DA1175.008 13 July, 2006 MAS1175 IC FOR 10.00 – 20.00 MHz VCTCXO Low Power Wide Supply Voltage Range True Sine Wave Output Very High Level of Integration • Electrically Trimmable • Very Low Phase Noise • Low Cost • • • • DESCRIPTION The MAS1175 is an integrated circuit well suited to build VCTCXO for mobile communication. Only two external components are needed. Temperature calibration is achieved with three calibration points only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. FEATURES • • • • • To build a VCTCXO only two additional components, a varactor and a crystal are needed. The compensation method is fully analog. IC compensation work is continuous without generating any steps or other interferences. APPLICATIONS Very small size Minimum current draw Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset VCTCXO for mobile phones VCTCXO for other telecommunications systems • BLOCK DIAGRAM DA CLK PV CUB 4 INF 4 SENS 4 LIN 8 CDAC1 8 f(T) MAS1175 TE1 Σ f(T) T Vref TMux TE2 VC VDD CDAC2 VSS 2 OUT X2 X1 1 (9) DA1175.008 13 July, 2006 PIN DESCRIPTION Pin Description Symbol x-coordinate y-coordinate Power Supply Voltage Programming Input Serial Bus Clock Input VDD PV CLK 263 503 745 1330 1326 1321 Serial Bus Data Input Temperature Output Test Multiplexer Output Voltage Control Input Crystal Oscillator Output Crystal/Varactor Oscillator Input Power Supply Ground Buffer Output DA TE1 TE2 VC X1 X2 VSS OUT 1001 1246 1454 190 398 1355 1828 2031 1321 1325 1325 231 231 231 242 231 Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Supply Voltage Input Voltage Power Dissipation Storage Temperature VDD - VSS VIN PMAX TST -0.3 VSS -0.3 6.0 VDD + 0.3 20 150 V V mW o C -55 Note 1) Note: Not valid for programming pin PV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Supply Voltage Supply Current Operable Temperature Storage Temperature VDD ICC TC TS Crystal Pulling Sensitivity Load Capacitance S CL Conditions Min Typ Max Unit 2.7 2.8 5.5 1.8 +85 +40 V mA o C o C Vcc = 2.8 Volt Relative humidity = 15%…70% -30 -5 30 10 ppm/pF pF 2 (9) DA1175.008 13 July, 2006 ELECTRICAL CHARACTERISTICS Parameter Symbol Min Frequency Range fo Voltage Control Range VC Voltage Control Sensitivity Typ Max Unit 10.00 20.00 MHz 0 Vdd VCSENS 10 ppm/V Output Voltage (10kΩ // 10 pF) Vout 1.0 Vpp Compensation Range ± 2.5 ppm TC -30 85 o o Compensation Range ± 2.0 ppm TC -25 75 Compensation Range Linear Part a1 -0.7 0.0 Compensation Inflection Point INF 25 31 Compensation Range Cubic Part a3 Compensation CDAC1 (8 Bit) CX1 C10 CX2 C20 Compensation CDAC2 (2 Bit) Startup Time C C ppm/K o C ppm2/K3 95 C10 + 18 C20 + 4 TSTART Note 2 pF 2) pF 3) ms Note 2: typ C10 = 14pF Note 3: typ C20 = 5pF (varactor capacitance has to be added) IC OUTLINES PV CLK DA TE1 TE2 MAS1175 1556 µm VDD VC X1 X2 VSS OUT Die map reference 2234 µm Note 1: MAS1175A pads are round with 95 µm diameter at opening. Note 2: Pins PV and TE1 shall not be connected and pins CLK and DA can either be connected to VSS or left open in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. 3 (9) DA1175.008 13 July, 2006 DEVICE OUTLINE CONFIGURATION MSOP10 (SnPb) CLK PV VDD A = product version Y = year WW= week TE2 OUT VSS X2 Top View DA CLK X1 PV VC VDD 1175 A G YWW DA 1175 AYWW TE2 MSOP10 (Green) OUT VSS X2 X1 VC A = product version Y = year WW= week G=Green/RoHs Compliant 4 (9) DA1175.008 13 July, 2006 PACKAGE (MSOP-10) OUTLINE e S See Detail A c B c1 b1 (b) E1 E1 B Section B - B E E 5-15 Degrees L1 Detail A A2A F AA A1 Land Pattern Recommendation Gauge Plane 0 - 8 Degrees L2 D Seating Plane N L G Symbol Min Nom Max Unit A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) L1 L2 M N S -0.00 0.75 0.15 0.15 0.08 0.08 --0.85 ---- 1.10 0.15 0.95 0.30 0.25 0.23 0.18 mm mm mm mm mm mm mm mm mm mm mm mm mm mm 0.40 3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.60 0.80 0.95 REF 0.25 BSC 0.41 1.02 0.50 M mm mm mm Mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA. 5 (9) DA1175.008 13 July, 2006 SOLDERING INFORMATION ◆ For Sn/Pb MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 2*220°C 240°C 3 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% ◆ For Pb Free, RoHS Compliant MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Lead Finish According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Solder plate 7.62 - 25.4 µm, material Matte Tin 6 (9) DA1175.008 13 July, 2006 EMBOSSED TAPE SPECIFICATIONS P1 T DO PO P2 E W F BO A AO KO D1 Section A-A User Direction of Feed Pin 1 Designator Dimension Min/Max Unit Ao Bo Do D1 E F Ko Po P1 P2 T W 5.00 ±0.10 3.20 ±0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 ±0.05 1.45 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 +0.30/-0.10 mm mm mm mm mm mm mm mm mm mm mm mm 7 (9) DA1175.008 13 July, 2006 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Weight Leader Components Min 1.5 12.80 20.2 50 12.4 Max Unit 330 mm mm mm mm mm mm mm mm mm 13.50 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 g 8 (9) DA1175.008 13 July, 2006 ORDERING INFORMATION Product Code Product Package Comments MAS1175ATB1 MAS1175ASM1-T IC FOR VCTCXO IC FOR VCTCXO Tested wafers, 480 µm MSOP10 Die Size 2.233x1.556 mm Tape & Reel MAS1175A1SN06 IC FOR VCTCXO Green MSOP-10, Pb Free, RoHS Compliant Please contact Micro Analog Systems Oy for other wafer thickness options. Tape & Reel LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 9 (9)