KODENSHI KK74HC30AD

TECHNICAL DATA
KK74HC30A
8-Input NAND Gate
The KK74HC30A is high-speed Si-gate CMOS device and is
compatible with low power Schottky TTL (LSTTL) . The device provide
the 8-input NAND function.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
KK74HC30AN
Plastic
KK74HC30AD
SOIC
TA = -55° ÷ 125° C for all packages
LOGIC DIAGRAM
A
PIN ASSIGNMENT
B
A
1
14
V CC
B
2
13
-
C
3
12
H
D
4
11
G
E
5
10
-.
F
F
6
9
-
G
GND
7
8
Y
C
D
Y
E
H
FUNCTION TABLE
PIN 14 =VCC
PIN 7 = GND
Inputs
Output
A
B
С
D
E
F
G
H
Y
L
X
X
X
X
X
X
X
H
X
L
X
X
X
X
X
X
H
X
X
L
X
X
X
X
X
H
X
X
X
L
X
X
X
X
H
X
X
X
X
L
X
X
X
H
X
X
X
X
X
L
X
X
H
X
X
X
X
X
X
L
X
H
X
X
X
X
X
X
X
L
H
H
H
H
H
H
H
H
H
L
X = don’t care
1
KK74HC30A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air, Plastic DIP**
SOIC Package**
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
Tstg
TL
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
**Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
2
KK74HC30A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Test Conditions
VCC
Guaranteed Limit
V
25 °C
to
-55°C
≤85
°C
≤125
°C
Unit
VIH
Minimum High-Level
Input Voltage
VOUT≤0.1V or
VOUT ≥VCC-0.1V
⎢IOUT⎢≤ 20 µA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low -Level
Input Voltage
VOUT≤0.1V or
VOUT ≥VCC-0.1V
⎢IOUT⎢≤ 20 µA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH
Minimum High-Level
Output Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ - 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
VIN= VIH or VIL
⎢IOUT⎢ ≤ - 2.4 mA
3.0
2.48
2.34
2.20
VIN= VIH or VIL
⎢IOUT⎢ ≤ - 4.0 mA
4.5
3.98
3.84
3.70
VIN= VIH or VIL
⎢IOUT⎢ ≤ - 5.2 mA
6.0
5.48
5.34
5.20
VIN= VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
3.0
0.1
0.1
0.1
0.26
0.1
0.1
0.1
0.33
0.1
0.1
0.1
0.4
4.5
0.26
0.33
0.4
6.0
0.26
0.33
0.4
6.0
-0.1
-1.0
-1.0
µA
VOL
Maximum Low-Level
Output Voltage
VIN= VIH or VIL
⎢IOUT⎢ ≤ 2.4 mA
VIN= VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
VIN= VIH or VIL
⎢IOUT⎢ ≤ 5.2 mA
VIN= 0 V
V
IIL
Maximum Low-Level
Input Leakage Current
IIH
Maximum High-Level
Input Leakage Current
VIN= VCC
6.0
0.1
1.0
1.0
µA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN=VCC or 0 V
IOUT=0 µA
6.0
2.0
20
40
µA
3
KK74HC30A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
VCC
Symbol
Parameter
Guaranteed Limit
V
25 °C
to
-55°C
≤85°C
≤125°C
Unit
tPHL, tPLH
Maximum Propagation Delay (Figure 1)
2.0
4.5
6.0
175
35
30
220
44
37
265
53
45
ns
tTHL, tTLH
Maximum Output Transition Time
(Figure 1)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
Maximum Input Capacitance
5.0
10
10
10
pF
CIN
Power Dissipation Capacitance (Per Gate)
CPD
TA=25°C,VCC=5.0 V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
27
pF
tr
tf
V1
0.9
0.9
Input
V2
V2
0.1
GND
0.1
tPHL
tPLH
VCC
0.9
0.9
V2
Output
V2
0.1
0.1
0V
tTHL
tTLH
V1 = VCC
V2 = 0.5 VCC
Figure 1. Switching Waveforms
VCC
VI
VO
PULSE
GENERATOR
RT
Termination resistance RT – should
be equal to ZOUT of pulse generators
DEVICE
UNDER
TEST
CL
50 pF
Figure 2. Test Circuit
4
KK74HC30A
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
Dimension, mm
8
14
B
7
1
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
5.33
C
F
L
C
-T- SEATING
PLANE
N
G
M
K
J
H
D
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
A
14
8
H
B
1
G
P
7
R x 45
C
-TK
D
SEATING
PLANE
M
Symbol
MIN
MAX
A
8.55
8.75
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.27
J
0°
8°
K
0.1
0.25
1. Dimensions A and B do not include mold flash or protrusion.
M
0.19
0.25
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
P
5.8
6.2
R
0.25
0.5
J
0.25 (0.010) M T C M
NOTES:
F
5