10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD Features Ultra Wide Band Driver Amplifier Self Bias Architecture 23.0 dB Small Signal Gain 5.0 dB Noise Figure 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010 Chip Device Layout General Description Mimix Broadband’s 10.0-40.0 GHz GaAs MMIC distributed amplifier has a small signal gain of 23.0 dB with a 5.0 dB noise figure. This MMIC uses Mimix Broadband’s 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for microwave, millimeter-wave wideband military and fiber optic applications. Absolute Maximum Ratings Supply Voltage (Vd) Supply Current (Id) Input Power (Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Channel Temperature (Tch) +6.0 VDC 270 mA +17.0 dBm -65 to +165 OC 1 -55 to MTTF Table 1 MTTF Table (1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life. Electrical Characteristics (Ambient Temperature T = 25 oC) Parameter Frequency Range (f ) Input Return Loss (S11) Output Return Loss (S22) Small Signal Gain (S21) Gain Flatness ( S21) Reverse Isolation (S12) Noise Figure (NF) Output Power for 1 dB Compression Point (P1dB)2 Drain Bias Voltage (Vd) Supply Current (Id) (Vd=5.0V) Units GHz dB dB dB dB dB dB dBm VDC mA Min. 10.0 - Typ. 7.0 10.0 23.0 +/-5.0 35.0 5.0 TBD +5.0 190 Max. 40.0 +5.5 230 (2) Measured using constant current. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 1 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD Distributed Amplifier Measurements XD1005-BD Vd=See Legend, Id=See Legend XD1005-BD Vd=See Legend, Id=See Legend 30 0 28 -10 26 Reverse Isolation (dB) 24 Gain (dB) 22 20 18 16 14 12 10 -20 -30 -40 -50 -60 8 6 -70 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Vd=3.0V, Id=160 mA Vd=4.0V, Id=180 mA Frequency (GHz) Vd=5.0V, Id=190 mA Vd=3.0V, Id=160 mA 0 -5 -5 -10 -15 -20 -25 -30 Vd=5.0V, Id=190 mA XD1005-BD Vd=See Legend, Id=See Legend 0 Output Return Loss (dB) Input Return Loss (dB) XD1005-BD Vd=See Legend, Id=See Legend Vd=4.0V, Id=180 mA -10 -15 -20 -25 -30 -35 -35 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Frequency (GHz) Vd=3.0V, Id=160 mA Vd=4.0V, Id=180 mA Vd=5.0V, Id=190 mA Vd=3.0V, Id=160 mA Vd=4.0V, Id=180 mA Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Vd=5.0V, Id=190 mA Page 2 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD S-Parameters Typcial S-Parameter Data for XD1005-BD Vd=5.0 V Id=190 mA Frequency (GHz) 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 22.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0 41.0 42.0 43.0 44.0 45.0 46.0 47.0 48.0 S11 (Mag) 0.229 0.310 0.406 0.440 0.379 0.317 0.280 0.362 0.435 0.520 0.607 0.588 0.461 0.234 0.234 0.142 0.089 0.106 0.150 0.214 0.296 0.393 0.420 0.457 0.458 0.437 0.401 0.363 0.268 0.204 0.127 0.200 0.352 0.370 0.451 0.595 0.675 0.775 0.778 0.774 0.808 S11 (Ang) -83.96 -88.30 -100.44 -121.85 -139.89 -143.44 -133.61 -127.07 -138.34 -144.03 -160.43 173.99 155.28 136.17 136.17 125.24 168.47 -146.20 -124.03 -128.89 -131.04 -140.68 -150.70 -161.65 -172.99 -179.67 167.51 161.69 156.71 156.55 -176.88 -129.17 -131.82 -137.25 -145.14 -141.13 -147.50 -160.69 -167.31 -178.03 178.27 S21 (Mag) 2.929 5.960 10.441 15.181 17.935 19.100 20.311 23.466 25.765 26.953 27.000 23.854 20.012 17.650 17.650 17.767 19.269 19.359 19.244 18.747 18.278 17.353 14.807 12.855 11.054 9.745 9.002 8.918 9.090 9.480 10.075 11.745 13.740 15.643 13.989 9.541 6.009 3.840 2.831 2.641 1.502 S21 (Ang) -51.89 -92.15 -135.42 174.05 120.94 82.07 48.64 11.34 -26.27 -61.57 -102.19 -139.22 -167.08 145.59 145.59 121.84 90.92 62.94 35.51 2.26 -27.68 -59.53 -91.79 -119.72 -143.16 -167.65 171.27 150.19 124.67 99.17 72.86 38.81 1.69 -44.34 -112.77 -166.65 151.20 108.37 70.96 24.25 -109.87 S12 (Mag) 0.0019 0.0019 0.0035 0.0040 0.0049 0.0053 0.0065 0.0070 0.0051 0.0070 0.0093 0.0102 0.0103 0.0079 0.0079 0.0088 0.0067 0.0074 0.0089 0.0088 0.0107 0.0134 0.0139 0.0135 0.0128 0.0111 0.0109 0.0118 0.0092 0.0095 0.0076 0.0057 0.0072 0.0023 0.0056 0.0037 0.0065 0.0051 0.0041 0.0088 0.0058 S12 (Ang) -114.33 -120.63 -124.92 -156.95 -161.77 -169.88 173.66 159.80 148.04 159.39 160.45 134.55 116.80 105.99 105.99 113.91 105.04 104.90 113.90 105.69 98.23 103.20 86.31 80.27 72.20 69.61 65.22 61.78 52.31 40.42 45.83 41.02 39.04 31.66 117.47 94.03 41.31 59.54 163.29 72.02 149.40 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com S22 (Mag) 0.670 0.610 0.525 0.435 0.372 0.332 0.273 0.262 0.279 0.257 0.300 0.327 0.264 0.110 0.110 0.053 0.108 0.138 0.156 0.181 0.198 0.220 0.175 0.194 0.208 0.241 0.260 0.284 0.323 0.361 0.379 0.452 0.567 0.718 0.794 0.715 0.650 0.613 0.595 0.519 0.393 S22 (Ang) -140.06 -155.98 -168.07 -177.18 178.85 175.41 173.60 -179.08 173.60 179.61 -179.24 158.69 140.31 127.32 127.32 125.91 -160.48 -156.23 -151.63 -163.96 -171.06 -172.46 -173.03 -168.95 -165.06 -168.28 -174.00 -176.84 174.07 163.77 151.09 134.42 109.82 70.75 14.99 -31.34 -61.13 -85.62 -106.75 -138.36 -43.29 Page 3 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD Mechanical Drawing 1.250 (0.049) 1.070 (0.042) 1 2 0.406 (0.016) 3 0.0 0.820 (0.032) 0.0 1.500 (0.059) (Note: Engineering designator is 22DSBA0423) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.163 mg Bond Pad #1 (RF In) Bond Pad #2 (RF Out) Bond Pad #3 (Vd) Bias Arrangement RF In 1 Bypass Capacitors - See App Note [2] 2 RF Out 3 Vd Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 4 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD App Note [1] Biasing – As shown in the bonding diagram, this device operates using a self-biased architecture and only requires one drain bias. Bias is nominally Vd=5V, Id=190 mA. App Note [2] Bias Arrangement - Each DC pad (Vd) needs to have DC bypass capacitance (~100-200 pF) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended. MTTF Graphs These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating foundry. XD1005-BD Vd=5.0 V Id=175 mA 1.00E+04 1.00E+08 1.00E+03 FITS MTTF (hours) XD1005-BD Vd=5.0 V Id=175 mA 1.00E+09 1.00E+07 1.00E+02 1.00E+01 1.00E+06 1.00E+00 1.00E+05 55 65 75 85 95 105 115 55 125 65 75 95 105 115 125 XD1005-BD Vd=5.0 V Id=175 mA XD1005-BD Vd=5.0 V Id=175 mA 76 200 75 74 190 73 72 180 71 70 170 Tch (deg C) Rth (deg C/W) 85 Backplate Temperature (deg C) Backplate Temperature (deg C) 69 68 67 66 160 150 140 65 64 130 63 62 120 110 61 60 100 55 65 75 85 95 105 Backplate Temperature (deg C) 115 125 55 65 75 85 95 105 115 125 Backplate Temperature (deg C) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 5 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 10.0-40.0 GHz GaAs MMIC Distributed Amplifier January 2007 - Rev 16-Jan-07 D1005-BD Handling and Assembly Information CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. he gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 ºC (Note: Gold Germanium should be avoided). The work station temperature should be 310 ºC +/- 10 ºC. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. Part Number for Ordering Description XD1005-BD-000V XD1005-BD-EV1 RoHS compliant die packed in vacuum release gel packs XD1005-BD evaluation module Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 6 of 6 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.