3.2x1.6mm SMD CHIP LED LAMP APC3216EC HIGH EFFICIENCY RED Features Description !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The High Efficiency Red source color devices are made !LOW POWER CONSUMPTION. with Gallium Arsenide Phosphide on Gallium Phosphide !WIDE VIEWING ANGLE. Orange Light Emitting Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APC3216EC Iv (m c d ) @ 20 m A L en s Ty p e HIGH EFFICIENCY RED(GaAsP/GaP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 4 12 12 0 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er λpeak Peak Wavelength High Efficiency Red λD Dominate Wavelength High Efficiency Red ∆λ1/2 D ev i c e Spectral Line Half-width High Efficiency Red Ty p . Un it s Tes t Co n d it io n s 6 27 nm I F =20mA 6 25 nm I F =20mA 45 nm I F =20mA pF V F=0V;f =1MHz 2.5 V I F =20mA 10 uA V R = 5V C Capacitance High Efficiency Red 15 VF Forward Voltage High Efficiency Red 2.0 IR Reverse Current High Efficiency Red Max . Absolute Maximum Ratings at T)=25°°C P ar am e t e r H i g h E f f i c i e n c y R ed Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 160 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 High Efficiency Red SPEC NO: DSAD0995 APPROVED : J. Lu APC3216EC REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APC3216EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4