TI SN74LVC07A-Q1

SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
FEATURES
1
•
•
•
•
D OR PW PACKAGE
(TOP VIEW)
Qualified for Automotive Applications
Operates From 1.65 V to 3.6 V
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
DESCRIPTION/ORDERING INFORMATION
This hex buffer/driver is designed for 1.65-V to 3.6-V VCC operation.
The outputs of the SN74LVC07A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of
this device as a translator in a mixed-system environment.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOIC – D
Reel of 2500
SN74LVC07AQDRQ1
LVC07AQ
TSSOP – PW
Reel of 2000
SN74LVC07AQPWRQ1
LVC07AQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)
A
Y
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2007, Texas Instruments Incorporated
SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Output voltage range
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
–0.5
Continuous current through VCC or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
(1)
(2)
(3)
D package
86
PW package
113
–65
150
UNIT
°C/W
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
UNIT
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V
0.7
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
VCC = 2.7 V to 3.6 V
IOL
Low-level output current
TA
Operating free-air temperature
0.8
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
(1)
2
V
mA
24
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-Q1
SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 µA
0.2
1.65 V
0.45
2.3 V
0.7
2.7 V
0.4
3V
0.65
IOL = 12 mA
IOL = 24 mA
II
ICC
ΔICC
Ci
(1)
MAX
1.65 V to 3.6 V
IOL = 4 mA
VOL
MIN TYP (1)
VCC
UNIT
V
VI = 5.5 V or GND
3.6 V
±5
µA
VI = VCC or GND, IO = 0
3.6 V
10
µA
2.7 V to 3.6 V
500
µA
One input at VCC – 0.6 V, Other inputs at VCC or GND
VI = VCC or GND
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
MAX
MIN
MAX
1
3.5
1
2.8
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MIN
MAX
MIN
MAX
3
1
2.9
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance per buffer/driver
TEST
CONDITIONS
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
f = 10 MHz
1.8
2
2.5
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-Q1
UNIT
pF
3
SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
VCC = 1.8 V ± 0.15 V
2 × VCC
S1
1 kΩ
From Output
Under Test
Open
TEST
S1
tPZL (see Note F)
2 × VCC
tPLZ (see Note G)
2 × VCC
tPHZ/tPZH
2 × VCC
GND
CL = 30 pF
(see Note A)
1 kΩ
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VCC
VCC/2
tPZH
VCC
VCC/2
VOL
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
VOL + 0.15 V
VOL
tPHZ
VCC/2
VCC
VCC − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-Q1
SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
2 × VCC
S1
500 Ω
From Output
Under Test
Open
TEST
S1
tPZL (see Note F)
2 × VCC
tPLZ (see Note G)
2 × VCC
tPHZ/tPZH
2 × VCC
GND
CL = 30 pF
(see Note A)
500 Ω
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VCC
VCC/2
tPZH
VCC
VCC/2
VOL
VOL + 0.15 V
VOL
tPHZ
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
VCC/2
VCC
VCC − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-Q1
5
SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 and 3.3 V ± 0.3 V
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPZL (see Note F)
6V
tPLZ (see Note G)
6V
tPHZ/tPZH
6V
LOAD CIRCUIT
tw
2.7 V
2.7 V
Timing
Input
0V
0V
2.7 V
1.5 V
1.5 V
0V
1.5 V
1.5 V
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
3V
1.5 V
tPZH
3V
1.5 V
VOL
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPHL
1.5 V
2.7 V
1.5 V
tPZL
2.7 V
Output
VOLTAGE WAVEFORMS
PULSE DURATION
th
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
1.5 V
1.5 V
tsu
Data
Input
1.5 V
Input
Output
Waveform 2
S1 at 6 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
3V
1.5 V
2.7 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at 1.5 V.
G. tPLZ is measured at VOL + 0.3 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC07AQPWRQ1
ACTIVE
TSSOP
PW
Pins Package Eco Plan (2)
Qty
14
2000
Pb-Free
(RoHS)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated