MX27C2100/27C2048 2M-BIT [256Kx8/128x16] CMOS EPROM FEATURES • • • • • 128K x 16 organization(MX27C2048, JEDEC pin out) • 256K x 8 or 128K x 16 organization(MX27C2100, ROM pin out compatible) • +12.5V programming voltage • Fast access time: 55/70/90/120/150 ns • Totally static operation Completely TTL compatible Operating current: 40mA Standby current: 100uA Package type: - 40 pin plastic DIP - 44 pin PLCC(MX27C2048) GENERAL DESCRIPTION The MX27C2100/2048 is a 5V only, 2M-bit, One Time Programmable Read Only Memory. It is organized as 128K words by 16 bits per word(MX27C2048), 256K x 8 or 128K x 16(MX27C2100), operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C2100/2048 supports a intelligent fast programming algorithm which can result in programming times of less than one minute. This EPROM is packaged in industry standard 40 pin dual-in-line package and 44 lead PLCC package. PIN CONFIGURATIONS Q12 PIN NAME A0~A16 Address Input Q0~Q15 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Program Enable Input VPP Program Supply Voltage VCC Power Supply Pin (+5V) GND Ground Pin 1 44 A14 A15 A16 PGM VCC NC VPP CE 6 40 39 A13 Q11 A12 Q10 A11 Q9 A10 Q8 GND A9 MX27C2048 12 34 GND NC NC Q7 A8 Q6 A7 A6 Q5 29 28 A3 A2 A1 A0 NC OE Q0 23 A5 A4 17 18 Q1 Q4 BLOCK DIAGRAM (MX27C2048) PIN DESCRIPTION(MX27C2048) SYMBOL 7 Q15 Q13 VCC PGM A16 A15 A14 A13 A12 A11 A10 A9 GND A8 A7 A6 A5 A4 A3 A2 A1 A0 Q2 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 Q14 PLCC(MX27C2048) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Q3 VPP CE Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 GND Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 OE MX27C2048 PDIP(MX27C2048) CE CONTROL LOGIC PGM OE A0~A16 ADDRESS INPUTS . . . . . . Y-DECODER X-DECODER . . VCC VSS OUTPUT BUFFERS . . . . . . . Q0~Q15 Y-SELECT 2M BIT CELL MAXTRIX . VPP REV. 4.5, JAN. 14, 2003 P/N: PM0158 1 MX27C2100/27C2048 BLOCK DIAGRAM (MX27C2100) PIN CONFIGURATIONS NC A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MX27C2100 PDIP(MX27C2100) A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 CE OE BYTE/VPP . CONTROL OUTPUT Q0~Q14 LOGIC BUFFERS Q15/A-1 Y-DECODER . . A0~A16 ADDRESS INPUTS . . . . . . . Y-SELECT . . X-DECODER . . . . 2M BIT CELL MAXTRIX VCC GND PIN DESCRIPTION(MX27C2100) SYMBOL PIN NAME A0~A16 Address Input Q0~Q14 Data Input/Output CE Chip Enable Input OE Output Enable Input BYTE/VPP Word/Byte Selection Q15/A-1 Q15(Word mode)/LSB addr. (Byte mode) VCC Power Supply Pin (+5V) GND Ground Pin /Program Supply Voltage TRUTH TABLE OF BYTE FUNCTION(MX27C2100) BYTE MODE(BYTE = GND) CE OE Q15/A-1 MODE Q0-Q7 SUPPLY CURRENT H X X Non selected High Z Standby(ICC2) L H X Non selected High Z Operating(ICC1) L L A-1 input Selected DOUT Operating(ICC1) WORD MODE(BYTE = VCC) CE OE Q15/A-1 MODE Q0-Q14 SUPPLY CURRENT H X High Z Non selected High Z Standby(ICC2) L H High Z Non selected High Z Operating(ICC1) L L DOUT Selected DOUT Operating(ICC1) NOTE : X = H or L P/N: PM0158 REV. 4.5, JAN. 14, 2003 2 MX27C2100/27C2048 VIL(for MX27C2048), OE at VIL, CE at VIH(for MX27C2100) and VPP at its programming voltage. FUNCTIONAL DESCRIPTION THE PROGRAMMING OF THE MX27C2100/2048 AUTO IDENTIFY MODE When the MX27C2100/2048 is delivered, or it is erased, the chip has all 2M bits in the "ONE", or HIGH state. "ZEROs" are loaded into the MX27C2100/2048 through the procedure of programming. The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C2100/2048. For programming, the data to be programmed is applied with 16 bits in parallel to the data pins. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. When programming an MXIC EPROM, a 0.1uF capacitor is required across VPP and ground to suppress spurious voltage transients which may damage the device. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C2100/2048, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q15) defined as the parity bit. READ MODE The MX27C2100/2048 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE's, assuming that CE has been LOW and addresses have been stable for at least tACC - t OE. PROGRAM INHIBIT MODE Programming of multiple MX27C2100/2048's in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C2100/2048 may be common. A TTL low-level program pulse applied to an MX27C2100/2048 CE input with VPP = 12.5 ± 0.5 V will program the MX27C2100/2048. A high-level CE input inhibits the other MX27C2100/2048s from being programmed. WORD-WIDE MODE PROGRAM VERIFY MODE With BYTE/VPP at VCC ± 0.2V outputs Q0-7 present data Q0-7 and outputs Q8-15 present data Q8-15, after CE and OE are appropriately enabled. Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at P/N: PM0158 REV. 4.5, JAN. 14, 2003 3 MX27C2100/27C2048 BYTE-WIDE MODE The location of the capacitor should be close to where the power supply is connected to the array. With BYTE/VPP at GND ± 0.2V, outputs Q8-15 are tristated. If Q15/A-1 = VIH, outputs Q0-7 present data bits Q8-15. If Q15/A-1 = VIL, outputs Q0-7 present data bits Q0-7. STANDBY MODE The MX27C2100/2048 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C2100/2048 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. P/N: PM0158 REV. 4.5, JAN. 14, 2003 4 MX27C2100/27C2048 MODE SELECT TABLE (MX27C2048) PINS MODE CE OE PGM A0 A9 VPP OUTPUTS Read VIL VIL VIH X X VCC DOUT Output Disable VIL VIH VIH X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC 00C2H Device Code(3) VIL VIL X VIH VH VCC 0122H NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. MODE SELECT TABLE (MX27C2100) BYTE/ MODE CE OE A9 A0 Q15/A-1 VPP(5) Q8-14 Q0-7 Read (Word) VIL VIL X X Q15 Out VCC Q8-14 Out Q0-7 Out Read (Upper Byte) VIL VIL X X VIH GND High Z Q8-15 Out Read (Lower Byte) VIL VIL X X VIL GND High Z Q0-7 Out Output Disable VIL VIH X X High Z X High Z High Z Standby VIH X X X High Z X High Z High Z Program VIL VIH X X Q15 In VPP Q8-14 In Q0-7 In Program Verify VIH VIL X X Q15 Out VPP Q8-14 Out Q0-7 Out Program Inhibit VIH VIH X X High Z VPP High Z High Z Manufacturer Code(3) VIL VIL VH VIL 0B VCC 00H C2H Device Code(3) VIL VIL VH VIH 0B VCC 01H 8AH NOTES: 1. VH = 12.0V ± 0.5V 2. X = Either VIH or VIL. 3. A1 - A8, A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltages. 5. BYTE/VPP is intended for operation under DC Voltage conditions only. P/N: PM0158 REV. 4.5, JAN. 14, 2003 5 MX27C2100/27C2048 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 50us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0158 REV. 4.5, JAN. 14, 2003 6 MX27C2100/27C2048 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance (30pF for MX27C2100/2048-70 and MX27C2048-55) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 3.0V/0V. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C2100/2048-70 and MX27C2048-55. P/N: PM0158 REV. 4.5, JAN. 14, 2003 7 MX27C2100/27C2048 ABSOLUTE MAXIMUM RATINGS NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. RATING VALUE Ambient Operating Temperature 0oC to 70oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C2048 Operating Temperature Commercial MX27C2100/2048 -55 -70 -90 -12 -15 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% Vcc Power Supply DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 40 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V P/N: PM0158 REV. 4.5, JAN. 14, 2003 8 MX27C2100/27C2048 AC CHARACTERISTICS 2100/2048-55 SYMBOL PARAMETER MIN. tACC Address to Output Delay 55 tCE Chip Enable to Output Delay tOE Output Enable to Output Delay tDF OE High to Output Float, 2100/2048-70 MAX. 0 MIN. 2100/2048-90 MAX. UNIT CONDITIONS 70 90 ns CE = OE = VIL 55 70 90 ns OE = VIL 30 30 40 ns CE = VIL 25 ns 15 MAX. 0 MIN. 15 0 or CE High to Output Float tOH Output Hold from Address, 0 0 0 ns CE or OE which ever occurred first AC CHARACTERISTICS 2100/2048-12 SYMBOL PARAMETER MIN. 2100/2048-15 MAX. MIN. MAX. UNIT CONDITIONS tACC Address to Output Delay 120 150 ns CE = OE = VIL tCE Chip Enable to Output Delay 120 150 ns OE = VIL tOE Output Enable to Output Delay 50 65 ns CE = VIL tDF OE High to Output Float, 50 ns 0 35 0 or CE High to Output Float tOH Output Hold from Address, 0 0 ns CE or OE which ever occurred first AC CHARACTERISTICS SYMBOL PARAMETER tBHA BYTE Access Time tOHB BYTE Output Hold Time tBHZ BYTE Output Delay Time tBLZ BYTE Output Set Time 27C2100-70 27C2100-90 MIN. MIN. MAX. 70 0 MIN. 90 0 MAX. 70 10 MIN. MAX. UNIT 150 ns 0 70 10 P/N: PM0158 27C2100-15 120 0 70 10 MAX. 27C2100-12 ns 70 10 ns ns REV. 4.5, JAN. 14, 2003 9 MX27C2100/27C2048 DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V MAX. UNIT VIN = 0 to 5.5V CE = VIL, OE = VIH AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Out put Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2.0 us tOE Data valid from OE 130 ns us 105 150 P/N: PM0158 CONDITIONS us ns REV. 4.5, JAN. 14, 2003 10 MX27C2100/27C2048 WAVEFORMS(MX27C2048) READ CYCLE (WORD MODE) ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORM PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tPW tOES tOE Max VIH OE VIL P/N: PM0158 REV. 4.5, JAN. 14, 2003 11 MX27C2100/27C2048 WAVEFORMS(MX27C2100) READ CYCLE (BYTE MODE) HIGH-Z A-1 HIGH-Z tACC tOH BYTE/VPP Q0-Q7 VALID DATA VALID DATA tBHA tOHB VALID DATA Q15-Q8 tBHZ tBLZ FAST PROGRAMMING ALGORITHM WAVEFORM VERIFY PROGRAM VIH Addresses VALID ADDRESS VIL tAH tAS DATA OUT VALID DATA SET DATA tDS tDFP tDH VPP1 BYTE/VPP VCC tVPS VCC1 VCC VCC tVCS VIH CE VIL tPW tOES tOE VIH OE VIL P/N: PM0158 REV. 4.5, JAN. 14, 2003 12 MX27C2100/27C2048 ORDERING INFORMATION PLASTIC PACKAGE PART NO. ACCESS TIME OPERATING CURRENT STANDBY CURRENT (ns) MAX.(mA) MAX.(uA) MX27C2100PC-70 70 40 100 40 Pin DIP(ROM pin out) MX27C2100PC-90 90 40 100 40 Pin DIP(ROM pin out) MX27C2100PC-12 120 40 100 40 Pin DIP(ROM pin out) MX27C2100PC-15 150 40 100 40 Pin DIP(ROM pin out) MX27C2048PC-55 55 40 100 40 Pin DIP(JEDEC pin out) MX27C2048PC-70 70 40 100 40 Pin DIP(JEDEC pin out) MX27C2048PC-90 90 40 100 40 Pin DIP(JEDEC pin out) MX27C2048PC-12 120 40 100 40 Pin DIP(JEDEC pin out) MX27C2048PC-15 150 40 100 40 Pin DIP(JEDEC pin out) MX27C2048QC-55 55 40 100 44 Pin PLCC MX27C2048QC-70 70 40 100 44 Pin PLCC MX27C2048QC-90 90 40 100 44 Pin PLCC MX27C2048QC-12 120 40 100 44 Pin PLCC MX27C2048QC-15 150 40 100 44 Pin PLCC P/N: PM0158 PACKAGE REV. 4.5, JAN. 14, 2003 13 MX27C2100/27C2048 PACKAGE INFORMATION P/N: PM0158 REV. 4.5, JAN. 14, 2003 14 MX27C2100/27C2048 P/N: PM0158 REV. 4.5, JAN. 14, 2003 15 MX27C2100/27C2048 REVISION HISTORY Revision No. Description 3.0 SWITCHING TEST WAVEFORMS: For 90/120/150ns, the AC driving level are revised from 2.4V/0.4V to 3.0V/0V. 4.0 1)Eliminate Interactive Programming Mode. 2)40-CDIP package quartz len, change to square shape. 4.1 IPP : 100uA----> 10uA 4.2 Cancel Ceramic DIP package type 4.3 Cancel "Ultraviolet Erasable" wording in General Description To modify Package Information 4.4 To modify Package Information 4.5 1. To remove 10 x 14mm 40-TSOP package type. 2. To modify 40-PDIP package information P/N: PM0158 Page Date 10/23/1996 6/13/1997 P1,2,3,13,14 P1 P14~16 P14~16 P1,13,16 P14 8/8/1997 MAR/01/2000 AUG/22/2001 NOV/19/2002 JAN/14/2003 REV. 4.5, JAN. 14, 2003 16 MX27C2100/27C2048 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.