AGILENT HCPL-2531

Dual Channel, High Speed
Optocouplers
Technical Data
HCPL-2530
HCPL-2531
HCPL-4534
HCPL-0530
HCPL-0531
HCPL-0534
Features
Applications
Description
• 15 kV/µs Minimum Common
Mode Transient Immunity at
VCM = 1500 V
(HCPL-4534/0534)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8 Pin DIP, SO-8,
and 8 Pin DIP – Gull Wing
Surface Mount (Option 020)
Packages
• High Density Packaging
• 3 MHz Bandwidth
• Open Collector Outputs
• Guaranteed Performance
from 0°C to 70°C
• Safety Approval
UL Recognized – 2500 V rms
for 1 minute (5000 V rms for
1 minute for Option 020) per
UL1577
CSA Approved
• Single Channel Version
Available (4502/3, 0452/3)
• MIL-STD-1772 Version
Available (55XX/65XX/4N55)
• Line Receivers – High
Common Mode Transient
Immunity (>1000 V/µs) and
Low Input-Output Capacitance
(0.6 pF)
• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL
• Replace Pulse Transformers
– Save Board Space and Weight
• Analog Signal Ground
Isolation – Integrated Photon
Detector Provides Improved
Linearity over Phototransistor
Type
• Polarity Sensing
• Isolated Analog Amplifier –
Dual Channel Packaging
Enhances Thermal Tracking
These dual channel optocouplers
contain a pair of light emitting
diodes and integrated photodetectors with electrical insulation
between input and output.
Separate connection for the
photodiode bias and output
transistor collectors increase the
speed up to a hundred times that
of a conventional phototransistor
coupler by reducing the basecollector capacitance.
Functional Diagram
ANODE 1 1
8 VCC
CATHODE 1 2
7 VO1
CATHODE 2 3
6 VO2
ANODE 2 4
TRUTH TABLE
(POSITIVE LOGIC)
LED
VO
ON
LOW
OFF
HIGH
5 GND
A 0.1 µF bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
These dual channel optocouplers
are available in an 8 Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8 Pin
DIP part number and the
electrically equivalent SO-8 part
number.
8 Pin DIP
HCPL-2530
HCPL-2531
HCPL-4534
SO-8
Package
HCPL-0530
HCPL-0531
HCPL-0534
The SO-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCPL-2530/0530 is for use in
TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
the HCPL-2530/0530 is 7%
minimum at IF = 16 mA.
The HCPL-2531/0531 is designed
for high speed TTL/TTL
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 kΩ pull-up resistor. CTR of
the HCPL-2531/0531 is 19%
minimum at IF = 16 mA.
The HCPL-4534/0534 is an
HCPL-2531/0531 with increased
common mode transient immunity
of 15,000 V/µs minimum at
VCM = 1500 V guaranteed.
Selection Guide
Minimum CMR
8-pin DIP (300 Mil)
dV/dt
(V/ µs)
1,000
VCM
(V)
10
Current
Transfer
Ratio (%)
7
19
Dual
Channel
Package
HCPL-2530
HCPL-2531
15,000
1,000
1500
10
19
9
HCPL-4534
Single
Channel
Package*
6N135
6N136
HCPL-4502
HCPL-4503
*Technical data for these products are on separate HP publications.
Small-Outline SO-8
Dual
Channel
Package
HCPL-0530
HCPL-0531
HCPL-0534
Single
Channel
Package*
HCPL-0500
HCPL-0501
HCPL-0452
HCPL-0453
Widebody
(400 Mil)
Single
Channel
Package*
HCNW135
HCNW136
HCNW4502
HCNW4503
Hermetic
Single and
Dual Channel
Packages*
HCPL-55XX
HCPL-65XX
4N55
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2531#XXX
020 = UL 5000 V rms/1 Minute Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For HCPL-2530/1 and HCPL-4534 only.
†Gull wing surface mount option applies to through hole parts only.
Schematic
1
ICC
I F1
+
8
VF1
I O1
–
7
VCC
VO1
2
3
I F2
–
I O2
6
VF2
VO2
+
4
GND
5
HCPL-4534/0534 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/2531/4534)
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
HP XXXXZ
YYWW RU
1
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
5° TYP.
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 ± 0.25
(0.100 ± 0.010)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.016 (0.040)
1.194 (0.047)
5
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
9.398 (0.370)
9.906 (0.390)
4
1.194 (0.047)
1.778 (0.070)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
4.19 MAX.
(0.165)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.381 (0.015)
0.635 (0.025)
0.635 ± 0.25
(0.025 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
12° NOM.
5
Small Outline SO-8 Package (HCPL-0530/0531/0534)
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
PIN ONE 1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
3.175 ± 0.127
(0.125 ± 0.005)
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
0.305 MIN.
(0.012)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
TEMPERATURE – °C
Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface
Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
∆T = 145°C, 1°C/SEC
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activiated fluxes is highly recommended.
Regulatory Information
The devices contained in this data
sheet have been approved by the
following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
6
Insulation and Safety Related Specifications
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(101)
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
L(102)
7.4
4.8
0.08
0.08
mm
NA
NA
mm
200
200
Volts
IIIa
IIIa
CTI
Units
Conditions
mm Measured from input terminals to output to
to output terminals, shortest distance through
air.
mm Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals to output
terminals, along internal cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
(each channel)
Peak Forward Input Current (each channel)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current (each channel)
(≤ 1 µs pulse width, 300 pps)
Reverse LED Input Voltage (each channel)
Input Power Dissipation (each channel)
Average Output Current (each channel)
Peak Output Current
Supply Voltage (Pin 8-5)
Output Voltage (Pins 7-5, 6-5)
Output Power Dissipation (each channel)
Lead Solder Temperature
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
Reflow Temperature Profile
Symbol
TS
TA
IF(AVG)
Device
Max.
125
100
25
Units
°C
°C
mA
IF(PEAK)
50
mA
IF(TRANS)
1
A
VR
PIN
5
45
8
16
30
20
35
V
mW
mA
mA
V
V
mW
IO(AVG)
IO(PEAK)
VCC
VO
PO
TLS
TRP
Min.
-55
-55
-0.5
-0.5
8 Pin DIP
SO-8 and
Option 300
260
°C
See Package Outline
Drawings section
Note
13
7
Electrical Specifications (DC)
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 9.
Parameter
Sym.
Device
Current
Transfer
Ratio
CTR
HCPL-2530/
0530
7
VOL
19
18
50
%
TA = 25°C
24
50
%
TA = 25°C
0.1
0.5
V
TA = 25°C IO = 1.1 mA IF = 16 mA,
VCC = 4.5 V
IO = 0.8 mA
V
TA = 25°C IO = 3.0 mA
HCPL-2530/
0530
0.5
0.1
0.5
0.5
IF = 16 mA, 1, 2
VCC = 4.5 V 4
VO = 0.5 V
1, 2
IOH
0.003
0.5
1
1
6
1
3
1
IO = 2.4 mA
µA
50
TA = 25°C VO = Open IF = 0 mA
VCC = 5.5 V
TA = 25°C VO = Open
VCC = 15.0 V
Logic Low
Supply
Current
ICCL
100
400
µA
IF = 16 mA, VO = Open,
VCC = 15 V
Logic High
Supply
Current
ICCH
0.05
4
µA
IF = 0 mA, VO = Open,
VCC = 15 V
VF
1.5
1.7
V
TA = 25°C
Input
Forward
Voltage
Fig. Note
15
HCPL-2531/
0531
HCPL-4534/
0534
Logic High
Output
Current
Test Conditions
5
HCPL-2531/
0531
HCPL-4534/
0534
Logic Low
Output
Voltage
Min. Typ.* Max. Units
IF = 16 mA
1.8
BVR
Temperature
Coefficient
of Forward
Voltage
∆VF
∆TA
-1.6
mV/
°C
IF = 16 mA
Input
Capacitance
CIN
60
pF
f = 1 MHz, VF = 0 V
*All typicals at TA = 25°C.
5
V
IR =10 µA
Input
Reverse
Breakdown
Voltage
1
1
8
Switching Specifications (AC)
Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified.
Device
Parameter
Sym.
HCPLMin. Typ.* Max. Units
Test Conditions
Fig.
Propagation
tPHL 2530/0530
0.2
1.5
µs
TA = 25°C
RL = 4.1 kΩ
5, 9,
Delay Time
2.0
11
to Logic Low
2531/0531/
0.2
0.8
TA = 25°C
RL = 1.9 kΩ
at Output
4534/0534
1.0
Propagation
tPLH 2530/0530
1.3
1.5
µs
TA = 25°C
RL = 4.1 kΩ
5, 9,
Delay Time
2.0
11
High to Logic
2531/0531/
0.6
0.8
TA = 25°C
RL = 1.9 kΩ
at Output
4534/0534
1.0
Common
|CMH| 2530/0530
1
10
kV/µs RL = 4.1 kΩ IF = 0 mA,
10
Mode Transient
2531/0531
1
10
RL = 1.9 kΩ TA = 25°C,
Immunity at
4534/0534
15
30
RL = 1.9 kΩ VCM = 10 Vp-p
Logic High
Level Output
Common
|CML| 2530/0530
1
10
kV/µs RL = 4.1 kΩ IF = 0 mA,
10
Mode Transient
2531/0531
1
10
RL = 1.9 kΩ TA = 25°C,
Immunity at
4534/0534
15
30
RL = 1.9 kΩ VCM = 10 Vp-p
Logic Low
Level Output
Bandwidth
BW
3
MHz RL = 100 kΩ
7, 8
Note
6, 7
6, 7
5, 6,
7
5, 6,
7
*All typicals at TA = 25°C.
Package Characteristics
Parameter
Input-Output
Momentary Withstand Voltage**
Sym.
VISO
Device
HCPL-2530/
2531/4534
Option 020
Min. Typ.* Max.
2500
5000
Units
V rms
Test Conditions
RH < 50%,
t = 1 min.,
RH ≤ 45%
VI-O = 500 Vdc,
t=5s
f = 1 MHz,
TA = 25°C
RH ≤ 45%,
t = 5 s,
VI-I = 500 Vdc
Resistance
(Input-Output)
RI-O
1012
Ω
Capacitance
(Input-Output)
Input-Input
Insulation
Leakage Current
Resistance
(Input-Input)
Capacitance
(Input-Input)
CI-O
0.6
pF
II-I
0.005
µA
RI-I
1011
Ω
0.03
pF
CI-I
HCPL-2530/
2531/4534
HCPL-0530/
0531/0534
Fig.
Note
3, 10
3, 11
3
12
4
4
f = 1 MHz
4
0.25
*All typicals at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),
your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,”
publication number 5963-2203E.
9
IO – OUTPUT CURRENT – mA
35 mA
30 mA
25 mA
5
20 mA
15 mA
10 mA
IF = 5 mA
0
0
10
VO – OUTPUT VOLTAGE – V
Figure 1. DC and Pulsed Transfer
Characteristics.
20
7.
8.
9.
VO > 2.0 V). Common mode transient
immunity in a Logic Low level is the
maximum tolerable (negative)
dVCM /dt on the falling edge of the
common mode pulse signal, VCM , to
assure that the output will remain in a
Logic Low state (i.e., VO < 0.8 V).
The 1.9 kΩ load represents 1 TTL
unit load of 1.6 mA and the 5.6 kΩ
pull-up resistor.
The 4.1 kΩ load represents 1 LSTTL
unit load of 0.36 mA and the 6.1 kΩ
pull-up resistor.
The frequency at which the ac output
voltage is 3 dB below the low
frequency asymptote.
Use of a 0.1 µF bypass capacitor
connected between pins 5 and 8 is
recommended.
10. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
≥ 3000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA).
11. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA).
12. Measured between the LED anode and
cathode shorted together and pins 5
through 8 shorted together.
13. Derate linearly above 90°C free-air
temperature at a rate of 3.0 mW/ °C
for the SOIC-8 package.
1.5
1000
HCPL-2530/0530
HCPL-2531/0531/4534/0534
IF – FORWARD CURRENT – mA
40 mA
TA = 25°C
10 VCC = 5.0 V
6.
NORMALIZED CURRENT TRANSFER RATIO
Notes:
1. Each channel.
2. CURRENT TRANSFER RATIO is
defined as the ratio of output
collector current, IO, to the forward
LED input current, IF , times 100%.
3. Device considered a two-terminal
device: pins 1, 2, 3, and 4 shorted
together and pins 5, 6, 7, and 8
shorted together.
4. Measured between pins 1 and 2
shorted together, and pins 3 and 4
shorted together.
5. Common mode transient immunity in
a Logic High level is the maximum
tolerable (positive) dVCM/dt on the
rising edge of the common mode
pulse, VCM, to assure that the output
will remain in a Logic High state (i.e.,
1.0
0.5
NORMALIZED
I F = 16 mA
VO = 0.5 V
VCC = 5 V
TA = 25°C
0.1
0
1
10
100
IF – INPUT CURRENT – mA
Figure 2. Current Transfer Ratio vs.
Input Current.
100
IF
TA = 25°C
+
VF
–
10
1.0
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
VF – FORWARD VOLTAGE – VOLTS
Figure 3. Input Current vs. Forward
Voltage.
1.1
t P – PROPAGATION DELAY – ns
2000
1.0
0.9
NORMALIZED
IF = 16 mA
VO = 0.5 V
VCC = 5 V
TA = 25°C
0.8
0.7
HCPL-2530/0530
HCPL-2531/0531/4534/0534
0.6
-60 -40 -20
0
20
40
60
80 100
1000
t PLH
t PHL
500
0
-60
-20
20
60
100
Figure 4. Current Transfer Ratio vs.
Temperature.
Figure 5. Propagation Delay vs.
Temperature.
0.20
0.10
8
12
16
20
-5
10+2
10+1
10 0
10 -1
10 -2
-50
-25
0
+25
+50
+75
+100
TA = 25°C
IF = 16 mA
24
RL = 100 Ω
RL = 220 Ω
RL = 470 Ω
RL = 1 kΩ
-10
-15
-20
-25
-30
0.01
0
4
IF = 0
VO = VCC = 5.0 V
Figure 6. Logic High Output Current vs.
Temperature.
NORMALIZED RESPONSE –dB
TA = 25°C, RL = 100 Ω, VCC = 5 V
0
10+3
TA – TEMPERATURE – °C
0
0.30
10+4
TA – TEMPERATURE – °C
TA – TEMPERATURE – °C
∆ IO
∆ I F – SMALL SIGNAL CURRENT TRANSFER RATIO
1500
I F = 16 mA, V CC = 5.0 V
HCPL-2530/0530 (R L = 4.1 kΩ)
HCPL-2531/0531/4534/0534
(R L = 1.9 kΩ)
IOH – LOGIC HIGH OUTPUT CURRENT – nA
NORMALIZED CURRENT TRANSFER RATIO
10
0.1
1.0
10
f – FREQUENCY – MHz
IF – QUIESCENT INPUT CURRENT – mA
+5 V
SET I F
Figure 7. Small-Signal Current Transfer
Ratio vs. Quiescent Input Current.
20 kΩ
AC INPUT
1
8
2
7
3
6
2N3053
0.1 µF
560 Ω
100 Ω
+5 V
RL
VO
0.1 µF
4
1.6 V dc
0.25 Vp-p ac
Figure 8. Frequency Response.
5
11
PULSE
GEN.
ZO = 50 Ω
t r = 5 ns
IF
0
5V
VO
1.5 V
IF
8
2
7
3
6
+5 V
RL
10% DUTY CYCLE
1/f < 100 µs
1.5 V
VOL
VO
0.1µF
I F MONITOR
5
4
CL = 1.5 pF
RM
t PLH
t PHL
1
Figure 9. Switching Test Circuit.
B
IF
1
8
2
7
3
6
4
5
+5 V
A
VCM
0V
10%
90% 90%
10%
V FF
tf
tr
VO
5V
VO
VOL
SWITCH AT B: I F = 16 mA
VCM
+
–
PULSE GEN.
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
tP – PROPAGATION DELAY – µs
2.0
I F = 10 mA
I F = 16 mA
VCC = 5.0 V
TA = 25 °C
1.0
0.8
0.6
tPLH
0.4
t PHL
0.2
0.1
1
2
3
4
5
VO
0.1 µF
SWITCH AT A: I F = 0 mA
3.0
RL
6 7 8 9 10
RL – LOAD RESISTANCE – kΩ
Figure 11. Propagation Delay Time vs. Load Resistance.
www.hp.com/go/isolator
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-1272E
Printed in U.S.A.
5968-1090E (7/98)