LANSDALE MC1350P

ML1350
Monolithic IF Amplifier
Legacy Device: Motorola MC1350
The ML1350 is an integrated circuit featuring wide range
AGC for use as a linear IF amplifier in AM radio, shortwave,
TV and instrumentation.
• Power Gain:
•
•
•
•
•
•
50 dB Typ at 45 MHz
50 dB Typ at 58 MHz
AGC Range: 60 dB Min, DC to 45 MHz
Nearly Constant Input & Output Admittance over the
Entire AGC Range
Y21 Constant (–3.0 dB) to 90 MHz
Low Reverse Transfer Admittance: << 1.0 µmho Typical
12 V Operation, Single–Polarity Power Supply
Operating Temperature Range TA = 0° to +75° C
8
1
SO 8 = -5P
PLASTIC PACKAGE
CASE 751
(SO–8)
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.)
Symbol
Value
Unit
Power Supply Voltage
V+
+18
Vdc
Output Supply Voltage
V1, V8
+18
1
Vdc
Vdc
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
VAGC
V+
Differential Input Voltage
Vin
5.0
Vdc
Power Dissipation (Package Limitation)
Plastic Package
Derate above 25° C
PD
625
5.0
mW
mW/°C
Operating Temperature Range
TA
0 to +75
°C
AGC Supply Voltage
8
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
P DIP 8
MC1350P
ML1350PP
SO 8
MC1350D
ML1350-5P
Note: See ML1490 Similar Function
Rating
P DIP = PP
PLASTIC PACKAGE
CASE 626
Figure 1. Typical ML1350 Video IF Amplifier and MC1330 Low–Level Video Detector Circuit
0.002µF
470
220
0.1µF
0.002µF
+18Vdc
18V
Auxiliary Video
Output
10V
3.3k
68pF
0.001µF
4
3
2
22
1
7
6
5
Primary Video
and Sound Output
7.7V
4
T1
50
3.9k
MC1330AP
ML1350
6
7
8
12pF
8
3
33pF
2
1
AFT Output
0.002 µ F
5.0k
5
20pF
0
0.002 µ F
45MHz
Input
3.9k
L1
T1
AGC
5"
≈16
1"
5
6
Turns
Turns
4
All windings #30 AWG tinned nylon acetate
wire tuned with Carbonyl E or J slugs.
Page 1 of 6
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3"
16
10
Turns
3"
16
L1 wound with #26 AWG tinned nylon
acetate wire tuned by distorting winding.
Issue A
LANSDALE Semiconductor, Inc.
ML1350
ELECTRICAL CHARACTERISTICS (V+ = +12 Vdc, TA = +25°C, unless otherwise noted.)
Symbol
Characteristics
Min
Typ
Max
Unit
60
68
–
dB
–
46
–
–
48
50
58
62
–
–
–
–
–
–
20
8.0
–
–
AGC Range, 45 MHz (5.0 V to 7.0 V) (Figure 1)
Power Gain (Pin 5 grounded via a 5.1 kΩ resistor)
f = 58 MHz, BW = 4.5 MHz
See Figure 6(a)
f = 45 MHz, BW = 4.5 MHz
See Figure 6(a), (b)
f = 10.7 MHz, BW = 350 kHz
See Figure 7
f = 455 kHz, BW = 20 kHz
Ap
dB
Maximum Differential Voltage Swing
0 dB AGC
–30 dB AGC
VO
Output Stage Current (Pins 1 and 8)
I1 + I8
–
5.6
–
mA
Total Supply Current (Pins 1, 2 and 8)
IS
–
14
17
mAdc
Power Dissipation
PD
–
168
204
mW
Vpp
DESIGN PARAMETERS, Typical Values (V+ = +12 Vdc, TA = +25°C, unless otherwise noted.)
Frequency
Parameter
Symbol
455 kHz
10.7 MHz
45 MHz
58 MHz
Unit
g11
b11
0.31
0.022
0.36
0.50
0.39
2.30
0.5
2.75
mmho
Input Admittance Variations with AGC
(0 dB to 60 dB)
∆g11
∆b11
–
–
–
–
60
0
–
–
µmho
Differential Output Admittance
g22
b22
4.0
3.0
4.4
110
30
390
60
510
µmho
Output Admittance Variations with AGC
(0 dB to 60 dB)
∆g22
∆b22
–
–
–
–
4.0
90
–
–
µmho
Reverse Transfer Admittance (Magnitude)
|y12|
< < 1.0
< < 1.0
< < 1.0
< < 1.0
µmho
Forward Transfer Admittance
Magnitude
Angle (0 dB AGC)
Angle (–30 dB AGC)
|y21|
< y21
< y21
160
–5.0
–3.0
160
–20
–18
200
–80
–69
180
–105
–90
mmho
Degrees
Degrees
Single–Ended Input Capacitance
Cin
7.2
7.2
7.4
7.6
pF
Differential Output Capacitance
CO
1.2
1.2
1.3
1.6
pF
Single–Ended Input Admittance
Figure 2. Typical Gain Reduction
Figure 3. Noise Figure versus Gain Reduction
IAGC = 0.1 mA
20
40
60
(Figures 6 and 7)
80
4.0
Page 2 of 6
NOISE FIGURE (dB)
GAIN REDUCTION (dB)
0
IAGC = 0.2 mA
5.0
6.0
VAGC, SUPPLY VOLTAGE (V)
7.0
22
20
18
16
14
12
10
8.0
6.0
58 MHz
45 MHz
(Figure 6)
0
10
20
30
40
GAIN REDUCTION (dB)
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Issue A
LANSDALE Semiconductor, Inc.
ML1350
GENERAL OPERATING INFORMATION
The input amplifiers (Q1 and Q2) operate at constant emitter
currents so that input impedance remains independent of AGC
action. Input signals may be applied single–ended or differentially (for AC) with identical results. Terminals 4 and 6 may be
driven from a transformer, but a DC path from either terminal
to ground is not permitted.
Figure 4. Circuit Schematic
AGC Amplifier Section
V+
2
(+)
1.47k
AGC
Input 70
8
AGC action occurs as a result of an increasing voltage on the
base of Q4 and Q5 causing these transistors to conduct more
heavily thereby shunting signal current from the interstage
amplifiers Q3 and Q6. The output amplifiers are supplied from
an active current source to maintain constant quiescent bias
thereby holding output admittance nearly constant. Collector
voltage for the output amplifier must be supplied through a
center–tapped tuning coil to Pins 1 and 8. The 12 V supply
(V+) at Pin 2 may be used for this purpose, but output admittance remains more nearly constant if a separate 15 V supply
(V+ +) is used, because the base voltage on the output amplifier varies with AGC bias.
V++
Output
5
12.1
k
5.53k
470
470
Q3
Q4
Q5
Q6
Figure 5. Frequency Response Curve
(45 MHz and 58 MHz)
1(–)
2.0k
Q7
4 (–)
Q1
66
Q10
Q8 45
1.4k
Inputs
Q2
2.8k
6 (+)
Q9
200
200
2.8k
5.0k
5.0k
5.6k
1.1k
1.1k
1.9k
8.4k
200
Scale: 1.0 MHz/cm
7
Gnd
Input Amplifier Section
Bias Supplies
Output Amplifier Section
Figure 6. Power Gain, AGC and Noise Figure Test Circuits
(a) 45 MHz and 58 MHz
0.001µF
Input
RS = 50Ω
0.001µF
C2
L1
C1
LP
LP
1.5–20pF
0.001
µF
4
(b) Alternate 45 MHz
+12V
3
2
Input
0.68µH
.001
+12V
L1
LP
0.1
Output
T1 RL = 50Ω
1
RS = 50Ω
0.33µH
C1
4
3
2
1
RL = 50Ω
Output
ML1350
ML1350
5
6
7
8
5.1k
5.1k
5
6
7
5.1k
8
C2
VAGC
VAGC *
0.001µF
0.001
C3
0.001
0.001µF 0.001µF
*Connect to ground for maximum power gain test.
All power supply chokes (Lp), are self–resonant at input frequency. LP ≥ 20 kΩ.
See Figure 5 for Frequency Response Curve.
L1 @ 45 MHz = 7 1/4 Turns on a 1/4" coil form
L1 @ 58 MHz = 6 Turns on a 1/4" coil form
T1 Primary Winding = 18 Turns on a 1/4" coil form, center–tapped, #25 AWG
Secondary Winding = 2 Turns centered over Primary Winding @ 45 MHz
= 1 Turn @ 58 MHz
Slug = Carbonyl E or J
45 MHz
Page 3 of 6
L1
Ferrite Core
14 Turns 28 S.W.G.
C1
C2
C3
5–25 pF
5–25 pF
5–25 pF
58 MHz
L1
0.4 µH
Q ≥ 100
0.3 µH
Q ≥ 100
T1
1.3 µH to 3.4 µH
Q ≥ 100 @ 2.0 µH
1.2 µH to 3.8 µH
Q ≥ 100 @ 2.0 µH
C1
50 pF to 160 pF
8.0 pF to 60 pF
C2
8.0 pF to 60 pF
3.0 pF to 35 pF
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1350
Legacy Applications Information
Figure 7. Power Gain and AGC Test Circuit
(455 kHz and 10.7 MHz)
Frequency
L1
12 V
C2
C1
C3
4
3
2
1
5
6
C7
*Grounded for
maximum power gain.
C1
C2
C3
C4
C5
C8
C7
L1
T1
–
–
0.05 µF
0.05 µF
0.001 µF
0.05 µF
0.05 µF
–
Note 1
80–450 pF
5.0–80 pF
0.001 µF
0.05 µF
36 pF
0.05 µF
0.05 µF
4.6 µF
Note 2
Output
RS = 50Ω
7
8
C6
NOTES:
NOTES:
NOTES:
NOTES:
NOTES:
NOTES:
NOTES:
NOTES:
NOTES:
Figure 8. Single–Ended Input Admittance
5.0
500
4.0
400
b11
3.0
2.0
1.0
< Y21 (–30 dB gain)
300
–80
200
–120
Y21
20
30
40
50
f, FREQUENCY (MHz)
70
100
1.0
1.0
(Single–ended output
admittance exhibits
twice these values.)
b22
0.6
0.4
0.2
g22
0
10
3.0 5.0
10
20
f, FREQUENCY (MHz)
30
–200
100
50
8.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
0.8
2.0
Figure 11. Differential Output Voltage
Figure 10. Differential Output Admittance
g 22 , b 22 (mmho)
–160
0
10
0
–40
< Y21 (max gain)
100
g11
0
7.0
6.0
V + + = 14 V
5.0
4.0
V + + = 12 V
3.0
2.0
1.0
0
20
30
40
50
70
100
0
f, FREQUENCY (MHz)
Page 4 of 6
1. Primary: 120 µH (center–tapped)
1. Qu = 140 at 455 kHz
1. Primary: Secondary turns ratio ≈ 13
2. Primary: 6.0 µH
2. Primary winding = 24 turns #36 AWG
2. (close–wound on 1/4" dia. form)
2. Core = Carbonyl E or J
2. Secondary winding = 1–1/2 turns #36 AWG, 1/4" dia.
2. (wound over center–tap)
Figure 9. Forward Transfer Admittance
| Y 21 | (mmhos)
g11 ,b11 (mmhos)
10.7 MHz
T1
MC1350
5.1k
455 kHz
C4
C5
VAGC *
Component
< Y 21 (DEGREES)
Input
RS = 50Ω
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10
20
30
40
50
GAIN REDUCTION (dB)
60
70
80
Issue A
LANSDALE Semiconductor, Inc.
ML1350
Typical application of a AM
Modulator using ML1350
Figure 12.
V1
12V
+V
C4
.1uF
C1
220pF
vcc
rfout
4 3
2
1
rfin
R2
P1
50
V2
10V
+V
AGC
7
8
gnd
a gc
C7
1uF
6
rfout
5
R1
5.1k
T1
U2
ML1350
rfin
R3
10k 40%
gnd
RF input
L2
1uH
C5
47pF
C6
470pF
RF out
P3
C2
MOD input
P2
.1uF
C3
.1uF
Page 5 of 6
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Issue A
LANSDALE Semiconductor, Inc.
ML1350
OUTLINE DIMENSIONS
8
P DIP 8 = PP
(ML1350PP)
PLASTIC PACKAGE
CASE 626–05
ISSUE K
5
–B–
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
–A–
NOTE 2
L
C
J
–T–
N
SEATING
PLANE
D
M
K
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
0.030
0.040
G
H
0.13 (0.005)
M
T A
M
B
SO 8 = -5P
(ML1350-5P)
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE N
–A–
8
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5
–B–
1
4X
P
0.25 (0.010)
4
M
B
M
G
R
C
–T–
8X
K
D
0.25 (0.010)
M
T B
SEATING
PLANE
M
S
A
X 45°
F
J
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.18
0.25
0.10
0.25
INCHES
MIN
MAX
0.189
0.196
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.007
0.009
0.004
0.009
5.80
0.25
0.229
0.010
6.20
0.50
0.244
0.019
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 6 of 6
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Issue A