SOT-23 SURFACE MOUNT LED LAMP KM-23ID-F HIGH EFFICIENCY RED Features Description ! SOT-23 The High Efficiency Red source color devices !LOW PACKAGE SURFACE MOUNT LED LAMP. POWER CONSUMPTION. ! LONG LIFE - SOLID STATE RELIABILITY. !PACKAGE are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: DSAA4561 APPROVED : J. Lu REV NO: V.4 CHECKED :Allen Liu DATE:DEC/16/2002 DRAWN:Y.H.LI PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e KM-23ID-F Iv (m c d ) @ 20 m A L en s Ty p e HIGH EFFICIENCY RED (GaAsP/GaP) RED DIFFUSED V i ew i n g An g l e Min . Ty p . 2θ1/2 4 15 140° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er λpeak Peak Wavelength High Efficiency Red λD Dominate Wavelength High Efficiency Red ∆λ1/2 D ev i c e Spectral Line Half-width High Efficiency Red Ty p . Un its Tes t Co n d it io n s 627 nm I F =20mA 625 nm I F =20mA 45 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C Capacitance High Efficiency Red 15 VF Forward Voltage High Efficiency Red 2.0 IR Reverse Current High Efficiency Red Max . Absolute Maximum Ratings at TA=25°°C P ar am et er H i g h E f f i c i en c y R ed Un its Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 160 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAA4561 APPROVED : J. Lu REV NO: V.4 CHECKED :Allen Liu DATE:DEC/16/2002 DRAWN:Y.H.LI PAGE: 2 OF 4 High Efficiency Red SPEC NO: DSAA4561 APPROVED : J. Lu KM-23ID-F REV NO: V.4 CHECKED :Allen Liu DATE:DEC/16/2002 DRAWN:Y.H.LI PAGE: 3 OF 4 KM-23ID-F SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAA4561 APPROVED : J. Lu REV NO: V.4 CHECKED :Allen Liu DATE:DEC/16/2002 DRAWN:Y.H.LI PAGE: 4 OF 4