ML145050 ML145051 10-Bit A/D Converter with Serial Interface - CMOS Legacy Device: Motorola MC145050, MC145051 These ratio metric 10-bit ADCs have serial interface ports to provide communication with MCUs and MPUs. Either a 10- or 16-bit format can be used. The 16-bit format can be one continuous 16-bit stream or two intermittent 8-bit streams. The converters operate from a single power supply with no external trimming required. Reference voltages down to 4.0 V are accommodated. The ML145050 has the same pin out as the 8-bit ML145040 which allows an external clock (ADCLK) to operate the dynamic A/D conversion sequence. The ML145051 has the same pin out as the 8-bit ML145041 which has an internal clock oscillator and an end-of-conversion (EOC) output. • 11 Analog Input Channels with Internal Sample-and-Hold • Operating Temperature Range: – 40 to 125°C • Successive Approximation Conversion Time: ML145050 – 21 µs (with 2.1 MHz ADCLK) ML145051 – 44 µs Maximum • Maximum Sample Rate: ML145050 – 38 ks/s ML145051 – 20.4 ks/s • Analog Input Range with 5-Volt Supply: 0 to 5 V • Monotonic with No Missing Codes • Direct Interface to Motorola SPI and National MICROWIRE Serial Data Ports • Digital Inputs/Outputs are TTL, NMOS, and CMOS Compatible • Low Power Consumption: 14 mW • Chip Complexity: 1630 Elements (FETs, Capacitors, etc.) • See Application Note AN1062 for Operation with QSPI P DIP 20 = RP PLASTIC CASE 738 SO 20W = -6P SOG CASE 751D CROSS REFERENCE/ORDERING INFORMATION MOTOROLA LANSDALE PACKAGE P DIP 20 MC145050P ML145050RP SOG 20W MC145050DW ML145050-6P P DIP 20 MC145051P ML145051RP SOG 20W MC145051DW ML145051-6P Note: Lansdale lead free (Pb) product, as it becomes available, will be identified by a part number prefix change from ML to MLE. PIN ASSIGNMENT *ADCLK (ML145050); EOC (ML145051) AN0 1 20 VDD AN1 2 19 * AN2 3 18 SCLK AN3 4 17 Din AN4 5 16 Dout AN5 6 15 CS AN6 7 14 Vref AN7 8 13 VAG AN8 9 12 AN10 VSS 10 11 AN9 MICROWARE is A Trademark Of National Semiconductor Corp. Page 1 of 15 www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 BLOCK DIAGRAM AN0 1 AN1 2 AN2 3 AN3 4 Vref INTERNAL TEST VOLTAGES ANALOG MUX AN7 8 9 AN8 11 AN9 AN10 12 AN11 AN12 AN13 17 Din 16 Dout CS SCLK ADCLK (ML145050 ONLY) EOC (ML145051 ONLY) 14 13 10-BIT RC DAC WITH SAMPLE AND HOLD MUX OUT AN4 5 AN5 6 AN6 7 VAG SUCCESSIVE APPROXIMATION REGISTER MUX ADDRESS REGISTER DATA REGISTER AUTO-ZEROED COMPARATOR 15 18 19 PIN 20 = VDD PIN 10 = VSS DIGITAL CONTROL LOGIC 19 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VDD DC Supply Voltage (Referenced to VSS) – 0.5 to + 6.0 V Vref DC Reference Voltage VAG to VDD + 0.1 V VAG Analog Ground VSS – 0.1 to Vref V Vin DC Input Voltage, Any Analog or Digital Input VSS – 0.5 to VDD + 0.5 V Vout DC Output Voltage VSS – 0.5 to VDD + 0.5 V DC Input Current, per Pin ± 20 mA DC Output Current, per Pin ± 25 mA DC Supply Current, VDD and VSS Pins ± 50 mA – 65 to 150 C 260 C Iin Iout IDD, ISS Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Operation Ranges below.. OPERATION RANGES (Applicable to Guaranteed Limits) Parameter Value Unit 4.5 to 5.5 V DC Reference Voltage VAG + 4.0 to VDD + 0.1 V VAG Analog Ground VSS – 0.1 to Vref – 4.0 V VAI Analog Input Voltage (See Note) VAG to Vref V Digital Input Voltage, Output Voltage VSS to VDD V Symbol VDD DC Supply Voltage, Referenced to V SS Vref Vin, Vout TA Ambient Operating Temperature – 40 to 125 C NOTE: Analog input voltages greater than V ref convert to full scale. Input voltages less than V AG convert to zero. See V ref and VAG pin descriptions. Page 2 of 15 www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS, Full Temperature and Voltage Ranges per Operation Ranges Table, unless otherwise indicated) Parameter Symbol Test Condition Guaranteed Limit Unit VIH Minimum High-Level Input Voltage (Din, SCLK, CS, ADCLK) 2.0 V VIL Maximum Low-Level Input Voltage (Din, SCLK, CS, ADCLK) 0.8 V VOH Minimum High-Level Output Voltage (Dout, EOC) Iout = – 1.6 mA Iout = – 20 µA 2.4 VDD – 0.1 V VOL Minimum Low-Level Output Voltage (Dout, EOC) Iout = + 1.6 mA Iout = 20 µA 0.4 0.1 V Maximum Input Leakage Current (Din, SCLK, CS, ADCLK) Vin = VSS or VDD + 2.5 µA IOZ Maximum Three-State Leakage Current (Dout) Vout = VSS or VDD + 10 µA IDD Maximum Power Supply Current Vin = VSS or VDD, All Outputs Open 2.5 mA Iref Maximum Static Analog Reference Current (Vref) Vref = VDD, VAG = VSS 100 µA IAl Maximum Analog Mux Input Leakage Current between all deselected inputs and any selected input (AN0 ± AN10) VAl = VSS to VDD +1 µA Iin A/D CONVERTER ELECTRICAL CHARACTERISTICS (Full Temperature and Voltage Ranges per Operation Ranges Table; ML145050: 500 kHz ≤ ADCLK ≤ 2.1 MHz, unless otherwise noted) Characteristic Definition and Test Conditions Guaranteed Limit Unit Resolution Number of bits resolved by the A/D converter 10 Bits Maximum Nonlinearity Maximum difference between an ideal and an actual ADC transfer function ±1 LSB Maximum Zero Error Difference between the maximum input voltage of an ideal and an actual ADC for zero output code ±1 LSB Maximum Full-Scale Error Difference between the minimum input voltage of an ideal and an actual ADC for full-scale output code ±1 LSB Maximum Total Unadjusted Error Maximum sum of nonlinearity, zero error, and full-scale error ±1 LSB Maximum Quantization Error Uncertainty due to converter resolution ± 1/2 LSB Absolute Accuracy Difference between the actual input voltage and the full-scale weighted equivalent of the binary output code, all error sources included ± 1-1/2 LSB Maximum Conversion Time Total time to perform a single analog-to-digital conversion ML145050 44 ML145051 44 ADCLK cycles µs Data Transfer Time Total time to transfer digital serial data into and out of the device Sample Acquisition Time Analog input acquisition time window Minimum Total Cycle Time Total time to transfer serial data, sample the analog input, and perform the conversion ML145050: ADCLK = 2.1 MHz, SCLK = 2.1 MHz ML145051: SCLK = 2.1 MHz Maximum Sample Rate Page 3 of 15 Rate at which analog inputs may be sampled ML145050: ADCLK = 2.1 MHz, SCLK = 2.1 MHz ML145051: SCLK = 2.1 MHz www.lansdale.com 10 to 16 SCLK cycles 6 SCLK cycles µs 26 49 ks/s 38 20.4 Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 AC ELECTRICAL CHARACTERISTICS (Full Temperature and Voltage Ranges per Operation Ranges Table) Figure Symbol 1 f Guaranteed Limit Parameter Clock Frequency, SCLK Unit Note: Refer to t wH, twL below (10-bit xfer) Min (11- to 16-bit xfer) Min (10- to 16-bit xfer) Max) 0 Note 1 2.1 MHz Clock Frequency, ADCLK Note: Refer to t wH, twL below Minimum Maximum 500 2.1 kHz MHz 1 f 1 twH Minimum Clock High Time ADCLK SCLK 190 190 ns 1 twL Minimum Clock Low Time ADCLK SCLK 190 190 ns 1, 7 tPLH, tPHL Maximum Propagation Delay, SCLK to Dout 125 ns 1, 7 th Minimum Hold Time, SCLK to Dout 10 ns 2, 7 tPLZ, tPHZ Maximum Propagation Delay, CS to Dout High-Z 150 ns 2, 7 tPZL, tPZH Maximum Propagation Delay, CS to Dout Driven 2 ADCLK cycles + 300 2.3 ns µs 3 tsu Minimum Setup Time, Din to SCLK 100 ns 3 th Minimum Hold Time, SCLK to Din 0 ns 4, 7, 8 td Maximum Delay Time, EOC to Dout (MSB) ML145051 100 ns 5 tsu Minimum Setup Time, CS to SCLK ML145050 ML145051 2 ADCLK cycles + 425 2.425 ns µs – tCSd Minimum Time Required Between 10th SCLK Falling Edge ( 0.8 V) and CS to Allow a Conversion ML145050 ML145051 44 Note 2 ADCLK cycles – tCAs Maximum Delay Between 10th SCLK Falling Edge ( 2 V) and CS to Abort a Conversion ML145050 36 ML145051 9 ADCLK cycles µs 0 ns ML145051 2.35 µs SCLK ADCLK Din, CS 1 250 10 ms ns µs 5 th 6, 8 tPHL Maximum Propagation Delay, 10th SCLK to EOC 1 tr, tf Maximum Input Rise and Fall Times 1, 4, 6 – 8 tTLH, tTHL – Cin – Cout ML145050 ML145051 Minimum Hold Time, Last SCLK to CS Maximum Output Transition Time, Any Output Maximum Input Capacitance 300 ns AN0 – AN10 ADCLK, SCLK, CS, Din 55 15 pF Dout 15 pF Maximum Three-State Output Capacitance NOTES: 1. After the 10th SCLK falling edge (≤ 2 V), at least 1 SCLK rising edge (≥ 2 V) must occur within 38 ADCLKs (ML145050) or 18.5 µs (ML145051). 2. On the ML145051, a CS edge may be received immediately after an active transition on the EOC pin. Page 4 of 15 www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 SWITCHING WAVEFORMS twL twH tr tf 2.0 V SCLK 0.8 V 2.0 V CS 1/f 0.8 V tPLH, tPHL tPZH, tPZL th tPHZ, tPLZ 2.4 V Dout 0.4 V tTLH, tTHL 90% 2.4 V 0.4 V Dout Figure 1. 10% Figure 2. tTLH EOC VALID 2.4 V 0.4 V 2.0 V 0.8 V Din td 2.4 V th tsu 0.4 V Dout VALID MSB 2.0 V SCLK 0.8 V NOTE: Dout is driven only when CS is active (low). Figure 3. Figure 4. 2.0 V CS tsu SCLK SCLK 0.8 V 0.8 V 10TH CLOCK 0.8 V tPHL th FIRST CLOCK 2.4 V EOC LAST CLOCK 0.4 V 0.8 V tTHL Figure 5. Figure 6. VDD TEST POINT VDD TEST POINT 2.18 k Dout DEVICE UNDER TEST 12 k DEVICE UNDER TEST 100 pF Figure 7. Test Circuit Page 5 of 15 2.18 k EOC 12 k 50 pF Figure 8. Test Circuit www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 PIN DESCRIPTIONS DIGITAL INPUTS AND OUTPUT The various serial bit-stream formats for the ML145050/51 are illustrated in the timing diagrams of Figures 9 through 14. Table 1 assists in selection of the appropriate diagram. Note that the ADCs accept 16 clocks which makes them SPI (Serial Peripheral Interface) compatible. Table 1. Timing Diagram Selection No. of Clocks in Serial Transfer Using CS 10 10 11 to 16 16 11 to 16 16 Yes No Yes No Yes No Serial Transfer Interval Don't Care Don't Care Shorter than Conversion Shorter than Conversion Longer than Conversion Longer than Conversion Figure No. 9 10 11 12 13 14 CS Active-Low Chip Select Input (Pin 15) Chip select initializes the chip to perform conversions and provides 3-state control of the data output pin (Dout). While inactive high, CS forces Dout to the high-impedance state and disables the data input (Din) and serial clock (SCLK) pins. A high-to-low transition on CS resets the serial dataport and synchronizes it to the MPU data stream. CS can remain active during the conversion cycle and can stay in the active low state for multiple serial transfers or CS can be in active high after each transfer. If CS is kept active low between transfers, the length of each transfer is limited to either 10 or 16 SCLK cycles. If CS is in the inactive high state between transfers, each transfer can be anywhere from 10 to16 SCLK cycles long. See the SCLK pin description for a more detailed discussion of these requirements. On the ML145050/51 spurious chip selects caused by system noise are minimized by the internal circuitry. Any transitions on the ML145050 CS pin are recognized as valid only if the level is maintained for a setup time plus two falling edges of ADCLK after the transition. Transitions on the ML145051 CS pin are recognized as valid only if the level is maintained for about 2 ms after the transition. NOTE If CS is inactive high after the 10th SCLK cycleand then goes active low before the A/D conversion is complete, the conversion is aborted and the chip enters the initial state, ready for another serial transfer/conversion sequence. At this point, the output data register contains the result from the conversion before the aborted conversion. Note that the last step of the A/D conversion sequence is to update the output data register with the result. Therefore, if CS goes active low in an attempt to abort the conversion too close to the end of the conversion sequence, the result register may be corrupted and the chip could be thrown out of sync with the processor until CS is toggled again (refer to the AC Electrical Characteristics in the spec tables). Page 6 of 15 Dout Serial Data Output of the A/D Conversion Result(Pin 16) This output is in the high-impedance state when CS is in active high. When the chip recognizes a valid active low on CS, Dout is taken out of the high-impedance state and is driven with the MSB of the previous conversion result. (For thefirst transfer after power-up, data on Dout is undefined for the entire transfer.) The value on Dout changes to the second most significant result bit upon the first falling edge of SCLK. The remaining result bits are shifted out in order, with the LSB appearing on Dout upon the ninth falling edge of SCLK. Note that the order of the transfer is MSB to LSB. Upon the 10th falling edge of SCLK, Dout is immediately driven low (if allowed by CS) so that transfers of more than 10 SCLKs read zeroes as the unused LSBs. When CS is held active low between transfers, Dout is driven from a low level to the MSB of the conversion result for three cases: Case 1 – upon the 16th SCLK falling edge if the transfer is longer than the conversion time (Figure 14); Case 2 – upon completion of a conversion for a 16-bit transfer interval shorter than the conversion (Figure 12); Case 3– upon completion of a conversion for a 10-bit transfer (Figure 10). Din Serial Data Input (Pin 17) The four-bit serial input stream begins with the MSB of the analog mux address (or the user test mode) that is to be converted next. The address is shifted in on the first four rising edges of SCLK. After the four mux address bits have been received, the data on Din is ignored for the remainder of the present serial transfer. See Table 2 in Applications Information. SCLK Serial Data Clock (Pin 18) This clock input drives the internal I/O state machine to perform three major functions: (1) drives the data shift registers to simultaneously shift in the next mux address from the Din pin and shift out the previous conversion result on the Dout pin, (2) begins sampling the analog voltage onto the RCDAC as soon as the new mux address is available, and (3) transfers control to the A/D conversion state machine (driven by ADCLK) after the last bit of the previous conversion result has been shifted out on the Dout pin. The serial data shift registers are completely static, allowing SCLK rates down to the DC. There are some cases, however, that require a minimum SCLK frequency as discussed later in this section. SCLK need not be synchronous to ADCLK. At least ten SCLK cycles are required for each simultaneous data transfer. If the 16-bit format is used, SCLK can be one continuous 16-bit stream or two intermittent 8-bit streams. After the serial port has been initiated to perform a serial transfer*, the new mux address is shifted in on the first *The serial port can be initiated in three ways: (1) a recognized CS falling edge, (2) the end of an A/D conversion if the port is perform-ing either a 10-bit or a 16-bit “shorter-thanconversion” transfer with CS active low between transfers, and (3) the 16th falling edge of SCLK if the port is performing 16-bit “longer-than-conversion” transfers with CS active low between transfers. www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 four rising edges of SCLK, and the previous 10-bit conversion result is shifted out on the first nine falling edges of SCLK. After the fourth rising edge of SCLK, the new mux address is available; therefore, on the next edge of SCLK (the fourth falling edge), the analog input voltage on the selected mux input begins charging the RC DAC and continues to do so until the tenth falling edge of SCLK. After this tenth SCLK edge, the analog input voltage is disabled from the RC DAC and the RC DAC begins the “hold” portion of the A/D conversion sequence. Also upon this tenth SCLK edge, control of the internal circuitry is transferred to ADCLK which drives the successive approximation logic to complete the conversion. If 16 SCLK cycles are used during each transfer, then there is a constraint on the minimum SCLK frequency. Specifically, there must be at least one rising edge on SCLK before the A/D conversion is complete. If the SCLK frequency is too low and a rising edge does not occur during the conversion, the chip is thrown out of sync with the processor and CS needs to be toggled in order to restore proper operation. If 10 SCLKs are used per transfer, then there is no lower frequency limit on SCLK. Also note that if the ADC is operated such that CS is inactive high between transfers, then the number of SCLK cycles per transfer can be anything between 10 and 16 cycles, but the “rising edge” constraint is still in effect if more than 10 SCLKs are used. (If CS stays active low for multiple transfers, the number of SCLK cycles must be either 10 or 16.) dress register. AN1 is addressed by $1, AN2 by $2, 0, AN10 by $A. Table 2 shows the input format for a 16-bit stream. The mux features a break-before-make switching structure to minimize noise injection into the analog inputs. The source resistance driving these inputs must be ≤1 kΩ. During normal operation, leakage currents through the analog mux from unselected channels to a selected channel and leakage currents through the ESD protection diodes on the selected channel occur. These leakage currents cause an offset voltage to appear across any series source resistance on the selected channel. Therefore, any source resistance greater than 1 kΩ (Lansdale test condition) may induce errors in excess of guaranteed specifications. There are three tests available that verify the functionality of all the control logic as well as the successive approximation comparator. These tests are performed by addressing $B, $C, or $D and they convert a voltage of (Vref + VAG)/2,VAG, or Vref, respectively. The voltages are obtained internally by sampling Vref or VAG onto the appropriate elements of the RC DAC during the sample phase. Addressing $B, $C, or $D produces an output of $200 (half scale), $000, or $3FF (full scale), respectively, if the converter is functioning properly. However, deviation from these values occurs in the presence of sufficient system noise (external to the chip) on VDD, VSS, Vref, or VAG. POWER AND REFERENCE PINS ADCLK A/D Conversion Clock Input (Pin 19, ML145050 Only) This pin clocks the dynamic A/D conversion sequence, and may be asynchronous to SCLK. Control of the chip passes to ADCLK after the tenth falling edge of SCLK. Control of the chip is passed back to SCLK after the successive approximation conversion sequence is complete (44 ADCLK cycles), or after a valid chip select is recognized. ADCLK also drives the CS recognition logic. The chip ignores transitions on CS unless the state remains for a setup time plus two falling edges of ADCLK. The source driving ADCLK must be free running. EOC End-of-Conversion Output (Pin 19, ML145051 Only) EOC goes low on the tenth falling edge of SCLK. A low-tohigh transition on EOC occurs when the A/D conversion is complete and the data is ready for transfer. ANALOG INPUTS AND TEST MODE AN0 through AN10 Analog Multiplexer Inputs (Pins 1 – 9, 11, 12) The input AN0 is addressed by loading $0 into the mux ad- Page 7 of 15 VSS and VDD Device Supply Pins (Pins 10 and 20) VSS is normally connected to digital ground; VDD is connected to a positive digital supply voltage. Low frequency (VDD – VSS) variations over the range of 4.5 to 5.5 volts do not affect the A/D accuracy. (See the Operations Ranges Table for restrictions on Vref and VAG relative to VDD and VSS.) Excessive inductance in the VDD or VSS lines, as on automatic test equipment, may cause A/D offsets > ± 1 LSB. Use of a 0.1 µF bypass capacitor across these pins is recommended. VAG and Vref Analog Reference Voltage Pins (Pins 13 and 14) Analog reference voltage pins which determine the lower and upper boundary of the A/D conversion. Analog input voltages ≤ Vref produce a full scale output and input voltages ≤ VAG produce an output of zero. CAUTION: The analog input voltage must be ≥ VSS and ≤ VDD. The A/D conversion result is ratio metric to Vref – VAG. Vref and VAG must be as noisefree as possible to avoid degradation of the A/D conversion. Ideally, Vref and VAG should be single-point connected to the voltage supply driving the system's transducers. Use of a 0.22 µF bypass capacitor across these pins is strongly urged. www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 CS Dout D9 – MSB D8 1 SCLK D7 2 D6 3 4 D5 D4 5 D3 6 D2 7 D1 8 9 HIGH IMPEDANCE D0 D9 10 1 SAMPLE ANALOG INPUT Din A3 A2 A1 A3 A0 MSB EOC A/D CONVERSION INTERVAL SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE INITIALIZE RE-INITIALIZE Figure 9. Timing for 10-Clock Transfer Using CS* MUST BE HIGH ON POWER UP CS Dout D9 – MSB SCLK 1 D8 D7 2 D6 3 4 D5 5 D4 D3 6 D2 7 D1 8 9 D0 LOW LEVEL D9 10 1 SAMPLE ANALOG INPUT Din A3 A2 A1 A0 A3 MSB EOC SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE A/D CONVERSION INTERVAL INITIALIZE Figure 10. Timing for 10-Clock Transfer Not Using CS* NOTES: 1. D9, D8, D7, 0 , D0 = the result of the previous A/D conversion. 2. A3, A2, A1, A0 = the mux address for the next A/D conversion. * This figure illustrates the behavior of the ML145051. The ML145050 behaves identically except there is no EOC signal and the conversion time is 44 ADCLK cycles (user-controlled time). Page 8 of 15 www.lansdale.com Issue B Page 9 of 15 www.lansdale.com A0 D6 D5 D4 D2 D1 SAMPLE ANALOG INPUT D3 D0 A/D CONVERSION INTERVAL HIGH IMPEDANCE RE-INITIALIZE A3 D9 A1 A0 D6 D5 D4 D2 D1 SAMPLE ANALOG INPUT D3 D0 A/D CONVERSION INTERVAL LOW LEVEL Figure 12. Timing for 16-Clock Transfer Not Using CS* (Serial Transfer Interval Shorter Than Conversion) SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE A2 D7 1 NOTES: D9, D8, D7, . . . , D0 = the result of the previous A/D conversion. A3, A2, A1, A0 = the mux address for the next A/D conversion. *This figure illustrates the behavior of the ML145051. The ML145050 behaves identically except there is no EOC signal and the conversion time is 44 ADCLK cycles (user-controlled time). MSB A3 D8 MUST BE HIGH ON POWER UP D9 – MSB INITIALIZE EOC D in SCLK D out CS A1 D7 SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE A2 D8 LOW LEVEL Figure 11. Timing for 11- to 16-Clock Transfer Using CS* (Serial Transfer Interval Shorter than Conversion) A3 D9 – MSB INITIALIZE EOC D in SCLK D out CS A3 D9 1 ML145050, ML145051 LANSDALE Semiconductor, Inc. Issue B Page 10 of 15 www.lansdale.com D5 D4 D2 D1 SAMPLE ANALOG INPUT D3 A1 D7 A0 D6 D5 D4 D2 D1 SAMPLE ANALOG INPUT D3 D0 D0 A/D CONVERSION INTERVAL NOTE 2 LOW LEVEL HIGH IMPEDANCE RE-INITIALIZE A3 D9 A/D CONVERSION INTERVAL NOTE 2 LOW LEVEL Figure 14. Timing for 16-Clock Transfer Not Using CS* (Serial Transfer Interval Longer Than Conversion) SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE A2 A0 D6 1 D9 NOTES: D9, D8, D7, . . . , D0 = the result of the previous A/D conversion. A3, A2, A1, A0 = the mux address for the next A/D conversion. *NOTES: 1. This figure illustrates the behavior of the ML145051. The ML145050 behaves identically except there is no EOC signal and the conversion time is 44 ADCLK cycles (user-controlled time). 2. The 11th SCLK rising edge must occur before the conversion is complete. Otherwise the serial port is thrown out of sync with the microprocessor for the remainder of the transfer. MSB A3 D8 MUST BE HIGH ON POWER UP D9 – MSB INITIALIZE EOC D in SCLK D out CS A1 D7 SHIFT IN NEW MUX ADDRESS, SIMULTANEOUSLY SHIFT OUT PREVIOUS CONVERSION VALUE A2 D8 Figure 13. Timing for 11- to 16-Clock Transfer Using CS* (Serial Transfer Interval Longer Than Conversion) A3 D9 – MSB INITIALIZE EOC D in SCLK D out CS A3 1 ML145050, ML145051 LANSDALE Semiconductor, Inc. Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 Legacy Applications Information DESCRIPTION This example application of the ML145050/ML145051 ADCs interfaces three controllers to a microprocessor and processes data in real-time for a video game. The standard joystick X-axis (left/right) and Y-axis (up/down) controls as well as engine thrust controls are accommodated. Figure 15 illustrates how the ML145050/ML145051 is used as a cost-effective means to simplify this type of circuit design. Utilizing one ADC, three controllers are interfaced to a CMOS or NMOS microprocessor with a serial peripheral interface (SPI) port. Processors with National Semiconductor's MICROWIRE serial port may also be used. Full duplex operation optimizes throughput for this system. DIGITAL DESIGN CONSIDERATIONS Motorola's MC68HC05C4 CMOS MCU may be chosen to reduce power supply size and cost. The NMOS MCUs maybe used if power consumption is not critical. A VDD or VSS 0.1 µF bypass capacitor should be closely mounted to the ADC. Both the ML145050 and ML145051 accommodate all the analog system inputs. The ML145050, when used with a 2 MHz MCU, takes 27 µs to sample the analog input, perform the conversion, and transfer the serial data at 2 MHz. Fortyfour ADCLK cycles (2 MHz at input pin 19) must be provided and counted by the MCU before reading the ADC results. The ML145051 has the end-of-conversion (EOC) signal (at output pin 19) to define when data is ready, but has a slower 49 µs cycle time. However, the 49 µs is constant for serial data rates of 2 MHz independent of the MCU clock frequency. Therefore, the ML145051 may be used with the CMOS MCU operating at reduced clock rates to minimize power consumption without severely sacrificing ADC cycle times, with EOC being used to generate an interrupt. (The ML145051 may also be used with MCUs which do not provide a system clock.) ANALOG DESIGN CONSIDERATIONS Controllers with output impedances of less than 1 kΩ maybe directly interfaced to these ADCs, eliminating the need for buffer amplifiers. Separate lines connect the Vref and VAG pins on the ADC with the controllers to provide isolation from system noise. Although not indicated in Figure 15, the Vref and controller output lines may need to be shielded, depending on their length Page 11 of 15 and electrical environment. This should be verified during prototyping with an oscilloscope. If shielding is required, a twisted pair or foil-shielded wire (not coax) is appropriate for this low frequency application. One wire of the pair or the shield must be VAG. A reference circuit voltage of 5 volts is used for this application. The reference circuitry may be as simple as tying VAG to system ground and Vref to the system's positive supply. (See Figure 16.) However, the system power supply noise may require that a separate supply be used for the voltage reference. This supply must provide source current forVref as well as current for the controller potentiometers. A bypass capacitor of approximately 0.22 µF across the Vref and VAG pins is recommended. These pins are adjacent on the ADC package which facilitates mounting the capacitor very close to the ADC. SOFTWARE CONSIDERATIONS The software flow for acquisition is straight forward. The nine analog inputs, AN0 through AN8, are scanned by reading the analog value of the previously addressed channel into the MCU and sending the address of the next channel to be read to the ADC, simultaneously. If the design is realized using the ML145050, 44 ADCLK cycles (at pin 19) must be counted by the MCU to allow time for A/D conversion. The designer utilizing the MC145051 has the end-of-conversion signal (at pin 19) to define the conversion interval. EOC may be used to generate an interrupt, which is serviced by reading the serial data from the ADC. The software flow should then process and format the data, and transfer the information to the video circuitry for updating the display. When these ADCs are used with a 16-bit (2-byte) transfer, there are two types of offsets involved. In the first type of offset, the channel information sent to the ADCs is offset by 12 bits. That is, in the 16-bit stream, only the first 4 bits (4 MSBs) contain the channel information. The balance of the bits are don't cares. This results in 3 don't-care nibbles, as shown in Table 2. The second type of offset is in the conversion result returned from the ADCs; this is offset by 6 bits. In the 16-bit stream, the first 10 bits (10 MSBs) contain the conversion results. The last 6 bits are zeroes. The hexadecimal result is shown in the first column of Table 3. The second column shows the result after the offset is removed by a microprocessor routine. If the 16-bit format is used, these ADCs can transfer one continuous 16-bit stream or two intermittent 8-bitstreams. www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 Legacy Applications Information Table 2. Programmer 's Guide for 16-Bit Transfers: Input Code Input Address in Hex Channel to be Converted Next Comment $0XXX $1XXX $2XXX $3XXX $4XXX $5XXX $6XXX $7XXX $8XXX $9XXX $AXXX $BXXX $CXXX $DXXX $EXXX $FXXX AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 None None Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 11 Pin 12 Half Scale Test: Output = $8000 Zero Test: Output = $0000 Full Scale Test: Output = $FFC0 Not Allowed Not Allowed Table 3. Programmer 's Guide for 16-Bit Transfers: Output Code Conversion Result Without Offset Removed Conversion Result With Offset Removed $0000 $0040 $0080 $00C0 $0100 $0140 $0180 $01C0 $0200 $0240 $0280 $02C0 $0000 $0001 $0002 $0003 $0004 $0005 $0006 $0007 $0008 $0009 $000A $000B Zero Zero + 1 LSB Zero + 2 LSBs Zero + 3 LSBs Zero + 4 LSBs Zero + 5 LSBs Zero + 6 LSBs Zero + 7 LSBs Zero + 8 LSBs Zero + 9 LSBs Zero + 10 LSBs Zero + 11 LSBs $FF40 $FF80 $FFC0 $03FD $03FE $03FF Full Scale – 2 LSBs Full Scale – 1 LSB Full Scale +5V 0.22 µF LEFT/RIGHT UP/DOWN CONTROLLER #1 ENGINE THRUST LEFT/RIGHT UP/DOWN CONTROLLER #2 ENGINE THRUST 5 VOLT REFERENCE CIRCUIT LEFT/RIGHT CONTROLLER #3 UP/DOWN ENGINE THRUST Vref AN0 VDD AN2 ML145050 AN4 AN5 µP SPI PORT Dout ADC AN3 0.1 µF CS Din SCLK AN1 Value ML145051 ADCLK (ML145050) EOC (ML145051) AN6 AN7 AN8 VAG AN9 AN10 VSS VIDEO CIRCUITRY VIDEO MONITOR Figure 15. Joystick Interface Page 12 of 15 www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 Legacy Applications Information DIGITAL + V DO NOT CONNECT AT IC ANALOG + V Vref TO JOYSTICKS 5V SUPPLY VDD ML145050 ML145051 0.22 µF VAG ANALOG GND 0.1 µF VSS DO NOT CONNECT AT IC DIGITAL GND Figure 16. Alternate Configuration Using the Digital Supply for the Reference Voltage Compatible Motorola MCUs/MPUs This is not a complete listing of Motorola's MCUs/MPUs. Contact your Motorola representative if you need additional information. Instruction Set Memory (Bytes) ROM EEPROM SPI SCI M6805 2096 2096 4160 4160 8K 4160 8K 7700 – – – – – – – – – 4160 – Yes Yes Yes Yes Yes Yes Yes – M68000 – – – Device Number MC68HC05C2 MC68HC05C3 MC68HC05C4 MC68HSC05C5 MC68HSC05C8 MC68HCL05C4 MC68HCL05C8 MC68HC05C8 MC68HC805C5 MC68HC000 SPI = Serial Peripheral Interface. SCI = Serial Communication Interface. ✟ High Speed. ✟ Low Power. Page 13 of 15 www.lansdale.com Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 OUTLINE DIMENSIONS P DIP 20 = RP (ML145050RP, ML145051RP) CASE 738-03 -A20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 11 B 1 1 0 C -T- L K SEATING PLANE M E G N F J 20 PL 0.25 (0.010) D 20 PL 0.25 (0.010) Page 14 of 15 M T A M www.lansdale.com M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.070 1.010 0.260 0.240 0.180 0.150 0.022 0.015 0.050 BSC 0.070 0.050 0.100 BSC 0.015 0.008 0.140 0.110 0.300 BSC 15° 0° 0.040 0.020 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0° 15° 1.01 0.51 Issue B LANSDALE Semiconductor, Inc. ML145050, ML145051 OUTLINE DIMENSIONS SOG 20W = -6P (ML145050-6P, ML145051-6P) CASE 751D-04 -A20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOW ABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 -B- P 10 PL 0.010 (0.25) 1 1 M B M 0 D 20 PL 0.010 (0.25) J M T B S A S F R X 45° C -TG 18 PL K SEATING PLANE M DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0° 7° 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0° 7° 0.395 0.415 0.010 0.029 Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc. Page 15 of 15 www.lansdale.com Issue B