PDSP16256/A Programmable FIR Filter Supersedes version DS3709 5.1 January 1998 The PDSP16256 contains sixteen multiplier accumulators, which can be multi cycled to provide from 16 to 128 stages of digital filtering. Input data and coefficients are both represented by 16-bit two’s complement numbers with coefficients converted internally to 12 bits and the results being accumulated up to 32 bits. In 16-tap mode the device samples data at the system clock rate of up to 25MHz. If a lower sample rate is acceptable then the number of stages can be increased in powers of two up to a maximum of 128. Each time the number of stages is doubled, the sample clock rate must be halved with respect to the system clock. With 128 stages the sample clock is therefore one eighth of the system clock. In all speed modes devices can be cascaded to provide filters of any length, only limited by the possibility of accumulator overflow. The 32-bit results are passed between cascaded devices without any intermediate scaling and subsequent loss of precision. The device can be configured as either one long filter or two separate filters with half the number of taps in each. Both networks can have independent inputs and outputs. Both single and cascaded devices can be operated in decimate-by-two mode. The output rate is then half the input rate, but twice the number of stages are possible at a given sample rate. A single device with a 20MHz clock would then, for example, provide a 128-stage low pass filter, with a 5MHz input rate and 2·5MHz output rate. Coefficients are stored internally and can be down loaded from a host system or an EPROM. The latter requires no additional support, and is used in stand alone applications. A full set of coefficients is then automatically loaded at power on, or at the request of the system. A single EPROM can be used to provide coefficients for up to 16 devices. DS3709 - 6.0 August 1998 EPROM ADDR DATA RES PDSP 16256 INPUT DATA APPLICATIONS ■ High Performance Digital Filters ■ Pulse Compression for Radar and Sonar ■ Matrix Multiplication ■ Correlation OUTPUT DATA EPROM SCLK GND Fig. 1 A dual filter application EPROM ADDR DATA CHANGE COEFF POWER-ON RESET RES COEFFICIENTS PDSP 16256 ANALOG INPUT OUTPUT DATA ADC EPROM CLKOP FEATURES ■ Sixteen MACs in a Single Device ■ Basic Mode is 16-Tap Filter at up to 25MHz Sample Rates ■ Programmable to give up to 128 Taps with Sampling Rates Proportionally Reducing to 3·125MHz ■ 16-bit Data and 32-bit Accumulators ■ Can be configured as One Long Filter or Two HalfLength Filters ■ Decimate-by-two Option will Double the Filter Length ■ Coefficients supplied from Host System or local EPROM CHANGE COEFF POWER-ON RESET SCLK GND Fig. 2 Typical system application ASSOCIATED PRODUCTS PDSP16350 I/Q Splitter/NCO PDSP16510A FFT Processor ORDERING INFORMATION Commercial (0°C to 170°C) PDSP16256A/C0/AC 25MHz, PGA package Industrial (240°C to 185°C) PDSP16256 B0/AC 20MHz, PGA package PDSP16256 B0/GC 20MHz, QFP package Military (255°C to 1125°C) PDSP16256 MA/ACBR 20MHz, MIL-STD-883* (latest revision), PGA package PDSP16256 MA/GCPR 20MHz, MIL-STD-883* (latest revision), QFP package *See notes following Electrical Characteristics for further information on MIL-STD-883 screening PDSP16256 Description Signal DA15:0 16-bit data input bus to Network A. DB15:0 Delayed data output bus in the single filter mode. Connected to the data input bus of the next device in a cascaded chain. Input to Network B in the dual filter modes. X31:0 Expansion input bus in the single filter mode. Connected to the previous filter output in a cascaded chain. The inputs are not used on a single device system or on the Termination device in a cascaded chain. The X bus provides the output from Network B in both dual modes. F31:0 In single filter mode this bus holds the main device output. In dual mode it holds the output from Network A. FEN Filter enable. The first high present on an SCLK rising edge defines the first data sample. The signal must stay active whilst valid data is being received and must be low if FRUN is high. DFEN Delayed filter enable. This output is connected to the Filter Enable input of the next device in a cascaded chain when moving towards the termination device and with multiple stand-alone EPROM-loaded configurations. It is used to coordinate the control logic within each device. SWAP Selects either the upper or lower set of coefficients for Bank Swap. A low selects the lower bank, a high the upper bank. FRUN In EPROM load mode, when high this signal allows continuous filter operations to occur without the need for the initial FEN edge. If the device is not a single, interface or master device then this pin must be tied low. DCLR A low on this signal on the SCLK rising edge will clear all the internal accumulators. DCLR need only remain low for a single cycle, signal BUSY will indicate when the internal clearing is complete. After a clear the device must be re-synchronised to the data stream using FEN. It is recommended that FEN is taken low at the same time as clear. FEN may then be taken high to synchronise the data stream once BUSY has returned low. C15:0 16-bit coefficient input bus. In the Byte mode of operation, C15:8 have alternative uses as explained in the text. A7:0 Coefficient address bus. In the EPROM mode A7:0 are address outputs for an EPROM. In the remote host mode they are inputs from the host. A7 is not used when coefficients are loaded as 16-bit words. CCS This pin is similar in operation to A7:0 and provides a higher order address bit. When low the coefficients are loaded, when high the control register is loaded. WEN In the remote mode this pin is an input which when low enables the load operation. In the EPROM mode it is an output which provides the write enable for other slave devices. CS This pin is always an input and must also be low for the internal write operation to occur. BYTE When this pin is tied low, coefficients are loaded as two 8-bit bytes. When the pin is high they are loaded as 16-bit words. In the EPROM mode this pin is ignored. EPROM When this pin is tied low coefficients are loaded as bytes from an external EPROM. The device outputs an address on A7:0. When the pin is high coefficients must be loaded from a remote master. They can then be transferred individually rather than as a complete set. SCLK The main system clock; all operations are synchronous with this clock. The clock rate must be either 1, 2, 4, or 8 times the required data sampling rate. The factor used depends on the required filter length. CLKOP This output, when used to enable SCLK, can provide a data sampling clock. It has the effect of dividing the SCLK rate by 1, 2, 4 or 8 depending on the filter mode selected. OEN Tri-state enable for the F bus. When high the outputs will be high impedance. OEN is registered onto the device and does not therefore take effect until the first SCLK rising edge BUSY A high on this signal indicates that the device is completing internal operations and is not yet able to accept new data. The signal is used during automatic EPROM loading, reset and accumulator clearing. RES When this pin is low the control logic and accumulators are reset. In the EPROM mode it will initiate a load sequence when it goes high. NOTES 1. Unused buses (e.g. X31:0 when the device is configured in single or termination mode) can be set to any value. They should however be maintained at a valid logic level to avoid an increase in power consumption. 2. To ensure correct input voltage thresholds are maintained all the VDD and GND pins must be connected to adequate power and ground planes. Table 1 Pin descriptions 2 PDSP16256 R P N M L K J H G EXTRA PIN D4, CONNECTED TO D3 F E D C B A AC144 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Fig. 3a Pin connections for 144 pin PGA package (bottom view) PIN 1 INDEX PIN 1 PIN 172 GC172 Fig. 3b Pin connections for 172 pin QFP (top view) Fig. 3 Pin connection diagrams (not to scale). See Table 1 for signal descriptions and Table 2 for pinouts. 3 PDSP16256 GG AC Signal GG AC Signal GG AC Signal GG AC Signal 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 A15 B15 D13 C14 G15 C15 D14 J15 E13 D15 E14 E15 F13 F14 F15 G14 G13 H14 H15 H13 J14 K15 J13 K14 L15 K13 L14 M15 L13 M14 N15 N14 M13 P15 P14 N13 R15 F0 F1 F2 F3 VDD F4 F5 GND F6 F7 F8 F9 F10 F11 F12 GND F13 F14 F15 VDD F16 F17 F18 F19 VDD F20 F21 GND F22 F23 F24 F25 F26 F27 F28 GND F29 F30 F31 VDD FEN DFEN 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 R14 N12 P13 R13 P12 N11 R12 P11 R11 R9 N10 P10 R10 P9 R7 N9 P8 R8 N8 P7 R6 N7 P6 R5 N6 P5 R4 N5 P4 R3 P3 N4 R2 P2 N3 R1 SWAP GND 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 P1 N2 N1 M2 L3 M1 M3 L2 L1 K3 K2 K1 J2 J3 G1 H2 H1 J1 H3 G2 F1 G3 F2 E1 F3 E2 D1 E3 D2 C1 C2 D3 B1 B2 C3 - C15 GND GND 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 A1 A2 C4 B3 A3 B4 C5 A4 B5 A5 A7 C6 B6 A6 B7 C7 B8 A9 A8 C8 B9 A10 C9 B10 A11 C10 B11 A12 C11 B12 A13 B13 C12 A14 B14 C13 GND BUSY X0 VDD X1 X2 X3 X4 X5 X6 GND X7 X8 VDD X9 X10 X11 X12 X13 X14 GND X15 X16 X17 X18 X19 X20 X21 X22 GND X23 X24 X25 VDD X26 X27 X28 X29 X30 GND X31 VDD FRUN DCLR OEN CLKOP VDD DA0 DA1 DA2 DA3 DA4 DA5 GND DA6 DA7 DA8 DA9 VDD DA10 DA11 DA12 DA13 DA14 DA15 GND C0 C1 C2 C3 C4 C5 VDD C6 C7 C8 C9 C10 GND C11 C12 C13 VDD GND C14 WEN CCS CS VDD RES SLCK GND VDD BYTE EPROM A0 A1 A2 A3 A4 VDD A5 A6 GND A7 DB0 DB1 DB2 GND DB3 DB4 DB5 DB6 DB7 VDD DB8 DB9 DB10 DB11 DB12 DB13 DB14 GND DB15 VDD NOTE. All GND and VDD pins must be used Table 2 Pin connections for AC144 and GC172 packages 4 PDSP16256 DA15:0 SCLK F31:0 OEN FRUN SWAP NETWORK A A7:0 C15:0 CCS WEN CS BYTE DUAL MODE COEFFICIENT STORAGE AND CONTROL MUX EPROM FEN NETWORK B DFEN DCLR RES SINGLE MODE CLKOP BUSY DB15:0 X31:0 Fig. 4 Block Diagram OPERATIONAL OVERVIEW The PDSP16256 is an application specific FIR filter for use in high performance digital signal processing systems. Sampling rates can be up to 25MHz. The device provides the filter function without any software development, and the options are simply selected by loading a control register. The device can be user configured as either a single filter, or as two separate filters. The latter can provide two independent filters for the in-phase and quadrature channels after IQ splitting, or can provide two filters in cascade for greater stop band rejection. The device operates from a system clock, with rates up to 25MHz. This clock must be 1, 2, 4, or 8 times the required sampling frequency, with the higher multiplication rates producing longer filter networks at the expense of lower sampling rates. Devices can be connected in cascade to produce longer filter lengths. This can be accomplished without the need for any additional external data delays, and all the single device options remain available. Continuous inputs are accepted, and continuous results produced after the internal pipeline delay. Connection can be made directly to an A-D converter. The filter operation can be synchronised to a Filter Enable signal (FEN) whose positive going edge marks the first data sample. The internal multiplier accumulator array can be cleared with a dedicated input. This is necessary if erroneous results obtained during the normal data ‘flush through’ are not permissible in the system. Coefficients can be loaded from a host system using a conventional peripheral interface and separate data bus. Alternatively, they can be loaded as a complete set from a byte wide EPROM. The device produces addresses for the EPROM and a BUSY output indicates that the transfer is occurring. Up to sixteen devices can have their coefficients supplied from a single EPROM. These devices need not necessarily be part of the same filter network. Each of the filter networks shown in Fig. 4 contains eight systolic multiplier accumulator stages; an example with four stages is shown in Fig. 5. Input data flows through the delay lines and is presented for multiplication with the required coefficient. This is added to either the last result from this accumulator or the result from the previous accumulator. The filter results progress along the adders at the data sample rate. If the sample rate equals SCLK divided by four, for example, then the accumulated result is passed onto the next stage every fourth cycle. The structure described is highly efficient when used to calculate filtered results from continuous input data. A comprehensive digital filter design program is available for PC compatible machines. This will optimise the filter coefficients for the filter type required and number of taps available at the selected sample rate within the PDSP16256 device. An EPROM file can be automatically generated in Motorola S-record format. 5 PDSP16256 DATA OUT DATA DELAY LINE DATA DELAY LINE COEFF RAM DATA DELAY LINE COEFF RAM DATA IN DATA DELAY LINE COEFF RAM COEFF RAM ACCUMULATE EXPANSION IN RESULT OUT ADDER ADDER ADDER ADDER Z21 Z21 Z21 Z21 Fig. 5 Filter network diagram SINGLE FILTER OPTIONS When operating as a single filter the device accepts data on the 16-bit DA bus at the selected sample rate, see Figs. 5 and 6. Results are presented on the 32-bit F bus, which may be tristated using the OEN input. Signal OEN is registered onto the device and does not therefore take effect until the first SCLK rising edge. Devices may be cascaded this allows filters with more taps than available from a single device. To accomplish this two further buses are utilised. The DB bus presents the input data to the next device in cascade after the appropriate delay, while, partial results are accepted on the X bus. Single filter mode is selected by setting control register bit 15 to a one. The required filter length is then selected using control register bits 14 and 13 as summarised in Table 3. The options define the number of times each multiplier accumulator is used per sample clock period. This can be once, twice, four times, or eight times. In addition a normal/decimate bit (CR12) allows the filter length to be doubled at any sample rate. This is possible when the filter coefficients are selected to produce a low pass filter, since the filtered output would then not contain the higher frequency components present in the input. The Nyquist criterion, specifying that the sampling rate must be at least double the highest frequency component, can still then be satisfied even though the sampling rate has been halved. CR 14 13 12 0 0 0 0 1 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 Input Rate Output Rate Filter Length Setup Latency SCLK SCLK SCLK/2 SCLK/2 SCLK/4 SCLK/4 SCLK/8 SCLK SCLK/2 SCLK/2 SCLK/4 SCLK/4 SCLK/8 SCLK/8 16 Taps 32 Taps 32 Taps 64 Taps 64 Taps 128 Taps 128 Taps 16 17 16 18 20 24 24 Table 3 Single Filter options 6 The system clock latency for a single device is shown in Table 3. This is defined as the delay from a particular data sample being available on the input pins to the first result including that input appearing on the output pins. It does not include the delay needed to gather N samples, for an N tap filter, before a mathematically correct result is obtained. DA15:0 F31:0 OEN NETWORK A DUAL MODE MUX NETWORK B SINGLE MODE DB15:0 X31:0 Fig. 6 Single Filter bus utilisation PDSP16256 SPEED MODE 0 (Data input and output at fSCLK) CR14:13 = 00, CR12 = 0. CLKOP held high. SCLK 1 2 3 A B C 16 17 31 18 32 33 34 35 FEN DA15:0 F31:0 A′ B′ A′′ C′ B′′ C′′ D′′ E′′ CLKOP First data point (A) is read on edge 1 First valid result including data point (A) available after edge 16 Valid result contains the first 16 data points available after edge 31 SPEED MODE 1 (Data input and output at half fSCLK) CR14:13 = 01, CR12 = 0 SCLK 1 2 3 16 17 78 18 79 80 81 82 FEN DA15:0 A B F31:0 A′ A′′ B′ B′′ C′′ CLKOP First data point (A) is read on edge 1 First valid result including data point (A) available after edge 16 Valid result contains the first 32 data points available after edge 78 SPEED MODE 2 (Data input and output at a quarter fSCLK) CR14:13 = 10, CR12 = 0 SCLK 1 2 3 4 5 20 21 22 23 272 273 274 275 276 24 FEN DA15:0 A B F31:0 A′ B′ A′′ B′′ CLKOP First data point (A) is read on edge 1 First valid result including data point (A) available after edge 20 Valid result contains the first 64 data points available after edge 272 SPEED MODE 3 (Data input and output at an eighth fSCLK) CR14:13 = 11, CR12 = 0 SCLK 1 2 3 4 5 6 7 8 9 24 25 26 27 29 28 30 31 1040 1041 1042 1043 32 FEN DA15:0 A B F31:0 A′ B′ A′′ CLKOP First data point (A) is read on edge 1 First valid result including data point (A) available after edge 24 Valid result contains the first 128 data points available after edge 1040 SPEED MODE 1 Decimating (Data input at half fSCLK and output at a quarter fSCLK) CR14:13 = 01, CR12 = 1. SCLK 1 2 3 18 19 20 21 22 142 143 144 145 FEN DA15:0 A B F31:0 B′ B′′ CLKOP First data point (A) is read on edge 1 First valid result including data point (A) available after edge 18 Valid result contains the first 64 data points available after edge 142 Fig. 7 Single Filter timing diagrams 7 PDSP16256 DUAL INDEPENDENT FILTER OPTIONS When operating as two independent filters the device accepts 16 bit data on both the DA and DB buses at the selected sample rate, see Fig. 8. Results are available from both the F and X buses. The F bus may be tristated using the OEN input. Signal OEN is registered onto the device and does not therefore take effect until the first SCLK rising edge Each filter must be configured in the same manner, and multiple device expansion is not possible due to the pin reorganization. The latter requirement can, of course, still be satisfied by several devices configured as single filters. Dual independent filter mode is selected by setting control register bits 15 and 4 to a zero. The required filter length is selected using control register bits 14 and 13 as summarised in Table 4, which also shows the resulting latency. As in single filter mode normal or decimate-by-two operation can be selected using control register bit 12. CR 14 13 12 0 0 0 0 1 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 Input Rate Output Rate Filter Length SCLK SCLK SCLK/2 SCLK/2 SCLK/4 SCLK/4 SCLK/8 SCLK SCLK/2 SCLK/2 SCLK/4 SCLK/4 SCLK/8 SCLK/8 8 Taps 16 Taps 16 Taps 32 Taps 32 Taps 64 Taps 64 Taps Setup Latency Ind Cas 16 17 16 18 20 24 24 27 28 36 40 DUAL CASCADED FILTER OPTIONS When operating as two cascaded filters the device accepts 16 bit data on the DA bus at the selected sample rate. Results are presented on the 32-bit X bus, see Fig. 9. Each filter must be configured in the same manner. Multiple device expansion is not possible in this mode. Dual cascaded filter mode is selected by setting control register bit 15 to a zero and bit 4 to a one. The required filter length is selected using control register bits 14 and 13 as summarised in Table 4, which also shows the resulting latency. The decimate-by-two option is not available in this mode. The data for the second filter network is extracted as the middle 16 bits from the first networks accumulated result. For successful operation the first filter network must have unity gain. See the section on filter accuracy for more details. The cascade option is used to increase the stop band rejection in a practical filter application. Theoretically, increasing the number of taps in an FIR filter will increase the stop band rejection, but this assumes floating point calculations with no accuracy limitations. In practice, with fixed point arithmetic, better performance is achieved with two smaller filters in series. Table 4. Dual Filter options DA15:0 F31:0 OEN NETWORK A DA15:0 F31:0 NETWORK A DUAL MODE MUX MUX NETWORK B SINGLE MODE SINGLE MODE X31:0 Fig. 8 Dual independent filter bus utilisation 8 DUAL MODE NETWORK B DB15:0 OEN DB15:0 X31:0 Fig. 9 Dual cascaded filter bus utilisation PDSP16256 FILTER ACCURACY Input data and coefficients are both represented by 16-bit two’s complement numbers. The coefficients are converted to twelve bits by rounding towards zero. This is achieved as follows. If the coefficient is positive then the least significant 4 bits are discarded. If the coefficient is negative then the logical ‘OR’ of the least significant 4 bits are added to the remainder of the word. Twelve bit coefficients can be used directly provided the least significant four bits are set to zero. The FIR filter results are calculated using a multiplier accumulator structure as shown in Fig. 10. The truncation and word growth allowed for in the data path are explained in Fig. 10. The 16-bit data and 12-bit coefficient inputs (each with one sign bit before the binary point), are presented to the multiplier. This produces a 28-bit result with two bits before the binary point. Producing the full 28-bit result ensures that if both the data and coefficients are set to logic 1 a valid result is generated. Prior to entering the accumulator the least significant 4 bits of the multiplier result are truncated and the resulting 24 bits sign extended to 32 bits. The final accumulator result is 32 bits with 10 bits before the binary point. Thus 9 bits of word growth are allowed within the accumulator. All accumulator bits are made available on the output pins. In cascade mode the middle 16 bits from the network A accumulator are fed round to the network B data inputs, see Fig. 11. INPUT DATA COEFFICIENT INPUT DATA COEFFICIENT ADDER ACCUMULATOR RESULT Fig. 10 Multiplier Accumulator S -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 S -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 Multiplication producing a 28-bit result MULTIPLIER RESULT S S S S S 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -22 -23 -24 -25 -26 Sign extended to 32 bits, least significant 4 bits truncated ACCUMULATOR RESULT S S S S S 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -22 3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -22 S 8 7 6 5 4 ACCUMULATOR RESULT These bits are passed to filter network B during cascade mode Fig. 11 Filter accuracy 9 PDSP16256 CASCADING DEVICES When the filter requirements are beyond the capabilities of a single device, it is possible to connect several devices in cascade increasing the number of taps available at the required sample rate. Within each device all filter length, decimate, and bank swap options are still possible, but each device in the chain must be similarly programmed and configured as a single filter. The number of devices which can be cascaded is only limited by the possibility of overflow in the 32-bit intermediate accumulations. If more than sixteen devices are cascaded in auto EPROM load mode, then an additional EPROM will be needed. In modes where the data sample rate does not equal the clock rate. Then the cascade arrangement shown in Fig. 12 is used. Delayed data is passed from device to device in one direction, while intermediate results flow in the opposite direction. The interface device both accepts the input data and produces the final result. It is not necessary for each device to know its exact position in the chain, but the device which receives the input data and produces the final result must be identified, as must the device which terminates the chain. The former is known as the Interface device and the latter as the Termination device, all others are Intermediate devices. Control Register bits CR11:10 are used to define these positions as shown in Table 6. The control logic in each of the devices must be synchronised with respect to the Interface device. This is achieved by connecting the Delayed Filter Enable output (DFEN) to the Filter Enable input (FEN) of the next device in the chain. The Interface device, itself, needs a FEN signal produced by the system, unless in EPROM mode, where FRUN may be pulled DATA IN FEN RESULTS OUT DA15:0 FEN F31:0 INTERFACE DEVICE high. Even when the latter is true, the FEN connection must be made between the remaining devices in the chain. By effectively extending the filter length, the cascade latency is therefore the same as for the single device in the same mode. Once the pipeline is initially flushed the latency is as given in Table 3. When devices are cascaded such that the data sample rate equals the clock rate, (Control register bits 14:13 = 00), then a different cascade configuration must be used. This is shown in Fig. 13. The number of devices that can be cascaded is, again, only limited by the 32-bit accumulators. In this mode the delayed data is passed from device to device in the same direction as the intermediate results. The device which accepts the input data is now at the opposite end of the chain to the device which produces the final result. The control logic in each of the devices must be synchronised this is achieved by connecting all the device FEN inputs to the global FEN. The cascade latency for the complete filter is built up from the 12 delays from the termination device, 8 delays from the interface device and additional intermediate devices each adding 4 delays. AVAILABLE OPTIONS No more than 128 coefficients can be stored internally. This limits the filter length / decimate / bank swap options to those which do not require more than that number of coefficients. Thus when a filter with 128 taps is to be implemented in a single device, it is not possible to decimate or bank swap. When a filter with 64 taps is implemented, decimate or bank swap are possible, but not both. With all other filter lengths, all decimate and bank swap configurations are possible. RESULTS OUT DB15:0 FEN F31:0 INTERFACE DEVICE DB15:0 DFEN X31:0 DA15:0 DFEN X31:0 DA15:0 FEN F31:0 DB15:0 FEN F31:0 INTERMEDIATE DEVICE INTERMEDIATE DEVICE DB15:0 DFEN X31:0 DA15:0 DFEN X31:0 DA15:0 FEN F31:0 DB15:0 FEN F31:0 TERMINATION DEVICE DB15:0 DFEN X31:0 FEN TERMINATION DEVICE DA15:0 DFEN X31:0 DATA IN Fig. 12 Three-device cascaded system 10 Fig. 13 Full speed cascaded system PDSP16256 128 TAP 127 64 TAP 32 TAP 127 127 UPPER BANK 16 TAP 127 NOT USED NOT USED NO SWAP POSSIBLE 64 63 64 63 UPPER BANK LOWER BANK 32 31 32 31 LOWER BANK 0 0 0 16 15 0 UPPER BANK LOWER BANK (a) Single Filters 64 TAP 32 TAP 16 TAP 127 127 127 FILTER B NO SWAP POSSIBLE 8 TAP 127 B UPPER BANK 96 95 NOT USED A UPPER BANK 64 63 NOT USED 64 63 64 63 B UPPER FILTER A NO SWAP POSSIBLE B LOWER BANK 48 47 32 31 B LOWER A LOWER BANK 0 A UPPER 32 31 32 31 16 15 A LOWER 0 0 0 B UPPER A UPPER B LOWER A LOWER (b) Dual Filters Fig. 14 Coefficient memory map FILTER CONTROL Two control modes are available selected by input signal FRUN. In EPROM load mode, when FRUN is tied high the device will commence operation once the coefficients have been loaded. The CLKOP signal indicates when new input data is required and that new results are available, see Fig. 7. In both EPROM and remote master load modes, when FRUN is tied low filter operation will not commence until a high has been detected on signal FEN. This mode allows synchronisation to an existing data stream. FEN should be taken high when the first valid data sample is available so that both are read into the device on the next SCLK rising edge. During device reset RES must be held low for a minimum of 16 SCLK cycles. After a reset the control register returns to its default state of 8C80 HEX. This places the device into the following mode : ● Single filter ● Sample rate equal to the clock rate ● Non-decimating ● A single device (Not in a cascade chain) ● Bank swap selected by bit in the control register COEFFICIENT BANK SWAP A Bank Swap feature is provided which allows all coefficients to be simultaneously replaced with a different set. A bit in the Control Register (CR7) allows the swap to be controlled by either input signal SWAP or Control Register bit (CR6). The latter is useful if the device is controlled by a microprocessor, when driving a separate pin would entail additional address decoding logic and an external latch. If SWAP or bit CR6 is low, the coefficients used will be those loaded into the lower banks illustrated in Fig. 14. When the SWAP or CR6 is high, the upper banks are used. The actual swap will occur when the next sampling clock active going transition occurs. This can be up to seven system clocks later than the swap transition, and is filter length dependent. The first valid filtered output will then occur after the pipeline latencies given in Tables 3 and 4. LOADING COEFFICIENTS When the device is to operate in a stand alone application then the coefficients can be down loaded as a complete set from a previously programmed EPROM. Alternatively if the 11 PDSP16256 system contains a microprocessor they can be individually transferred from a remote master under software control. In any mode the system clock must be present and stable during the transfer, and the addressing scheme is such that the least significant address specifies the coefficient applied to the first multiplier seen by incoming data. The addresses used during the load operation are those illustrated in Fig. 15. The Control Register is loaded when CCS is high. In byte mode address A0 is used to select the portion of control register loaded, otherwise the address bits are redundant. When an EPROM is used to provide coefficients, this redundancy causes the number of locations needed for any device to be double that for the coefficients alone. AUTO EPROM LOAD When EPROM is tied low, the PDSP16256 assumes the role of a master device in the system and controls the loading of coefficients from an external EPROM, see Fig.15. A load sequence commences when the RES input goes high, and will continue until every coefficient has been loaded. BUSY goes high to indicate that a load sequence is occurring and the filter output is invalid. The device will not commence a filter operation until the FEN edge is received after BUSY has gone low. This requirement can be avoided if FRUN is tied high. The address bus pins become outputs on the Master device, and produce a new address every four system clock periods. This four clock interval, minus output delays and the data set up time, defines the available EPROM access time. The coefficients are always loaded as bytes. The state of the BYTE pin on the master device is ignored. This arrangement also allows the eight most significant coefficient bus pins (C15:8) to be used for other purposes as described later. Since the 16-bit coefficients are loaded in two bytes the A0 pin specifies the required byte. The maximum number of stored coefficients is 128, eight address outputs are therefore provided for the EPROM. These eight outputs from the Master must also drive the address inputs on the slave devices. SCLK 00 A7:0 01 00 01 VALID ADDR LOAD MASTER CONTROL LOAD FIRST COEFFICIENT REGISTER 00 VALID ADDR LOAD LAST COEFFICIENT CCS RES BUSY Fig. 15a EPROM load sequence SCLK A7:0 FE FF 00 01 00 01 FE FF 00 01 00 01 CCS C15:12 0000 LOAD LAST MASTER COEFFICIENT 0001 LOAD SLAVE 1 CONTROL REGISTER 0001 LOAD SLAVE 1 COEFFICIENTS LOAD LAST SLAVE 1 COEFFICIENT Fig. 15b EPROM load sequence for a cascaded system Fig. 15 EPROM load sequence timing diagrams 12 0010 LOAD SLAVE 2 CONTROL REGISTER LOAD SLAVE 2 COEFFICIENTS PDSP16256 PDSP16256 EPROM LSB ADDRESS MSB A7:0 DATA C7:0 C11:8 (2 SLAVES) 0010 CS GND EPROM GND BYTE GND CCS MASTER C15:12 WEN PDSP16256 C11:8 0001 CS GND A7:0 CCS SLAVE 1 EPROM C15:12 BYTE VDD GND C7:0 WEN PDSP16256 C11:8 0010 CS GND A7:0 CCS SLAVE 2 EPROM C15:12 BYTE VDD GND C7:0 WEN Fig. 16 Three device auto EPROM load When the filter length is less than the maximum, the PDSP16256 will only transfer the correct number of coefficients, and one or more significant address bits will remain low. Sufficient coefficients are always loaded to allow for a possible Bank Swap to occur, and the EPROM allocation must allow for this even if the feature is not to be used. Table 5 shows the number of coefficients loaded for each of the modes. If several devices are cascaded, only one device assumes the role of the Master by having its EPROM pin grounded. It produces a WEN signal for the other devices, plus four higher order address outputs on C15:12, see Fig. 16. The extra address bits on C15:12 define separate areas of EPROM, containing coefficients for up to fifteen additional devices. The least significant block of memory must always be allocated to the Master device. The additional devices need not in practice be all part of the same cascaded chain, but can consist of several independent filters. They must, however, all have their BYTE pins tied low. FRUN can still be used to start these independent filters after all the devices have been loaded. In this case, however, each slave FEN pin should be driven by DFEN from the master device. When one EPROM is supplying information for several devices, some means of selectively enabling each additional device must be provided. This is achieved by using the C11:8 pins on the slave devices as binary coded inputs to define one to fifteen extra devices. These coded inputs always corre- spond to the block address used for the segment of EPROM allocated to that device. Code ‘all zeros’ must not be used since the Master device has implied use of the bottom segment. This is necessary since the C11:8 pins are alternatively used on the Master device to define the number of devices supported by the EPROM. In addition to providing the most significant addresses to the EPROM, the C15:12 address outputs from the master device must also drive the C15:12 inputs on the slave devices. These C15:12 inputs are internally compared to the C11:8 inputs to decide if that device is currently to be loaded. This approach avoids the need for external decoders and makes the CS input redundant. This input, however, must be tied low on every device in an EPROM supported system. The Control Coefficient pin (CCS) is used to define when the control register is to be loaded. It becomes an output on the Master device which provides an EPROM address bit next in significance above A7:0, and also drives the CCS inputs on the slave devices. This output is high for the first two EPROM transfers in order to access the control information, and then remains low whilst the coefficients are loaded. This control information is thus not stored adjacent to the coefficients within the EPROM, and in fact the EPROM must provide twice the storage necessary to contain the coefficients alone. All but two of the bytes in the additional half are redundant. See Fig.17 for the EPROM memory map. 13 PDSP16256 COEFFICIENTS PER DEVICE 32 64 128 DEVICE 2 DEVICE 1 Control Register Number of Coefficients Loaded 14 13 12 255 511 1023 194 193 192 191 386 385 384 383 770 769 768 767 NOT USED 0 0 0 0 1 1 1 1 CONTROL REG FILTER COEFFICIENTS 128 127 256 255 512 511 66 65 64 63 130 129 128 127 258 257 256 255 NOT USED CONTROL REG FILTER COEFFICIENTS 0 0 0 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 32 64 64 128 128 128 128 Invalid Mode Table 5. Number of coefficients loaded NOTE: The EPROM memory map assumes that, for the 32 and 64 coefficient per device options, the unused address pins are unconnected. If all address pins are connected as shown in Fig. 16 then the 128 coefficients per device memory map column should be used. Only those coefficients required will be read, hence the upper portions of the coefficient address space will be ignored. Fig. 17 EPROM Memory Map USING A REMOTE MASTER When a remote master is used to load coefficients, EPROM must be tied high and a conventional peripheral interface is then provided. It is not possible, however, to read coefficients already stored. The master supplies an address and data bus, and writes to the PDSP16256 occur under the control of synchronous CS and WEN inputs. The Coefficient Control Register pin (CCS) must be driven by a master address line higher in significance than A7:0. Both the WEN and CS signals must be low for the load operation to occur. When loading the control register the CS signal must be held low for a further 2 cycles, see Fig. 20. Since the internal write operation is actually performed with the system clock, it is necessary for the clock to be present during the transfer. The BYTE input defines whether coefficients are loaded as a single 16 bit word or two 8-bit bytes. The latter saves on connections to the remote master. Address bits A7:0 are used in byte mode. 16-bit word mode uses bits A6:0, A7 being redundant. When writing in byte mode the least significant byte (A0 = 0) must be written first followed by the most significant byte (A0 = 1). In byte mode the internal comparison between C15:12 and C11:8 is made, regardless of the state of EPROM . For this reason pins C15:8 should all be tied low when a remote master is used with byte transfers. This ensures that the internal comparison gives equality and allows the load operation to occur. 14 The address and coefficient buses plus the WEN and CS signals must all meet the specified set up and hold times with respect to the system clock, see Fig 20 and Switching Characteristics. This synchronous interface is optimum for the majority of high end applications, when individual coefficients must be updated at sample clock rates. However, if the coefficients are to be loaded under software control from a general purpose microprocessor, the processor’s WRITE STROBE will probably be asynchronous with the SCLK clock used by the PDSP16256. In this case external synchronising logic is needed, as shown in Fig.18. Fig. 19 shows the recommended loading sequence and filter operation initiation. The simplest technique is to reset the device prior to loading a set of coefficients. Coefficients may be loaded once BUSY returns low or 22 cycles after RES is taken high. When loading a device from a remote master the control register must be loaded first followed by the filter coefficients. Fig. 19 shows the required loading sequence, two examples are given one for byte mode the other for word mode. A gap of at least one cycle must be left after loading the control register before loading the first coefficient. Filter operations are started by presenting the first data word at the same time as raising signal FEN; FRUN should always be low. PDSP16256 SCLK PROCESSOR WRITE STROBE D Q COEFFICIENT LOAD STATE MACHINE WEN PDSP 16256 ADDRESS HOLD CIRCUIT A7:0 DATA C15:0 STROBE REGISTERED INTO SYNCHRONISATION REGISTER STROBE REGISTERED INTO STATE MACHINE COEFFICIENT INPUT CLOCKED TO PDSP16256 ON THIS EDGE SCLK PROCESSOR WRITE STROBE REGISTERED STROBE PDSP16256 WEN ADDRESS/DATA A7:0/C15:0 ADDRESS AND DATA VALID A7:0 AND C15:0 HELD AFTER FALLING EDGE OF WRITE STROBE Fig. 18 Remote Master synchronisation 15 PDSP16256 DEVICE RESET 1 2 3 4 5 6 7 16 17 37 38 39 SCLK RES BUSY RES must be held low for 16 cycles BUSY goes active Coefficient loading may start once BUSY has returned low BYTE WIDE COEFFICIENT LOAD 1 2 3 4 5 6 7 8 67 68 69 70 71 SCLK CCS A7:0 00 01 00 01 02 03 3E 3F C15:0 00 AC 10 00 20 00 00 02 CS WEN Control register loaded Blank cycles Coefficients loaded into the required address location. CS must be maintained with CCS high This example uses byte wide loading (BYTE held low). for two cycles WORD WIDE COEFFICIENT LOAD 1 2 3 4 5 6 7 8 34 35 36 37 38 18 19 SCLK CCS A7:0 00 00 01 02 03 04 1E 1F C15:0 AC00 0010 0020 0030 0040 0050 001F 0200 CS WEN Control register loaded Blank cycles Coefficients loaded into the required address location. with CCS high This example uses word wide loading (BYTE held high). START OF FILTER OPERATION 1 2 3 4 5 6 7 8 9 16 17 SCLK FEN 0010 DA15:0 F31:0 0000 0000 0020 0000 0000 0030 0000 0000 0040 0000 0000 0050 0000 0090 0000 0001 0001 00A0 0004 0004 CLKOP The first data sample is read as FEN goes high The first result available. CLKOP indicates the first active result cycle Fig. 19 Device startup timing diagrams 16 PDSP16256 CONTROL REGISTER The internal operation of the PDSP16256 is controlled by the status of a 16-bit control register. In the dual filter modes both networks are controlled by the same register. The significance of the various bits are shown in Table 6. Tables 7 and 8 define the control register bit interdependence for the filter and bank swapping modes. Bits Decode 15 15 14:13 14:13 14:13 14:13 12 12 11:10 11:10 11:10 11:10 9:8 7 7 6 6 5 4 4 3:0 0 1 00 01 10 11 0 1 00 01 10 11 00 0 1 0 1 0 1 The control register is double buffered. This allows the writing of a new control word without affecting the current operation of the device. To activate the new control register after it has been written to the device the bank swap signal must be toggled. After a reset the active control register is loaded directly and bank swap need not be used. Control Register Bits Function Dual filter mode Single filter mode Sample rate is the system clock Sample rate is half the system clock Sample rate is quarter the system clock Sample rate is eighth the system clock Output rate equals the input rate Decimate-by-two Intermediate device Interface device Termination device Single device These bits MUST be at logical zero Bank swap is controlled by input pin Bank swap is controlled by Bit 6 Lower bank if bit 7 is set Upper bank if bit 7 is set This bit must be at logical zero Two independent filters Two filters in cascade These bits MUST be at logical zero Function 15 4 0 0 1 0 1 X Two independent filters Two filters in cascade Single Filter Table 7 Control register filter mode bits Control Register Bits Function 7 6 5 0 1 1 X X 0 1 X 0 0 0 1 Control by input pin Lower bank selected Upper bank selected Swap on every sample clock Table 8 Control register bank swap bits Table 6 Control register bit allocation 17 PDSP16256 SCLK SCLK tHS tHH tHS CCS CCS CS CS WEN WEN tCL tHH C15:0 VALID DATA C15:0 VALID DATA A7:0 VALID ADDRESS A7:0 VALID ADDRESS (a) Coefficient Write tCH (b) Control Register Write Fig. 20 Remote Master setup and hold timings CLK 1 CLK 2 tCD A7:0 VALID ADDRESS C15:12 VALID ADDRESS CLK 9 ∼ ∼ ∼∼ ∼∼ ∼∼ ∼∼ ∼ ∼ SCLK CCS tCD tHS tHH ∼∼ ∼ ∼ C7:0 Fig. 21 EPROM load timings SCLK tCD tCL tOS tOH tCH OEN tCZF F31:0 VALID DATA OUTPUT PINS VALID DATA HIGH Z VALID DATA tCVF VALID DATA VALID DATA tHS tHH INPUT PINS Fig. 22 Operating timings 18 tHH PDSP16256 ELECTRICAL CHARACTERISTICS The Electrical Characteristics are guaranteed over the following range of operating conditions, unless otherwise stated: Commercial: TAMB = 0°C to170°C, VDD = 15V±5%, GND = 0V IndustriaL: TAMB = 240°C to 185°C, VDD = 15V±10%, GND = 0V Military: TAMB = 255°C to 1125°C, VDD = 15V±10%, GND = 0V Static Characteristics Characteristic Output high voltage Output low voltage Input high voltage (CMOS) Input low voltage (CMOS) Input high voltage (TTL) Input low voltage (TTL) Input leakage current Input capacitance Output leakage current Output short circuit current Value Symbol VOH VOL VIH VIL VIH VIL IIN CIN IOZ IOS Units Min. Typ. Max. 2·4 3·5 2·0 210 0·4 1·0 0·8 110 10 250 10 150 300 V V V V V V µA pF µA mA Conditions IOH = 4mA IOH = 4mA SCLK input only SCLK input only All other inputs All other inputs GND < VIN < VDD GND < VOUT < VDD VDD = 15·5V Switching Characteristics (see Figs. 20, 21 and 22) Characteristic Input signal setup to clock rising edge Input signal hold after clock rising edge OEN set up to clock rising edge OEN hold after clock rising edge Clock rising edge to output signal valid Clock frequency Clock high time Clock low time Clock to data valid F bus from high impedance Clock to data high impedance F bus VDD current Symbol tHS tHH tOS tOH tCD fSCLK tCH tCL tCVF tCZF IDD Commercial Industrial Military Min. Max. Min. Max. Min. Max. 8 4 20 4 5 18 11 - 26 25 30 30 400 8 4 20 4 5 20 12 - 28 20 30 30 380 8 4 20 4 5 20 12 - 28 20 30 30 380 Units ns ns ns ns ns MHz ns ns ns ns mA Conditions 30pF See Fig. 23 See Fig. 23 See Note 1 NOTE 1. VDD = 15·5V, outputs unloaded, clock frequency = Max. 19 PDSP16256 Test Delay from output high to output high impedance Delay from output low to output high impedance Delay from output high impedance to output low Delay from output high impedance to output high Waveform measurement level VH 0·5V IOL VL 0·5V 1·5V 1·5V DUT 30pF 0·5V IOH 1·5V 0·5V Three state delay measurement load VH is the voltage reached when the output is driven high VL is the voltage reached when the output is driven low Fig. 23 Three state delay measurement ABSOLUTE MAXIMUM RATINGS (Note 1) Supply voltage, VDD 20·5V to 17·0V Input voltage, VIN 20·5V to VDD 10·5V Output voltage, VOUT 20·5V to VDD 10·5V 18mA Clamp diode current per pin, IK (see note 2) 500V Static discharge voltage (HBM) Storage temperature, TS 265°C to1150°C Maximum junction temperature, TJMAX Commercial grade 1100°C Industrial grade 1110°C Military grade 1150°C 3000mW Package power dissipation 5°C/W Thermal resistance, Junction-to-Case, θJC NOTES 1. Exceeding these ratings may cause permanent damage. Functional operation under these conditions is not implied. 2. Maximum dissipation should not be exceeded for more than 1 second, only one output to be tested at any one time. 3. Exposure to absolute maximum ratings for extended periods may affect device reliablity. 4. Current is defined as negative into the device. 5. The θJC data assumes that heat is extracted from the top of the package. 6. Maximum junction temperature, TJMAX, is specified with power applied. 20 PDSP16256 MA ACBR and PDSP16256 MA GCPR (MIL-STD-883 PARTS) Polyimide is used as an inter-layer dielectric and as glassification. Polymeric material is also used for die attach which, according to the requirements in paragraph 1.2.1. b. (2) of MIL-STD-883 precludes categorising these devices as fully compliant. In every other respect, these devices are manufactured and screened in full compliance with MIL-STD-883 (latest revision). Life test/burn-in connections are given in Tables 9 and 10 on the following pages. Change Notification The change notification requirements of MIL-PRF-38535 will be implemented on MIL-STD-883 grade devices. Known customers will be notified of any changes since the last buy when ordering further parts if significant changes have been made. Rev. Date A B C MAR 1993 SEPT 1995 JAN 1998 D PDSP16256 Pin Voltage Pin Voltage Pin Voltage Pin Voltage A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 C1 C2 C3 C4 C5 C6 C7 N/C 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 15·0V 0V/180k 0V 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k N/C N/C N/C 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k N/C N/C N/C N/C 0V/180k 0V/180k 0V/180k 0V/180k C8 C9 C10 C11 C12 C13 C14 C15 D1 D2 D3 D4 D13 D14 D15 E1 E2 E3 E13 E14 E15 F1 F2 F3 F13 F14 F15 G1 G2 G3 G13 G14 G15 H1 H2 H3 H13 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 0V N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C 15·0V N/C N/C N/C N/C 15·0V 15·0V/180k 15·0V/180k 15·0V/180k N/C H14 H15 J1 J2 J3 J13 J14 J15 K1 K2 K3 K13 K14 K15 L1 L2 L3 L13 L14 L15 M1 M2 M3 M13 M14 M15 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N/C N/C 0V 0V/180k 0V/180k N/C N/C 0V 0V/180k 0V/180k 0V/180k N/C N/C N/C 15·0V 15·0V RESET N/C N/C N/C CLOCK 15·0V 0V N/C N/C N/C 0V 15·0V 15·0V/180k 15·0V 15·0V 0V 0V 15·0V 15·0V 0V 0V N12 N13 N14 N15 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 15·0V N/C N/C N/C 15·0V/180k 15·0V/180k 15·0V 15·0V 0V 0V 15·0V 15·0V 15·0V 0V 0V 0V N/C 0V N/C 0V/180k 15·0V 15·0V 0V 0V 15·0V 15·0V 15·0V 0V 15·0V 0V 0V 0V 15·0V N/C Table 9 Life test/burn-in connections for PDSP16256 MA ACBR (PGA). NOTE: PDA is 5% and based on groups 1 and 7 21 PDSP16256 Pin Voltage Pin Voltage Pin Voltage Pin Voltage 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 N/C N/C N/C N/C 15·0V N/C N/C 0V N/C N/C N/C N/C N/C N/C N/C 0V N/C N/C N/C 15·0V N/C N/C N/C N/C 15·0V N/C N/C 0V N/C N/C N/C N/C N/C N/C N/C 0V N/C N/C N/C 15·0V 0V N/C N/C 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 15·0V 0V 15·0V N/C 15·0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 15·0V 15·0V 15·0V 15·0V 15·0V 15·0V 15·0V 15·0V 15·0V 0V 0V 0V 0V 0V 0V 0V 15·0V 15·0V 15·0V 15·0V 15·0V 15·0V 0V 15·0V 15·0V/180k 15·0V/180k 15·0V 0V 0V/180k 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 15·0V/180k 0V 0V 15·0V 0V 15·0V 15·0V RESET CLOCK 0V 15·0V 15·0V 15·0V 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 15·0V 15·0V/180k 15·0V/180k 0V 15·0V/180k N/C N/C N/C 0V N/C N/C N/C N/C N/C 15·0V N/C N/C N/C N/C N/C N/C N/C 0V N/C 15·0V 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 0V N/C 0V/180k 15·0V 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 0V 0V/180k 0V/180k 15·0V 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 0V/180k 0V 0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 0V 15·0V/180k 15·0V/180k 15·0V/180k 15·0V 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 15·0V/180k 0V 15·0V/180k 15·0V 0V Table 10 Life test/burn-in connections for PDSP16256 MA GCPR (QFP). NOTE: PDA is 5% and based on groups 1 and 7 22 PDSP16256 PACKAGE DETAILS Dimensions are shown thus: mm (in). 3·35/4·14 (0·132/0·163) 4·45/4·70 (0·175/0·185) 2·54 (0·100) NOM. R P N 2·54 (0·100) NOM. M L 0·41/0·51 (0·016/0·020) DIA. K J H G EXTRA PIN D4, CONNECTED TO D3 F E D 1·93/2·39 (0·076/0·094) C 1·14/1·40 (0·045/0·055) DIA. B A 1·14/1·40 (0·045/0·055) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 39·60/40·41 (1·559/1·591) PIN A1 INDEX MARK (CAN BE ANY SHAPE) NOTES 1. Controlling dimensions are inches. 2. This package outline diagram is for guidance only. Please contact your Mitel Semiconductor Customer Service Centre for further information. PLATING BAR CAN BE IN VARIOUS POSITIONS – DO NOT USE FOR ORIENTATION. 39·60/40·41 (1·559/1·591) 144-I/O PIN GRID ARRAY – AC144 23 PDSP16256 PACKAGE DETAILS (Continued) Dimensions are shown thus: mm (in). 26.67 (1.050) NOM. 44.75/46.23 (1.760/1.820) PIN 1 INDEX PIN 1 PIN 172 2.41/2.82 (0.095/0.111) 1.96/2.36 (0.077/0.093) 0.127/0.178 (0.005/0.007) 0.15/0.25 (0.006/0.010) 28.95/29.46 (1.140/1.160) SQ. 172 LEADS AT 0.635 (0.025) NOM. SPACING NOTES 1. Controlling dimensions are inches. 2. This package outline diagram is for guidance only. Please contact your Mitel Semiconductor Customer Service Centre for further information. 172-LEAD CERAMIC FLATPACK - GC172 HEADQUARTERS OPERATIONS MITEL SEMICONDUCTOR Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 MITEL SEMICONDUCTOR 1500 Green Hills Road, Scotts Valley, California 95066-4922 United States of America. Tel (408) 438 2900 Fax: (408) 438 5576/6231 Internet: http://www.gpsemi.com CUSTOMER SERVICE CENTRES ● FRANCE & BENELUX Les Ulis Cedex Tel: (1) 69 18 90 00 Fax : (1) 64 46 06 07 ● GERMANY Munich Tel: (089) 419508-20 Fax : (089) 419508-55 ● ITALY Milan Tel: (02) 6607151 Fax: (02) 66040993 ● JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510 ● KOREA Seoul Tel: (2) 5668141 Fax: (2) 5697933 ● NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 5576/6231 ● SOUTH EAST ASIA Singapore Tel:(65) 3827708 Fax: (65) 3828872 ● SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 ● TAIWAN, ROC Taipei Tel: 886 2 25461260 Fax: 886 2 27190260 ● UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (01793) 726666 Fax : (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. © Mitel Corporation 1998 Publication No. DS3709 Issue No. 5.1 January 1998 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. 24 All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.