge Pump V3 Charge Pump V2 Charge Pump V1 LCD Resister level 4 ~ 1 LCD Virtual Ground The PWM positive output can drive speaker or buzzer directly. The PWM positive output can drive speaker or buzzer directly. PWMN 89 VO O Voice output. 96 88 VDD GND P P Positive Power Input Power Ground Input O When they are selected as I/O pins, the output driving type can be set by mask option. MO_14PP [7:0] = 1：Push-pull. = 0：Open-drain. Output must be “1” before reading whenever uses them as input (Non tri-state structure). LCD COM Output 106 HE80000 SERIES Add one 0.1 µF capacitor between LC1 and LC2. Please refer the application circuit. LV3< 9 Volts. Please refer the application circuit. Please refer the application circuit. Please refer the application circuit. Set the bit2(PWM=1) of VOC register and bit0 of PWMC register to turn on PWM Set the bit0(OP=0) and bit1(DA=1) of VOC register to turn on VO Add a 0.1 µF capacitor as by-pass capacitor between VDD and GND. D. LCD RAM Map Page 0 COM0 COM1 COM2 : : COM13 COM14 COM15 SEG [7:0] 80H 81H 82H : : 8DH 8EH 8FH SEG [15:8] 90H 91H 92H : : 9DH 9EH 9FH SEG [23:16] A0H A1H A2H : : ADH AEH AFH SEG [31:24] B0H B1H B2H : : BDH BEH BFH 3 SEG [39:32] C0H C1H C2H : : CDH CEH CFH SEG [47:40] D0H D1H D2H : : DDH DEH DFH SEG [55:48] E0H E1H E2H : : EDH EEH EFH SEG [63:56] F0H F1H F2H : : FDH FEH FFH V1.0E HE83149 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE80000 SERIES E. Pin Diagram C O M [11] C O M [10] C C O O M M [9] [8] P W M N P W M P P P P P P P P P R R R R R R R R T T T T T T T T D D D D D D D D [0] [1] [2] [3] [4] [5] [6] [7] V D D S X I S X O T S T P | P F X I F X O R S T P | N V O G N D L V G L R 0 L R 1 L R 2 L R 3 COM[12] LR4 COM[13] LV3 COM[14] LV2 COM[15] LV1 PRT15[7] LC2 PRT15[6] LC1 PRT15[5] COM[0] PRT15[4] COM[1] PRT15[3] COM[2] PRT15[2] COM[3] PRT15[1] COM[4] PRT15[0] PRT14[7] PRT14[6] PRT14[5] COM[5] Die Size: 3460 µm * 3650 µm。 Substrate connect with GND。 COM[6] COM[7] SEG[0] PRT14[4] SEG[1] PRT14[3] SEG[2] PRT14[2] SEG[3] PRT14[1] SEG[4] PRT14[0] SEG[5] SEG[47] SEG[6] SEG[46] SEG[7] SEG[45] SEG[8] SEG[44] SEG[9] SEG[43] SEG[10] SEG[42] Product name SEG[41] SEG[11] SEG[12] S S S S S S S S S S S S S S S S S S S S S S S S S S S S E E E E E E E E E E E E E E E E E E E E E E E E E E E E G G G G G G G G G G G G G G G G G G G G G G G G G G G G [40] [39] [38] [37] [36] [35] [34] [33] [32] [31] [30] [29] [28] [27] [26] [25] [24] [23] [22] [21] [20] [19] [18] [17] [16] [15] [14] [13] 4 V1.0E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83149 HE80000 SERIES F. Bonding Pad Location PIN Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 PIN Name COM[12] COM[13] COM[14] COM[15] PRT15[7] PRT15[6] PRT15[5] PRT15[4] PRT15[3] PRT15[2] PRT15[1] PRT15[0] PRT14[7] PRT14[6] PRT14[5] PRT14[4] PRT14[3] PRT14[2] PRT14[1] PRT14[0] SEG[47] SEG[46] SEG[45] SEG[44] SEG[43] SEG[42] SEG[41] SEG[40] SEG[39] SEG[38] SEG[37] SEG[36] SEG[35] SEG[34] SEG[33] SEG[32] SEG[31] X Coordinate X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1657.05 X= -1559.10 X= -1443.60 X= -1328.10 X= -1212.60 X= -1097.10 X= -981.60 X= -866.10 X= -750.60 X= -635.10 X= -519.60 Y PIN Coordinate Number Y= 1500.75 Y= 1385.25 Y= 1269.75 Y= 1154.25 Y= 1038.75 Y= 923.25 Y= 807.75 Y= 692.25 Y= 576.75 Y= 461.25 Y= 345.75 Y= 230.25 Y= 114.75 Y= -0.75 Y= -116.25 Y= -231.75 Y= -347.25 Y= -462.75 Y= -578.25 Y= -693.75 Y= -809.25 Y= -924.75 Y= -1040.25 Y= -1155.75 Y= -1271.25 Y= -1386.75 Y= -1502.25 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 5 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 PIN Name SEG[12] SEG[11] SEG[10] SEG[9] SEG[8] SEG[7] SEG[6] SEG[5] SEG[4] SEG[3] SEG[2] SEG[1] SEG[0] COM[7] COM[6] COM[5] COM[4] COM[3] COM[2] COM[1] COM[0] LC1 LC2 LV1 LV2 LV3 LR4 LR3 LR2 LR1 LR0 LVG GND VO RSTP_N FXO FXI X Coordinate X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1656.70 1599.95 1484.45 1368.95 1253.45 1137.95 1022.45 906.95 791.45 675.95 560.45 Y Coordinate Y= -1502.25 Y= -1386.75 Y= -1271.25 Y= -1155.75 Y= -1040.25 Y= -924.75 Y= -809.25 Y= -693.75 Y= -578.25 Y= -462.75 Y= -347.25 Y= -231.75 Y= -116.25 Y= -0.75 Y= 114.75 Y= 230.25 Y= 345.75 Y= 461.25 Y= 576.75 Y= 692.25 Y= 807.75 Y= 923.25 Y= 1038.75 Y= 1154.25 Y= 1269.75 Y= 1385.25 Y= 1500.75 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 Y= 1797.10 V1.0E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 SEG[30] SEG[29] SEG[28] SEG[27] SEG[26] SEG[25] SEG[24] SEG[23] SEG[22] SEG[21] SEG[20] SEG[19] SEG[18] SEG[17] SEG[16] SEG[15] SEG[14] SEG[13] X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= -404.10 -288.60 -173.10 -57.60 57.90 173.40 288.90 404.40 519.90 635.40 750.90 866.40 981.90 1097.40 1212.90 1328.40 1443.90 1559.40 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 Y= -1710.30 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 TSTP_P SXO SXI VDD PRTD[7] PRTD[6] PRTD[5] PRTD[4] PRTD[3] PRTD[2] PRTD[1] PRTD[0] PWMP PWMN COM[8] COM[9] COM[10] COM[11] HE83149 HE80000 SERIES X= 444.95 X= 329.45 X= 213.95 X= 98.45 X= -17.05 X= -132.55 X= -248.05 X= -363.55 X= -479.05 X= -594.55 X= -710.05 X= -825.55 X= -965.30 X= -1128.65 X= -1267.75 X= -1383.25 X= -1498.75 X= -1614.25 Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 1797.10 G. DC/AC Characteristics Absolute Maximum Rating Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C Condition Recommended Operating Conditions Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature Sym. Rating Vdd 2.2V ~ 5.5V Vih 0.9 Vdd ~ Vdd Vil 0.0V ~ 0.1Vdd Fmax 8MHz 4MHz Top 00C ~ 700C Tst -500C ~ 1000C 6 Condition Vdd =5.0V Vdd =2.2V V1.0E HE83149 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE80000 SERIES Testing Condition: TEMP=25℃, VDD=3V+/-10%, GND=0V P ARAMETER CONDITION IFast ISlow NORMAL Mode Current SLOW Mode Current System System IIdle IDLE Mode Current System ILCD Extra Current if LCD ON System ISleep IoHPWM IoLPWM IoVO ViH Sleep Mode Current PWM Output Drive Current PWM Output Sink Current DAC Output Current Input High Voltage System PWMP, PWMN*2 PWMP, PWMN*2 VO I/O pins ViL Input Low Voltage I/O pins Vhys Input Hysteresis Width I/O, RSTP_N IoH IoL_1 IiL_1 Output Drive Current Output Sink Current Input Low Current I/O pull-high*1 I/O pull-low*1 RSTP_N IiL_2 Input Low Current I/O Note: MIN TYP MAX UNIT 2M ext. R/C 32.768K X’tal LCD Disable 32.769K X’tal LCD Disable LCD Enable, LCD option=300Kohm Voltage-doubler OFF LCD Enable, LCD option=30Kohm, Voltage-doubler ON VDD=3V; Voh=2V VDD=3V; VoL=1V VDD=3V;VO=0~2V,Data=7F 0.75 10 1 20 mA µA 6 10 µA 12 20 µA 100 12 33 2.5 0.8 VDD Threshold=2/3VDD(input from low to high) Threshold=1/3VDD(input from high to low) VoL=2.0V 50 VoL=0.4V 1.0 ViL=GND, pull high Internally ViL=GND, if pull high Internally by user 120 1 µA mA mA mA V 0.2 VDD V 15 40 3 1/3 VDD V 20 µA mA µA 100 µA *1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, multiply the number of driver he used to one driver current to amount of current.( IoHPWM、IoLPWM * N; N=0,1,2,3,4,5) 7 so get user the just total V1.0E HE83149 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 H. Application Circuit Triple Charge Pump is selected LCD Max. Voltage=LV3=3*VDD Triple Charge Pump is selected LCD Max. Voltage=LV3=3/2*VDD VDD VDD LV2 C8 0.1uF LV2 C7 0.1uF LV1 C9 0.1uF LV3 C9 0.1uF LV3 C6 Triple Charge Pump is selected LCD Max. Voltage=LV3=VDD VDD LV1 0.1uF LC1 0.1uF C6 LC2 LV3 Floating LV1 Floating LV2 LC1 LC1 LC2 No Capacitor LC2 No External Parts is necessary if user adopt Internal Fast RC Clock External Fast Clock: Crystal osc. VDD VDD FXI R1 50K 3V C1 FXO C2 SXI 0.1uF 100uF RSTP_N C3 0.1uF SW1 SXO FXI FXO FXI 20P SXI 2MHZ SXO FXO 20P PRTD[7:0] RESET GND LC1 LC2 LV1 LV2 LV3 1/5 BAIS CONFIGURATION External Fast Clock: RC osc. LC1 LC2 COM[15:0] LV1 SEG[47:0] LV2 LV3 < 9 Volt C2 0.1uF LR4 C3 0.1uF LR3 C4 0.1uF LR2 C5 0.1uF LR1 R > 8.2 KOhm PWMP LVG FXI C: Please Ref . AN016 External Slow Clock: Crystal osc. PWMN LR0 VR1 LCD PANEL PRT14[7:0]/SEG[55:48] C1 0.1uF ?K Ohm VDD PRT15[7:0]/SEG[63:56] VO TSTP_P BATTERY1 HE80000 SERIES Buzzer or Speaker Circuit 20P SXI VDD Passive Bias & Q1 NPN Filter Circuit Please Refer AN022 for Speech Output Circuit 32.768K SP1 SXO 20P SPEAKER External Slow Clock: RC osc. SXI R: Please ref . AN016 HE83148 SXO 8 V1.0E HE83149 KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE80000 SERIES I. Important Note 1. Please always take in mind that ICE is different from IC which is your target body. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that your target IC didn't have these resources, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resources that don’t exist in your target IC. Please check the following table and refer to the abbreviation in HE80000 user's manual. I.F.C. E.S.C. I.P.R PROM DROM ◎ ◎ Timer T1,T2,TB ◎ 64KB TP TP+1 RAM 192KB 18-bit ◎ VO DAO OP PWM ◎ — — ◎ 512B PP DP I/O 3-bit 8-bit 8~24 DTMF WDT — ◎ LCD Type COM*SEG Bias 1024~768 I 16*64 1/5 2. To access any address larger than 64KB, users must update TPP first, TPH, and then TPL. Only follow this order, the pre-charge circuit of ROM will work correctly. 5us waiting is necessary before LDV instruction is executed since Data ROM is a low speed ROM. Users can not emulate this accessing process in ICE. So 5us delay should be added by firmware. 3. LCD driving circuit must be turn off before IC goes into sleep mode. 4. Please bonds the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and probed) as you can, then some testing can be performed on PCB if necessary. The TSTP_P is suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing point with through hole). 5. 6. LV3 must be lower than 9.0 Volt. Otherwise IC may be breakdown. J. Updated Record Version Date Section Original Content 9 New Content V1.0E