5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP Part Number: AAAF5051-02 PRELIMINARY SPEC Blue Reddish-Orange Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z CHIPS CAN BE CONTROLLED SEPARATELY. The Blue source color devices are made with InGaAlN Verti- z SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER cal Light Emitting Diode. This devices are made with AlGaInP. PROCESS. z AVAILABLE ON TAPE AND REEL. The Green source color devices are made with InGaAlN z WHITE SMD PACKAGE, SILICONE RESIN. Vertical Light Emitting Diode. z PACKAGE: 500PCS / REEL. Static electricity and surge damage the LEDS. z MOISTURE SENSITIVITY LEVEL : LEVEL 3. It is recommended to use a wrist band or anti-electrostatic z RoHS COMPLIANT. glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.15[±0.006]unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 1 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 2 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Selection Guide Part No. Dice Φv (mlm) [2] @ 120mA Min. Typ. Min. Typ. 1200 1450 5000 6300 2500 3100 8000 9000 3800 4900 12500 17000 Lens Type Blue (InGaAlN) AAAF5051-02 Iv (mcd) [2] @ 120mA WATER CLEAR Reddish-Orange (AlGaInP) Green (InGaAlN) Viewing Angle [1] 2θ1/2 120° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity/ luminous Flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Parameter Power dissipation Junction temperature Symbol Pt TJ Device Value Blue 0.432 Reddish-Orange 0.336 Green 0.444 Blue 110 Reddish-Orange 110 Green 110 Unit W °C Blue Operating Temperature Top Reddish-Orange -40 To +85 °C -40 To +85 °C Green Blue Storage Temperature Tstg Reddish-Orange Green DC Forward Current [1] Peak Forward Current [2] Thermal resistance IF IFM Rth j-a Blue 120 Reddish-Orange 120 Green 120 Blue 300 Reddish-Orange 300 Green 300 Blue 220 Reddish-Orange 270 Green 200 mA mA °C/W Blue Electrostatic Discharge Threshold (HBM) Reddish-Orange 8000 V Green Notes: 1. Results from mounting on PC board FR4(pad size ≥ 100mm 2 ),mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 3 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Electrical / Optical Characteristics at TA=25°C Value Parameter Symbol Device Unit Min. Wavelength at peak emission IF=120mA Dominant Wavelength IF=120mA Spectral Line Half-width IF=120mA Forward Voltage IF=120mA Temperature coefficient of λ peak IF=120mA, -10 ° C≤ T≤100 ° C Temperature coefficient of λ dom IF=120mA, -10 ° C≤ T≤100 ° C Temperature coefficient of VF IF=120mA, -10 ° C≤ T≤100 ° C λ peak λ dom [1] Δλ1/2 VF [2] TC λ peak TC λ dom TCV Typ. Blue 450 Reddish-Orange 633 Green 515 Blue 457 Reddish-Orange 624 Green 525 Blue 20 Reddish-Orange 30 Green 30 Max. nm nm nm Blue 2.6 3.1 3.6 Reddish-Orange 1.8 2.3 2.8 Green 2.6 3.2 3.7 Blue 0.12 Reddish-Orange 0.09 Green 0.13 Blue 0.1 Reddish-Orange 0.03 Green 0.11 Blue -2.3 Reddish-Orange -2.7 Green -3.9 V nm/ ° C nm/ ° C mV/ ° C Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 4 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 AAAF5051-02 Blue SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 5 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Reddish-Orange SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 6 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Green SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 7 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 AAAF5051-02 Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm) SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 8 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 PACKING & LABEL SPECIFICATIONS AAAF5051-02 SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 9 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347