MLX90248 Micropower & Omnipolar Hall Switch Features and Benefits Application Examples Micropower consumption ideal for batterypowered applications Omnipolar, easy to use as output switches with both North and South pole Ultra-Thin QFN package (0.43mm max) & Thin SOT23 3L (both RoHS Compliant) Very High Sensitivity Hall Sensor Chopper stabilized amplifier stage Operation down to 2.5V Solid State Switch Handheld Wireless Handset Awake Switch Lid close sensor for battery-powered devices Magnet proximity sensor for reed switch replacement in low duty cycle applications Ordering Information Part No. MLX90248 MLX90248 1 Functional Diagram Temperature Code E (-40°C to 85°C) E (-40°C to 85°C) Package Code SE (TSOT-3L) LD (UTQFN-6L) 2 General Description TM The MLX90248 Omnipolar Hall effect sensor IC is fabricated from mixed signal CMOS technology. It incorporates advanced chopper-stabilization techniques to provide accurate and stable magnetic switch points. The circuit design provides an internally controlled clocking mechanism to cycle power to the Hall element and analog signal processing circuits. This serves to place the high current-consuming portions of the circuit into a “Sleep” mode. Periodically the device is “Awakened” by this internal logic and the magnetic flux from the Hall element is evaluated against the predefined thresholds. If the flux density is above or below the Bop/Brp thresholds then the output transistor is driven to change states accordingly. While in the “Sleep” cycle the output transistor is latched in its previous state. The design has been optimized for service in applications requiring extended operating lifetime in battery powered systems. The output transistor of the 90248 will be latched on (BOP) in the presence of a sufficiently strong South or North magnetic field facing the marked side of the package. The output will be latched off (BRP) in the absence of a magnetic field. 3901090248 Rev 012 Page 1 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch Table of Contents 1 Functional Diagram ........................................................................................................ 1 2 General Description........................................................................................................ 1 3 Glossary of Terms .......................................................................................................... 3 4 Absolute Maximum Ratings ........................................................................................... 3 5 Pin Definitions and Descriptions................................................................................... 3 6 General Electrical Specifications .................................................................................. 4 7 Magnetic Specifications ................................................................................................. 4 8 Outputs Behaviour vs. Magnetic Pole........................................................................... 4 9 Detailed General Description ......................................................................................... 5 10 Unique Features............................................................................................................ 5 11 Performance Graphs .................................................................................................... 6 11.1 Magnetic Thresholds vs. TA .....................................................................................................................6 11.2 Magnetic Thresholds vs. VDD ...................................................................................................................6 11.3 Current Consumption vs. TA ....................................................................................................................6 11.4 Current Consumption vs. VDD ..................................................................................................................6 11.5 Consumption Period vs. TA ......................................................................................................................6 11.6 Consumption Period vs. VDD ....................................................................................................................6 11.7 Output Saturation Voltage vs. TA .............................................................................................................7 11.8 Output Switching Characteristics.............................................................................................................7 12 Application Information................................................................................................ 7 13 Standard information regarding manufacturability of Melexis products with different soldering processes........................................................................................... 8 14 ESD Precautions ........................................................................................................... 8 15 Package Information..................................................................................................... 9 15.1 SE Package (TSOT-3L)...........................................................................................................................9 15.2 LD Package (UTQFN-6L) ......................................................................................................................10 16 Disclaimer.................................................................................................................... 11 3901090248 Rev 012 Page 2 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 3 Glossary of Terms Gauss, milliTesla (mT), Units of magnetic flux density : 10 Gauss = 1mT 4 Absolute Maximum Ratings Parameter Symbol Supply Voltage (operating) VDD Supply Current IDD Output Voltage VOUT Output Current IOUT Operating Temperature Range TA Storage Temperature Range TS ESD Sensitivity (1) Table 1: Absolute maximum ratings Value 5 5 5 5 -40 to 85 -50 to 150 5000 Units V mA V mA °C °C V Note 1: Human Body Model according JESD22-A114 standard – 100pF capacitor discharged through 1.5kΩ resistor into each pin. Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. 5 Pin Definitions and Descriptions LD Package SE Package Pin Name Function Pin № (SE) VDD Power Supply 1 GND Ground 3 OUT Output (Open Drain) 2 NC Not Connected Table 2: Pin definitions and descriptions Pin № (LD) 2 3,4 5 1,6 Note : Exposed Pad on LD package is connected to ground 3901090248 Rev 012 Page 3 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 6 General Electrical Specifications o DC Operating Parameters TA = 25 C, VDD = 3V (unless otherwise specified) Parameter Supply Voltage Supply Current Output Current Output Saturation Voltage Awake Period Sleep Period Symbol VDD IDD IOUT VSAT TAW TSL Test Conditions Operating Average Min 2.5 Typ 3 10 Max 3.5 1 0.4 IOUT = 1mA Operating Operating 85 32 70 Units V µA mA V µs ms Table 3: Electrical specifications 7 Magnetic Specifications o DC Operating Parameters TA = 25 C, VDD = 3V (unless otherwise specified) Parameter Symbol Min Operating Point BOP Release Point BRP +/-0.5 Hysteresis BHYST Table 4: Magnetic specifications Typ Max +/-6 1 Units mT mT mT Note 2: For typical values, please refer to the performance graphs section 8 Outputs Behaviour vs. Magnetic Pole SE Package Parameter North or South pole “Zero” magnetic pole Test conditions B > |BOP| B < |BRP| LD Package OUT (SE) Low High OUT (LD) Low High Table 5: Outputs behaviour vs. magnetic pole Note : The magnetic pole is applied facing the branded side of the package 3901090248 Rev 012 Page 4 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 9 Detailed General Description The MLX90248 is originally used in mobile phone applications for open/close lid detection (slide and jackknife phone type). The goal of this detection is to switch on or off the application if the lid is opened or closed, in order to save battery power. The same operation principle can be simply applied to any other battery-powered device with a lid/cover like laptop, digital cameras and camcorders. By the use of a very high sensitivity Hall sensor, a very small and cheap magnet is enough to trigger the MLX90248, hence it can easily replace reed switch. The major benefit of using a Hall sensor is to provide “electronic” commutation, which is bounce-free, more reliable and with increased lifetime compared to usual mechanical contacts. 10 Unique Features The MLX90248 exhibits “Omnipolar” magnetic characteristics. It means the device reacts to both North and South magnetic pole. The purpose is to detect the presence of any magnetic field applied on the device. This mode of operation simplifies customer production processes by avoiding the need to detect the Hall sensor pole active on the magnet used in the application. Taking the example of a generic Hall sensor “south pole active”, during its production, the customer must detect the south pole of the application magnet and face it to the device to enable the output to be turned on and off. Without any magnet pole detection system, the incorrect magnetic pole (north in this example) could be faced to the device which would fail the application. Therefore, the “Omnipolar” magnetic behaviour helps customers by removing the need of magnet pole detection system during production phase. The “Micropower” feature makes the MLX90248 especially suitable for battery-powered device as it combines low voltage operation and low current consumption. By using a sleep/awake strategy managed internally, the power consumption is drastically reduced. To make a comparison, the MLX90248 consumes 100 times less power than the generic low voltage Melexis Hall sensor US3881. As well as Thin SOT package, the MLX90248 is now delivered in an ultra thin UTQFN package. This new 2 leadless package only requires 3mm PCB surface and is 0.43mm maximum thick, which is particularly important in design where space-saving and miniaturisation are the critical factors. 3901090248 Rev 012 Page 5 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 11 Performance Graphs 11.2 Magnetic Thresholds vs. VDD 6 6 4 4 Magnetic flux density (mT) Magnetic flux density (mT) 11.1 Magnetic Thresholds vs. TA 2 0 Bops Brps Bopn Brpn -2 -4 2 0 Bops Brps Bopn Brpn -2 -4 -6 -6 -40 -20 0 20 40 60 80 2.5 3 Ta (°C) 11.4 Current Consumption vs. VDD 12 12 10 10 Current Consumption Current Consumption 11.3 Current Consumption vs. TA 8 6 Iawake(mA) 4 Isleep(uA) 8 6 Iawake(mA) 4 Isleep(uA) Iaverage(uA) Iaverage(mA) 2 2 0 0 -40 -20 0 20 40 60 80 2.5 3 Ta (°C) 3.5 VDD (Volts) 11.5 Consumption Period vs. TA 11.6 Consumption Period vs. VDD 100 100 80 80 Consumption Period Consumption Period 3.5 VDD (Volts) Tawake(us) 60 Tsleep(ms) 40 20 Tawake(us) 60 Tsleep(ms) 40 20 0 0 -40 -20 0 20 40 60 80 2.5 Ta (°C) 3901090248 Rev 012 3 3.5 VDD (Volts) Page 6 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 11.7 Output Saturation Voltage vs. TA 11.8 Output Switching Characteristics 50 Vout (Vdd=2.5V) Output Saturation Voltage (mV) Vout (Vdd=3V) 40 Vout (Vdd=3.5V) 30 20 10 0 -40 -20 0 20 40 60 80 Ta (°C) 12 Application Information 100k VDD OUT 2.5~3.5V Output signal 10nF GND MLX90248 100pF Typical application 3901090248 Rev 012 Page 7 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 13 Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 14 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 3901090248 Rev 012 Page 8 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 15 Package Information 15.1 SE Package (TSOT-3L) 2.75 BSC 1.10 MAX 1.60 BSC 0.88 +0.02 - 0.03 SEATING PLANE see note 2 0.075 +0.025 - 0.050 Notes: 1. All dimensions are in millimeters 2. Outermost plastic extreme width does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.15mm per side. 3. Outermost plastic extreme length does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.25mm per side. 4. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead width dimension at maximum material condition. 5. Dimension is the length of terminal for soldering to a substrate. 0.50 BSC TOP VIEW 7. Formed lead shall be planar with respect to one another with 0.076mm at seating plane. SIDE VIEW 12° REF. TYP. 6. Dimension on SECTION B-B’ are apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. BASE METAL WITH PLATING Marking: Top side : 248D - Name of the Device (MLX90248) Bottom side : xyww 0.10 R. MIN. ~ 0.10 R. MIN. B’ SEATING PLANE 4°+/-4 x = last digit of lot number y = last digit of year ww = week 0.35 +0.05 - 0.10 B 0.40+/-0.10 0.30 0.45 see note 5 0.575 REF. SECTION B-B’ see note 6 END VIEW Hall plate location 1.43+/-0.05 Notes: 1. All dimensions are in millimeters 0.28 TYP END VIEW TOP VIEW 3901090248 Rev 012 Package line Page 9 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 15.2 LD Package (UTQFN-6L) 3901090248 Rev 012 Page 10 of 11 Data Sheet Sept/06 MLX90248 Micropower & Omnipolar Hall Switch 16 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2005 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: [email protected] America: Phone: +1 603 223 2362 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified 3901090248 Rev 012 Page 11 of 11 Data Sheet Sept/06