AGILENT HCPL-T250

1.5 Amp Output Current IGBT
Gate Drive Optocoupler
Technical Data
HCPL-T250
Features
Description
• Input Threshold Current
(IFLH): 5 mA (Max.)
• Supply Current
(ICC): 11 mA (Max.)
• Supply Voltage
(VCC): 15-35 V
• Output Current
(IO): ± 0.5 A (Min.)
• Switching Time
(tPLH/tPHL): 0.5 µs (Max.)
• Isolation Voltage
(VISO): 3750 Vrms (Min.)
• UL 1577 Recognized:
File No. E55361
• CSA Approved
• IEC/EN/DIN EN 60747-5-2
Approved with VIORM = 630
Vpeak
• 8 kV/µs Minimum Common
Mode Rejection (CMR) at
Vcm = 1500 V
• Creepage Distance: 7.4 mm.
Clearance: 7.1 mm.
The HCPL-T250 contains GaAs
LED. The LED is optically
coupled to an integrated circuit
with a power output stage. This
optocoupler is ideally suited for
driving power IGBTs and
MOSFETs used in motor control
inverter applications. The high
operating voltage range of the
output stage provides the drive
voltages required by gate
controlled devices. The voltage
and current supplied by this
optocoupler makes it ideally
suited for directly driving IGBTs
with ratings up to 1200 V/25 A.
For IGBTs with higher ratings,
the HCPL-T250 can be used to
drive a discrete power stage
which drives the IGBT gate.
Applications
Functional Diagram
N/C
1
ANODE
2
CATHODE
3
Q1
8
VCC
7
VO
6
VO
5
VEE
Q2
N/C
4
SHIELD
Truth Table
LED
Vout
ON
LOW
OFF
HIGH
Ordering Information
Specify Part Number followed by
Option Number.
Example:
HCPL-T250 #XXXX
No Option = Standard DIP Package, 50 per tube.
060 = IEC/EN/DIN EN 60747-5-2 VIORM = 630 Vpeak
Option, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 per reel.
XXXE = Lead Free Option
• IGBT/MOSFET Gate Drive
• AC/Brushless DC Motor
Drives
• Industrial Inverters
• Switch Mode Power
Supplies
Remarks: The notation “#” is used for existing products, while (new) products launched
since 15th July 2001 and lead free option will use “–”
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
Package Outline Drawings
Standard DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
8
7
7.62 ± 0.25
(0.300 ± 0.010)
6
5
6.35 ± 0.25
(0.250 ± 0.010)
A T250
DATE CODE
YYWW
PIN ONE
1
2
3
4
1.78 (0.070) MAX.
1.19 (0.047) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
+ 0.076
- 0.051
+ 0.003)
(0.010
- 0.002)
0.254
5° TYP.
PIN ONE
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
DIMENSIONS IN MILLIMETERS AND (INCHES).
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.016 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
10.9 (0.430)
4
1.27 (0.050)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
2.0 (0.080)
0.635 ± 0.25
(0.025 ± 0.010)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
12° NOM.
3
Solder Reflow Thermal Profile
300
TEMPERATURE (°C)
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
30
SEC.
160°C
150°C
140°C
30
SEC.
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
0
100
150
200
TIME (SECONDS)
Recommended Pb-Free IR Profile
tp
Tp
TEMPERATURE
TL
Tsmax
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
tL
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
250
4
Regulatory Information
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
The HCPL-T250 has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
Insulation and Safety Related
Parameter
Minimum External Air Gap
(Clearance)
Symbol
L(101)
Minimum External Tracking
(Creepage)
L(102)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
Value Units
7.1
mm
7.4
mm
0.08
mm
≥ 175
Volts
IIIa
Conditions
Measured from input terminals to
output terminals, shortest distance through
air.
Measured from input terminals to
output terminals, shortest distance path
along body.
Insulation thickness between emitter
and detector; also known as distance
through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings (Compared with HCPL-3120)
Parameter
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
TA
IOH(PEAK)
IOL(PEAK)
TS
IF(AVG)
IF(TRAN)
VR
(VCC - VEE)
VO
PO
Units
°C
A
A
°C
mA
A
HCPL-3120
Min.
Max.
-40
100
2.5
2.5
-55
125
25
1.0
HCPL-T250
Min.
Max.
-20
85
1.5
1.5
-55
125
20
1.0
Note
1
2
V
5
5
V
0
35
0
35
V
0
VCC
0
VCC
mW
250
250
3
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. See HCPL-3120 Applications section for additional details on limiting
I OH(PEAK).
2. Derate linearly above 70°C free-air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free-air temperature at a rate of 4.8 mW/°C.
5
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Input Voltage (OFF)
Symbol
VCC - VEE
IF(ON)
VF(OFF)
Min.
15
7
-3.0
Max.
30
16
0.8
Units
V
mA
V
DC Electrical Specifications (Compared with HCPL-3120)
Over recommended operating conditions (IF(ON) = 7 to 16 mA, VF(OFF) = -3.0 to 0.8 V, VCC = 15 to 30 V,
VEE = Ground) unless otherwise specified.
Parameter
Input Forward
Voltage
Symbol
VF
Units
V
Temperature
Coefficient of
Forward Voltage
Input Reverse
Current
∆VF /∆TA
mV/ °C
IR
µA
Input Capacitance
CIN
pF
High Level
Output Current
Low Level
Output Current
IOH
A
IOL
A
High Level
Output Voltage
Low Level
Output Voltage
VOH
V
V OL
V
Min.
1.2
HCPL-3120
Typ.* Max.
1.5
1.8
Min.
HCPL-T250
Typ.* Max.
1.6
1.8
-1.6
-2.0
10
60
0.5
2.0
0.5
2.0
1.5
VCC - 4
VCC - 3
60
2.0
0.5
N.A.
0.5
N.A.
1.5
VCC - 4
VCC - 3
VEE +0.1 VEE +0.5
IF = 10 mA
10
VR = 5 V
250
VF = 0 V,
F = 1 MHz
VO
VO
VO
VO
= VCC - 4 V
= VCC - 15 V
= VCC - 4 V
= VCC - 15 V
IO = -100 mA
2.0
VEE +0.8 VEE +2.5 IO = 100 mA
High Level
ICCH
mA
Supply CurrentntSupply Current
Low Level
ICCL
mA
Supply Current
2.0
5
7
11
2.0
5
7.5
11
Threshold Input
Current Low to
High
Threshold Input
Voltage High
to Low
2.3
5
1.2
5
IFLH
mA
V FHL
V
0.8
Supply Voltage
Capacitance
(Input-Output)
VCC
C I-0
V
pF
15
Resistance
(Input-Output)
RI-0
Ω
0.8
30
15
30
0.6
1.0
1012
1012
*All typical values at T A = 25°C and VCC - VEE = 3° V, unless otherwise noted.
Test
Conditions
IF = 10 mA
Output Open
IF = 7 to 16 mA
Output Open
V F = -3.0 to
+0.8 V
IO = 0 mA,
VO > 5 V
Note
6
Switching Specifications (AC) (Compared with HCPL-3120)
Over recommended operating conditions (TA = -40 to 100°C, I F(ON) = 7 to 16 mA, VF(OFF) = -3.0 to 0.8 V,
VCC = 15 to 30 V, VEE = Ground) unless otherwise specified.
HCPL-3120
(-40 °C ~ 100°C)
Parameter
Symbol Units
Propagation Delay
tPHL
µs
Time to High
Output Level
Propagation Delay
Time to Low
Output Level
Output Rise Time
Output Fall Time
Pulse Width
Distortion
TPLH
µs
tR
tF
PWD
µs
µs
µs
Propagation
(tPHL Delay Difference tPLH )
Between Any
PDD
Two Parts
Output High
|CMH |
Level Common
Mode Transient
Immunity
Output Low
Level Common
Mode Transient
Immunity
|CML |
Min.
0.1
Typ.*
0.27
0.1
0.3
Max. Min.
0.5
0.5
0.1
0.1
-0.35
kV/µs
15
15
30
Test
Max.
Conditions
0.5 Rg = 10 Ω
Cg = 10 nF,
f = 10 kHz,
0.5 Duty Cycle = 50%
Note
N.A.
N.A.
0.35
30
Typ.*
0.27
0.3
0.3
µs
kV/µs
HCPL-T250
(-20 °C ~ 85°C)
N.A.
N.A.
5
5
N.A.
4
TA = 25°C
VCC = 30 V
5
HCPL
-3120
IF = 10 mA
V CM = 1500 V
HCPL
-T250
IF = 10 mA
V CM = 600 V
TA = 25°C
VF = 0 V
5
HCPL
-3120
V CM = 1500 V
HCPL
-T250
V CM = 600 V
*All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.
Notes:
4. The difference between t PHL and tPLH between any two HCPL-3120 parts under the same test condition.
5. Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure
that the output will remain in the high state (i.e., VO > 15.0 V).
6. Common mode transient immunity in a low state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that
the output will remain in a low state (i.e., VO < 1.0 V).
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Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5989-0797EN
March 1, 2005
5989-2144EN
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