TB62706BNG/BFG TOSHIBA Bi- CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62706BNG, TB62706BFG 16BIT SHIFT REGISTER, LATCHES & CONSTANT CURRENT DRIVERS The TB62706BNG, TB62706BFG are specifically designed for LED and LED DISPLAY constant current drivers. This constant current output circuits are able to set up external resistor (IOUT = 5~90 mA). (Note) These devices are monolithic integrated circuit designed to be used together with Bi- CMOS process. The devices consist of 16bit shift register, latch, AND- GATE and Constant Current Drivers. These products are Pb free. TB62706BNG TB62706BFG FEATURES l Constant Current Output : Can set up all output current with one resister for 5 to 90 mA. l Maximum Clock Frequency : fCLK = 15 (MHz) (Cascade Connected Operate, Topr = 25°C) l 5 V C- MOS Compatible Input l Package : SDIP24- P- 300- 1.78 (TB62706BNG) SSOP24- P- 300- 1.00B (TB62706BFG) l Constant Output Current Matching: OUTPUT- GND VOLTAGE CURRENT MATCHING OUTPUT CURRENT =0.4 V ±6.0% 5~40 mA =0.7 V ±6.0% 5~90 mA Weight SDIP24-P-300-1.78 : 1.22 g (typ.) SSOP24-P-300-1.00B : 0.32 g (typ.) PIN CONNECTION (Top view) Company Headquarters 3 Northway Lane North Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725 Web: www.marktechopto.com | Email: [email protected] California Sales Office: 950 South Coast Drive, Suite 265 Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314 TB62706BNG/BFG BLOCK DIAGRAM TIMING DIAGRAM Note: Latches are level sensitive, not rising edges sensitive and not syncronus CLOCK. Input of LATCH- terminal to H Level, data passes latches, and input to L level, data hold latches. Input of ENABLE- terminal to H level, all output (OUT0~15) do off. 2 2004-06-24 TB62706BNG/BFG TERMINAL DISCRIPTION PIN No. PIN NAME FUNCTION 1 GND 2 SERIAL- IN 3 CLOCK Input terminal of a clock for data shift to up- edge. 4 LATCH Input terminal of a data strobe. Latches passes data with “H” level input of LATCH - terminal, and hold data with "L" level input. 5~20 OUT0 ~ 15 21 ENABLE 22 SERIAL- OUT 23 R- EXT 24 VDD GND terminal for control logic. Input terminal of a serial- data for shift- register. Output terminals. Input terminal of output enable. All outputs (OUT0~15) do off with “H” level input of ENABLE - terminal, and do on with "L" level input. Output terminal of a serial- data for next SERIAL- IN terminal. Input terminal of connects with a resister for to set up all output current. 5 V Supply voltage terminal. TRUTH TABLE CLOCK LATCH ENABLE SERIAL- IN OUT0 ··· OUT7 ··· OUT15 SERIAL- OUT UP H L Dn Dn ··· Dn- 7 ··· Dn- 15 Dn- 15 UP L L Dn+1 No change Dn- 14 UP H L Dn+2 Dn+2 ··· Dn- 5 ··· Dn- 13 Dn- 13 DOWN X L Dn+3 Dn+2 ··· Dn- 5 ··· Dn- 13 Dn- 13 DOWN X H Dn+3 Off Dn- 13 Note: OUT0 ~ 15 = on in case of Dn = H level and OUT0 ~ 15 = off in case of Dn = L level. A resistor is connected with R- EXT and GND accompanied with outside, and it is necessary that a correct power supply voltage is supplied. EQUIVALENT CIRCUIT OF INPUTS AND OUTPUTS 1. ENABLE terminal 2. LATCH terminal 3. CLOCK, SERIAL- IN terminal 4. SERIAL- OUT terminal 3 2004-06-24 TB62706BNG/BFG MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage VDD 0~7.0 V Input Voltage VIN - 0.4~VDD + 0.4 V Output Current IOUT 90 mA Output Voltage VOUT - 0.5~17.0 V fCK 15 MHz IGND 1440 mA Clock Frequency GND Terminal Current Power Dissipation Tharmal Resistance PD Rth (j- a) 1.78 (BNG- type : ON PCB, Ta = 25°C ) W 1.00 (BFG- type : ON PCB, Ta = 25°C ) BNG : 70 (BN- type : ON PCB) °C / W BFG : 120 (BF- type : ON PCB) Operating Temperature Topr - 40~85 °C Storage Temperature Tstg - 55~150 °C Note: BN- type :Ambient temperature delated above 25°C in the proportion of 14.2 mW / °C BF- type : Ambient temperature delated above 25°C in the proportion of 8.3 mW / °C RECOMMENDED OPERATING CONDITION (Ta = - 40~85°C unless otherwise noted) CHARACTERISTIC SYMBOL CONDITION MIN TYP. Supply Voltage VDD – 4.5 5.0 5.5 V Output Voltage VOUT – – – 15.0 V OUTn, DC 1 circuit 5 – 88 IOH SERIAL- OUT – – 1.0 IOL SERIAL- OUT – – - 1.0 IO Output Current MAX UNIT mA VIH – 0.7 VDD – VDD +0.3 VIL – - 0.3 – 0.3 VDD 100 – – ns Input Voltage LATCH Pulse Width t w LAT CLOCK Pulse Width V tw CLK 50 – – ns ENABLE Pulse Width t w EN 4500 – – ns Set- Up Time for DATA tsetup (D) 60 – – ns Hold Time for DATA thold (D) 20 – – ns Set- Up Time for LATCH tsetup (L) 100 – – ns Hold Time for LATCH thold (L) 60 – – ns MHz Clock Frequency Power Dissipation fCLK PD VDD = 4.5~5.5 V Cascade operation – – 10.0 Ta = 85°C (BNG- type) – – 0.92 Ta = 85°C (BFG- type) – – 0.50 4 W 2004-06-24 TB62706BNG/BFG ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted) SYMBOL TEST CIRCUIT "H" Level VIH – "L" Level VIL CHARACTERISTIC CONDITION MIN TYP. MAX Ta = - 40~85°C 0.7 VDD – VDD – Ta = - 40~85°C GND – 0.3 VDD IOH – VOH = 15.0 V – – 10 VOL – IOL = 1.0 mA – – 0.4 VOH – IOH = - 1.0 mA 4.6 – – IOL1 – VCE = 0.7 V 34.1 40.0 45.9 IOL2 – VCE = 0.4 V 33.7 39.5 45.3 ∆ IOL1 – IO = 40 mA, VCE = 0.4 V REXT = 470 Ω – ±1.5 ±6.0 IOL3 – VCE = 1.0 V 64.2 75.5 86.8 IOL4 – VCE = 0.7 V REXT = 250 Ω (Include current matching) 63.8 75.0 86.2 ∆ IOL2 – IO = 75 mA, VCE = 0.7 V – ±1.5 ±6.0 % Supply Voltage Regulation % / VDD – REXT = 470 Ω, Ta = - 40~85°C – 1.5 5.0 %/V Pull- Up Resistor RIN (up) – – 150 300 600 Ω RIN (down) – – 100 200 400 Ω IDD (off) 1 – REXT = Open, OUT0 ~ 15 = off – 0.6 1.2 IDD (off) 2 – REXT = 470 Ω, OUT0 ~ 15 = off 3.5 5.8 8.0 IDD (off) 3 – REXT = 250 Ω, OUT0 ~ 15 = off 6.5 10.7 15.0 IDD (on) 1 – REXT = 470 Ω, OUT0 ~ 15 = on 10.0 16.0 22.0 IDD (on) 2 – REXT = 250 Ω, OUT0 ~ 15 = on 18.0 28.3 38.5 Input Voltage Output Leakage Current Output Voltage SERIAL- OUT Output Current 1 Current Skew Output Current 2 Current Skew Pull- Down Resistor "OFF" Supply Current "ON" 5 REXT = 470 Ω (Include current matching) REXT = 250 Ω UNIT V µA V mA % mA mA 2004-06-24 TB62706BNG/BFG SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise noted) CHARACTERISTIC SYMBOL TEST CIRCUIT CONDITION CLK- OUTn Propagation Delay Time (“L” to “H”) Propagation Delay Time (“H” to “L”) LATCH - OUTn ENABLE - OUTn tpLH – MIN TYP MAX – 1200 1500 – 1200 1500 – 1200 1500 CLK- SOUT 15 30 70 CLK- OUTn – 700 1000 – 700 1000 – 700 1000 15 30 70 LATCH - OUTn ENABLE - OUTn tpHL – CLK- SOUT CLK tw CLK – LATCH tw LAT – Pulse Width L- H Set- up Time tsetup (L) H- L tsetup (C) L- H thold (L) Hold Time H- L – UNIT ns ns VDD = 5.0 V VCE = 0.4 V VIH = VDD VIL = GND REXT = 470 Ω VL = 3.0 V RL = 65 Ω CL = 10.5 pF – 20 30 ns – 10 25 ns – 25 50 ns – 25 50 ns – 0 15 ns – 0 15 ns – thold (C) Maximum CLOCK Rise Time tr – – – 10 µs Maximum CLOCK Fall Time tf – – – 10 µs Output Rise Time tor – 150 300 600 ns Output Fall Time tof – 150 300 600 ns 6 2004-06-24 TB62706BNG/BFG TEST CIRCUIT DC characteristic AC characteristic PRECAUTIONS for USING Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed due to short- circuit between outputs, air contamination fault, or fault by improper grounding. 7 2004-06-24 TB62706BNG/BFG TIMING WAVEFORM 1. CLOCK- SERIAL OUT, OUTn 2. CLOCK- LATCH 3. ENABLE - OUTn 8 2004-06-24 TB62706BNG/BFG 9 2004-06-24 TB62706BNG/BFG Fig.1 10 2004-06-24 TB62706BNG/BFG LED DRIVER TB6270X SERIES APPICATION NOTE [1] Output current (IOUT) IOUT is set by the enternal resistor (R- EXT) as shown in Fig.1. [2] Total supply voltage (VLED) This device can operate 0.4~0.7V (VO). When a higher voltage is input to the device, the excess voltage is consumed inside the device, that leads to power dissipation. In order to minimize power dissipation and loss, we would like to recommend to set the total supply voltage as shown below, VLED (total supply voltage) = VCE (Tr Vsat) + Vf (LED Forward voltage) + VO (IC supply voltage) When the total supply is too high considering the power dissipation of this device, an additional R can decrease the supply voltage (VO). [3] Pattern layout This device owns only one ground pin that means signal ground pin and power ground pin are common. If ground pattern layout contains large inductance and impedance, and the voltage between ground and LATCH, CLOCK terminals exceeds 2.5 V by switching noise in operation, this device may miss- operate. So we would lile you to pay attention to pattern layout to minimize inductance. 11 2004-06-24 TB62706BNG/BFG Package Dimensions Weight: 1.22 g (typ.) 12 2004-06-24 TB62706BNG/BFG Package Dimensions Weight: 0.32 g (typ.) 13 2004-06-24 TB62706BNG/BFG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-63Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE 000707EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document are subject to the foreign exchange and foreign trade laws. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 14 2004-06-24