54F/74F240 # 54F/74F241 # 54F/74F244 Octal Buffers/Line Drivers with TRI-STATEÉ Outputs General Description Features The ’F240, ’F241 and ’F244 are octal buffers and line drivers designed to be employed as memory and address drivers, clock drivers and bus-oriented transmitters/receivers which provide improved PC and board density. Y Y Y Y Y Commercial Military 74F240PC 54F240DM (Note 2) Package Number TRI-STATE outputs drive bus lines or buffer memory address registers Outputs sink 64 mA (48 mA mil) 12 mA source current Input clamp diodes limit high-speed termination effects Guaranteed 4000V minimum ESD protection Package Description N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F240SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F240SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ W20A 20-Lead Cerpack 54F240FM (Note 2) 54F240LM (Note 2) 74F241PC 54F241DM (Note 2) 74F241SC (Note 1) 74F241SJ (Note 1) 54F241FM (Note 2) 54F241LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ W20A 20-Lead Cerpack E20A 20-Lead Ceramic Leadless Chip Carrier, Type C N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F244SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F244SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ 74F244MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II 54F244FM (Note 2) W20A 20-Lead Cerpack 54F244LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F244PC 54F244DM (Note 2) Note 1: Devices also available in 13× reel. Use Suffix e SCX, SJX and MSAX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9501 RRD-B30M75/Printed in U. S. A. 54F/74F240 # 54F/74F241 # 54F/74F244 Octal Buffers/Line Drivers with TRI-STATE Outputs May 1995 Connection Diagrams Pin Assignment for LCC ’F240 ’F241 ’F244 TL/F/9501 – 6 TL/F/9501 – 4 TL/F/9501–2 Pin Assignment for DIP, SOIC, SSOP and Flatpak TL/F/9501–1 TL/F/9501 – 3 TL/F/9501 – 5 Logic Symbols IEEE/IEC ’F240 IEEE/IEC ’F241 TL/F/9501–7 IEEE/IEC ’F244 TL/F/9501 – 8 2 TL/F/9501 – 9 Unit Loading/Fan Out 54F/74F Pin Names Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL OE1, OE2 OE2 I 0 – I7 I0 – I 7 O0 – O7, O0 – O7 TRI-STATE Output Enable Input (Active LOW) TRI-STATE Output Enable Input (Active HIGH) Inputs (’F240) Inputs (’F241, ’F244) Outputs 1.0/1.667 1.0/1.667 1.0/1.667* 1.0/2.667* 600/106.6 (80) 20 mA/b1 mA 20 mA/b1 mA 20 mA/b1 mA 20 mA/b1.6 mA b 12 mA/64 mA (48 mA) *Worst-case ’F240 enabled; ’F241, ’F244 disabled Truth Tables ’F240 ’F244 OE1 D1n O1n OE2 D2n O2n OE1 D1n O1n OE2 D2n O2n H L L X H L Z L H H L L X H L Z L H H L L X H L Z H L H L L X H L Z H L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance ’F241 OE1 D1n O1n OE2 D2n O2n H L L X H L Z H L L H H X H L Z H L 3 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage Units Typ 2.0 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC VCC Conditions Max V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V 2.4 2.0 2.4 2.0 2.7 Min IIN e b18 mA V Min IOH IOH IOH IOH IOH IOL e 48 mA IOL e 64 mA e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.55 0.55 V Min IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 1.0 b 1.6 mA Max VIN e 0.5V (OE1, OE2, OE2, Dn (’F240)) VIN e 0.5V (Dn (’F241, ’F244)) IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current b 50 mA Max VOUT e 0.5V IOS Output Short-Circuit Current b 225 mA Max VOUT e 0V IZZ Bus Drainage Test 500 mA 0.0V VOUT e 5.25V 4.75 b 100 4 DC Electrical Characteristics Symbol (Continued) 54F/74F Parameter Min Typ Max Units VCC Conditions ICCH Power Supply Current (’F240) 19 29 mA Max VO e HIGH ICCL Power Supply Current (’F240) 50 75 mA Max VO e LOW ICCZ Power Supply Current (’F240) 42 63 mA Max VO e HIGH Z ICCH Power Supply Current (’F241, ’F244) 40 60 mA Max VO e HIGH ICCL Power Supply Current (’F241, ’F244) 60 90 mA Max VO e LOW ICCZ Power Supply Current (’F241, ’F244) 60 90 mA Max VO e HIGH Z AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay Data to Output (’F240) 3.0 2.0 5.1 3.5 7.0 4.7 3.0 2.0 9.0 6.0 3.0 2.0 8.0 5.7 tPZH tPZL Output Enable Time (’F240) 2.0 4.0 3.5 6.9 4.7 9.0 2.0 4.0 6.5 10.5 2.0 4.0 5.7 10.0 tPHZ tPLZ Output Disable Time (’F240) 2.0 2.0 4.0 6.0 5.3 8.0 2.0 2.0 6.5 12.5 2.0 2.0 6.3 9.5 tPLH tPHL Propagation Delay Data to Output (’F241, ’F244) 2.5 2.5 4.0 4.0 5.2 5.2 2.0 2.0 6.5 7.0 2.5 2.5 6.2 6.5 tPZH tPZL Output Enable Time (’F241, ’F244) 2.0 2.0 4.3 5.4 5.7 7.0 2.0 2.0 7.0 8.5 2.0 2.0 6.7 8.0 tPHZ tPLZ Output Disable Time (’F241, ’F244) 2.0 2.0 4.5 4.5 6.0 6.0 2.0 2.0 7.0 7.5 2.0 2.0 7.0 7.0 Units ns ns ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 240/241/244* Temperature Range Family 74F e Commercia 54F e Military S C X Special Variations QB e Military grade device with environmental and burn-in processing X e devices shipped in 13× reel Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC *MSA e Shrink Small Outline Package (EIAJ SSOP) (’244 only) SJ e Small Outline SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) NOTE: Not required for MSA package code 5 6 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 7 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M20B 20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M20D 8 Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline, EIAJ Type II (MSA) NS Package Number MSA20 20-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 9 54F/74F240 # 54F/74F241 # 54F/74F244 Octal Buffers/Line Drivers with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.