NICHIA NSPGR70ASS

No. STSE-CG5125A
<Cat.No.051019>
SPECIFICATIONS FOR NICHIA GREEN LED
MODEL : NSPGR70ASS
NICHIA CORPORATION
-0-
Nichia STSE-CG5125A
<Cat.No.051019>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
IFP
VR
PD
Topr
Tstg
Tsld
Absolute Maximum Rating
35
100
5
147
-30 ~ + 85
-40 ~ +100
265°C for 5sec.
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Flux
φV
x
Chromaticity Coordinate
y
-
Condition
IF=30[mA]
VR= 5[V]
IF=30[mA]
IF=30[mA]
IF=30[mA]
Typ.
(3.7)
(4.0)
0.17
0.70
(Ta=25°C)
Max.
Unit
4.2
V
50
µA
lm
-
Min.
4.8
3.4
2.4
(Ta=25°C)
Max.
Unit
6.8
lm
4.8
lm
3.4
lm
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank Rc
Rank Rb
Rank Ra
Symbol
φV
φV
φV
Condition
IF=30[mA]
IF=30[mA]
IF=30[mA]
Luminous Flux Measurement allowance is ± 10%.
Color Ranks
x
y
0.14
0.64
Rank G
0.14
0.22
0.74
0.74
x
y
0.22
0.64
0.21
0.65
(IF=30mA,Ta=25°C)
Rank H
0.21
0.28
0.28
0.73
0.73
0.65
Color Coordinates Measurement allowance is ± 0.01.
One delivery will include up to two color ranks and three luminous flux ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
-1-
Nichia STSE-CG5125A
<Cat.No.051019>
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ;
Resin(Mold) :
Leadframe :
Epoxy Resin (over Silicone Resin + Diffused)
Ag plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after packaging in stick.
Please refer to figure’s page.
The label on the packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 4 for 2004, 5 for 2005 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-2-
B for Nov. )
Nichia STSE-CG5125A
<Cat.No.051019>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard
Test Method
Test Conditions
Note
Number of
Damaged
1 time
0/50
1 time
over 95%
0/50
Resistance to
Soldering Heat
JEITA ED-4701
300 302
Tsld=260 ± 5°C, 5sec.
1.6mm from the base of the stopper
(Pre treatment 30°C,70%,168hrs.)
Solderability
JEITA ED-4701
300 303
Tsld=235 ± 5°C,
(using flux)
Thermal Shock
JEITA ED-4701
300 307
0°C ~ 100°C
15sec. 15sec.
100 cycles
0/50
Temperature Cycle
JEITA ED-4701
100 105
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
100 cycles
0/50
Moisture Resistance Cyclic
JEITA ED-4701
200 203
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
10 cycles
0/50
Terminal Strength
(bending test)
JEITA ED-4701
400 401
Load 5N (0.5kgf)
0° ~ 90° ~ 0° bend 2 times
No noticeable
damage
0/50
Terminal Strength
(pull test)
JEITA ED-4701
400 401
Load 10N (1kgf)
10 ± 1 sec.
No noticeable
damage
0/50
High Temperature Storage
JEITA ED-4701
200 201
Ta=100°C
1000hrs.
0/50
Temperature Humidity
Storage
JEITA ED-4701
100 103
Ta=60°C, RH=90%
1000hrs.
0/50
Low Temperature Storage
JEITA ED-4701
200 202
Ta=-40°C
1000hrs.
0/50
Steady State Operating Life
Condition 1
Ta=25°C, IF=35mA
1000hrs.
0/50
Steady State Operating Life
Condition 2
Ta=35°C, IF=30mA
1000hrs.
0/50
Steady State Operating Life
of High Humidity Heat
60°C, RH=90%, IF=20mA
500hrs.
0/50
Steady State Operating Life
of Low Temperature
Ta=-30°C, IF=30mA
1000hrs.
0/50
5sec.
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
VF
IF=30mA
U.S.L.*) 1.1
Reverse Current
IR
VR=5V
U.S.L.*) 2.0
Luminous Flux
IF=30mA
L.S.L.**) 0.7
φV
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
Nichia STSE-CG5125A
<Cat.No.051019>
7.CAUTIONS
(1) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 85°C
· Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected by
environments which contain corrosive substances. Please avoid conditions which may cause the LED
to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering
operations. It is recommended that the LEDs be used as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where
condensation can occur.
(2) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
-4-
Nichia STSE-CG5125A
<Cat.No.051019>
(3) Soldering Conditions
· Nichia LED leadframes are silver plated copper alloy.
This substance has a low
thermal coefficient (easily conducts heat).
Careful attention should be paid during soldering.
· Solder the LED no closer than 1.6mm from the base of the stopper.
· The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is
important to minimize the mechanical stress on the LEDs.
It should be confirmed beforehand
that it will not cause any problem when using it.
· Recommended soldering conditions
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
Dip Soldering
120°C Max.
60 seconds Max.
260°C Max.
Temperature
Soldering Time
Position
Soldering
350°C Max.
3 seconds Max.
No closer than 1.6 mm from the
base of the stopper.
5 seconds Max.
No lower than 1.6 mm from the
base of the stopper.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
the LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided.
Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes.
When it is
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
for any problems.
Direct soldering should only be done after testing has confirmed that no damage,
such as wire bond failure or resin deterioration, will occur.
Nichia’s LEDs should not be soldered
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
· Cut the LED leadframes at room temperature.
Cutting the leadframes at high temperatures may
cause failure of the LEDs.
(4) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-
Nichia STSE-CG5125A
<Cat.No.051019>
(6) Safety Guideline for Human Eyes
· In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety
(IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well
as lasers.
In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source.
In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products.
Components are excluded from this system. Products which contain visible LEDs are now classified
as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified
as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the
energy emitted is high. For these systems it is recommended to avoid long term exposure.
It is also recommended to follow the IEC regulations regarding safety and labeling of products.
(7) Others
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use.
Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-6-
Nichia STSE-CG5125A
<Cat.No.051019>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
0.7
G
H
550
560
0.6
570
500
0.5
y
580
590
0.4
600
0.3
610
620
630
490
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-7-
0.5
0.6
0.7
0.8
10
5
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
2.5
2.0
1.5
1.0
0.5
0
0
20 40 60 80 100 120
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.4
2.0
-8-
5.0
IFP=30mA
4.6
4.2
3.8
3.4
3.0
2.6
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
IFP=30mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
20
3.0
200
Ta=25°C
100
50
30
20
10
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Ta=25°C
50
1
2.5
Forward Voltage VF (V)
Relative Luminous Flux (a.u.)
100
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
200
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminous Flux
Forward Voltage vs.
Forward Current
50
40
30
20
10
9
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NSPGR70AS
Title
CHARACTERISTICS
No.
051005544971
Nichia STSE-CG5125A
<Cat.No.051019>
Model
Forward Current vs.
Chromaticity Coordinate (λD)
30mA 5mA
(525nm) (535nm)
0.70
y
50mA
(520nm)
0.65
1mA
(541nm)
100mA(514nm)
0.60
0.55
0.05 0.10 0.15 0.20 0.25 0.30
555
Ta=25°C
545
535
525
515
505
495
1
5 10 20
50 100
Forward Current IFP (mA)
Ta=25°C
IF=30mA
1.0
0.8
0.6
0.4
0.2
0
400 450 500 550 600 650 700
Wavelength λ (nm)
Ambient Temperature vs.
Dominant Wavelength
Dominant Wavelength λ D (nm)
-9-
Dominant Wavelength λ D (nm)
x
Forward Current vs.
Dominant Wavelength
1.2
Directivity
1.0
531
529
IFP=30mA
Relative Illuminance (a.u.)
Ta=25°C
0.75
Relative Emission Intensity (a.u.)
0.80
Spectrum
527
525
523
521
519
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
0°
Ta=25°C
IFP=30mA
10° 20°
30°
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
0.5
90°
1.0
NSPGR70AS
Title
CHARACTERISTICS
No.
051005544981
Nichia STSE-CG5125A
<Cat.No.051019>
Model
0°
Internal Circuit
3
2
3
A
7.5 ± 0.5
4.4
2
0.5
K
4
1
(C 1.25) 1 Pin Mark
R 0.69
0.76 ± 0.1
1
1.55
K
4
5.08
7.62 ± 0.5
A
7.62 ± 0.5
φ3
(5°)
1.4MAX.
0.4 ± 0.1
0.4
2.5 ± 0.5
-10-
0.4
1.1
Stopper
0.5
5.08 ± 0.3
ITEM
LEAD FRAME
Remark:
Please note that the bare copper alloy showing at the cut end
of the lead frame may be corroded under certain conditions.
LEDs have some sharp edges and points, particularly lead
frames. Please handle with care so as to avoid injuries.
Model
NICHIA CORPORATION
Title
No.
NSPGR70AS
OUTLINE DIMENSIONS
051005544991
Unit
mm
5/1
Scale
Allow
±0.2
Nichia STSE-CG5125A
<Cat.No.051019>
RESIN
MATERIALS
Epoxy Resin
(over Silicone Resin + Diffused)
Ag Plating Copper Alloy
Cross Sectional image of stick
5.85
9
11.8
5.4
½1 t = 0.6 ± 0.1mm
½2 Warp : 1mm Max.
3
9.6
-11-
Whole image of stick
485 ± 1
Cap
NICHIA >PC< CAUTION TO ELECTROSTATIC DAMAGE 静電気に注意
A
60pcs / stick
K
NICHIA CORPORATION
NSPxR70xSS
Title
STICK DIMENSIONS
No.
050725436072
Unit
mm
Scale
Allow
±0.2
Nichia STSE-CG5125A
<Cat.No.051019>
Model
Nichia STSE-CG5125A
<Cat.No.051019>
The stick and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Moisture
absorbent material
Moisture proof foil bag
Stick
Label
NICHIA
XXXX LED
TYPE
LOT
QTY
Seel
NSPxR70xSS
xxxxxx-U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Label
NICHIA
XXXX LED
TYPE
RANK
QTY
NSPxR70xSS
U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Empty space in the box is filled
with cushion material.
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box M
Cardboard box 1/2L
Cardboard box L
Stick/bag
10 stick Max.
Quantity/bag (pcs)
600 MAX.
Dimensions (mm)
590¯277¯120¯4t
613¯298¯268¯7t
613¯298¯518¯7t
Stick/box
100 stick MAX.
200 stick MAX.
400 stick MAX.
Model
NICHIA CORPORATION
-12-
Quantity/box (pcs)
6,000 MAX.
12,000 MAX.
24,000 MAX.
NSPxR70xSS
Title
PACKING
No.
050725436082