NSC LMX2531LQ2080E

LMX2531
PLLatinum™ High Performance Frequency Synthesizer
System with Integrated VCO
General Description
Features
The LMX2531 is a low power, high performance frequency
synthesizer system which includes a fully integrated deltasigma PLL and VCO with fully integrated tank circuit. The
third and fourth poles are also integrated and also adjustable. Also included are integrated ultra-low noise and high
precision LDOs for the PLL and VCO which give higher
supply noise immunity and also more consistent performance. When combined with a high quality reference oscillator, the LMX2531 generates very stable, low noise local
oscillator signals for up and down conversion in wireless
communication devices. The LMX2531 is a monolithic integrated circuit, fabricated in an advanced BiCMOS process.
There are actually several different versions of this product,
for which the primary difference is frequency range.
Device programming is facilitated using a three-wire
MICROWIRE Interface that can operate down to 1.8 volts.
Supply voltage range is 2.8 to 3.2 Volts. The LMX2531 is
available in a 36 pin 6x6x0.8 mm Lead-Free Leadless Leadframe Package (LLP).
Multiple Frequency Options Available
— See Selection Guide Below
— Frequencies from: 765 MHz - 2790 MHz
Target Applications
n 3G Cellular Base Stations (WCDMA,
TD-SCDMA,CDMA2000)
n 2G Cellular Base Stations (GSM/GPRS, EDGE,
CDMA1xRTT)
n Wireless LAN
n Broadband Wireless Access
n Satellite Communications
n Wireless Radio
n Automotive
n CATV Equipment
n Instrumentation and Test Equipment
n RFID Readers
PLL Features
— Fractional-N Delta Sigma Modulator Order
programmable up to 4th order
— FastLock/Cycle Slip Reduction with Timeout Counter
— Partially integrated, adjustable Loop Filter
— Very low phase noise and spurs
VCO Features
— Integrated tank inductor
— Low phase noise
Other Features
— 2.8 V to 3.2 V Operation
— Low Power-Down Current
— 1.8V MICROWIRE Support
— Package: 36 Lead LLP
Part
Low Band
High Band
LMX2531LQ1570E
765 - 818 MHz
1530 - 1636 MHz
LMX2531LQ1650E
795 - 850 MHz
1590 - 1700 MHz
LMX2531LQ1700E
831 - 885 MHz
1662 - 1770 MHz
LMX2531LQ1778E
863 - 920 MHz
1726 - 1840 MHz
LMX2531LQ1910E
917 - 1014 MHz
1834 - 2028 MHz
LMX2531LQ2080E
952 - 1137 MHz
1904 - 2274 MHz
LMX2531LQ2265E 1089 - 1200 MHz 2178 - 2400 MHz
LMX2531LQ2570E 1168 - 1395 MHz 2336 - 2790 MHz
PLLatinum™ is a trademark of National Semiconductor Corporation.
© 2005 National Semiconductor Corporation
DS201011
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LMX2531 High Performance Frequency Synthesizer System with Integrated VCO
October 2005
LMX2531
Functional Block Diagram
20101101
Connection Diagram
36-Pin LLP (LQ) Package
20101102
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2
LMX2531
Pin Descriptions
Pin
Number
Pin Name
I/O Description
1
VccDIG
-
Power Supply for digital LDO circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors should be
placed as close as possible to this pin and ground.
3
GND
-
Ground
2,4,5,7,
12,
13,
29, 35
NC
-
No Connect.
6
VregBUF
-
Internally regulated voltage for the VCO buffer circuitry. Connect to ground with a capacitor.
8
DATA
I
MICROWIRE serial data input. High impedance CMOS input. This pin must not exceed 2.75V. Data is
clocked in MSB first. The last bits clocked in form the control or register select bits.
9
CLK
I
MICROWIRE clock input. High impedance CMOS input. This pin must not exceed 2.75V. Data is
clocked into the shift register on the rising edge.
10
LE
I
MICROWIRE Latch Enable input. High impedance CMOS input. This pin must not exceed 2.75V.
Data stored in the shift register is loaded into the selected latch register when LE goes HIGH.
11
CE
I
Chip Enable Input. High impedance CMOS input. This pin must not exceed 2.75V. When CE is
brought high the LMX2531 is powered up corresponding to the internal power control bits. It is
necessary to reprogram the R0 register to get the part to re-lock.
14, 15
NC
-
No Connect. Do NOT ground.
16
VccVCO
-
Power Supply for VCO regulator circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors should
be placed as close as possible to this pin and ground.
17
VregVCO
-
Internally regulated voltage for VCO circuitry. Not intended to drive an external load. Connect to
ground with a capacitor and some series resistance.
18
VrefVCO
-
Internal reference voltage for VCO LDO. Not intended to drive an external load. Connect to ground
with a capacitor.
19
GND
-
Ground for the VCO circuitry.
20
GND
-
Ground for the RF Output Buffer circuitry.
21
Fout
O Buffered RF Output for the VCO.
22
VccBUF
-
Power Supply for the VCO Buffer circuitry. Input may range from 2.8 - 3.2 V. Bypass capacitors
should be placed as close as possible to this pin and ground.
23
Vtune
I
Tuning voltage input for the VCO. For connection to the CPout Pin through an external passive loop
filter.
24
CPout
O Charge pump output for PLL. For connection to Vtune through an external passive loop filter.
25
FLout
O An open drain NMOS output which is used for FastLock or a general purpose output.
26
VregPLL1
-
Internally regulated voltage for PLL charge pump. Not intended to drive an external load. Connect to
ground with a capacitor.
27
VccPLL
-
Power Supply for the PLL. Input may range from 2.8 - 3.2 V. Bypass capacitors should be placed as
close as possible to this pin and ground.
28
VregPLL2
-
Internally regulated voltage for RF digital circuitry. Not intended to drive an external load. Connect to
ground with a capacitor.
30
Ftest/LD
31
OSCin
32
OSCin*
O Multiplexed CMOS output. Typically used to monitor PLL lock condition.
I
Oscillator input. The oscillator can be placed in either single-ended or differential mode of operation.
I
Oscillator complimentary input. When a single ended source is used, then a bypass capacitor should
be placed as close as possible to this pin and be connected to ground.
33
Test
O This pin if for test purposes and should be grounded for normal operation.
34
GND
-
Ground
36
VregDIG
-
Internally regulated voltage for LDO digital circuitry.
3
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LMX2531
Connection Diagram
20101111
Pin(s)
Application Information
VccDIG
VccVCO
VccBUF
VccPLL
Because the LMX2531 contains internal regulators, the power supply noise rejection is very good and
capacitors at this pin are not critical. If desired, capacitors can be placed at these pins to improve the noise
rejection. Recommended values are from open to 1 µF.
VregDIG
There is not really any reason to use any other values than the recommended values.
VrefVCO
If the VregVCO capacitor is changed, it is recommended to keep this capacitor between 1/100 and 1/1000 of
the value of the VregVCO capacitor.
VregVCO
Because this pin is the output of a regulator, there are be stability concerns if there is not sufficient series
resistance. For ceramic capacitors the ESR (Equivalent Series Resistance) is too low, and it recommended
that a series resistance of 1 - 3.3Ω is necessary. If there is insufficient ESR, then there may be degradation in
the phase noise, especially in the 100 - 300 kHz offset. Recommended values are from 1 µF to 10 µF.
VregPLL1
VregPLL2
The choice of the capacitor value at this pin involves a trade-off between integer spurs and phase noise in the
100 - 300 kHz offset range. If too much series resistance is at this pin, the spurs at far offset will be severely
degraded. If there is too little, the phase noise may be degraded. A 470 nF capacitor in series with 220 mΩ
provides optimal spurs with a minimal degradation in phase noise, although these optimal values may be
design specific.
CLK
DATA
LE
Since the maximum voltage on these pins is less than the minimum Vcc voltage, level shifting may be
required, if the output voltage of the microcontroller is too high. This can be accomplished with a resistive
divider.
CE
As with the CLK, DATA, and LE pins, level shifting may be required if the output voltage of the microcontroller
is too high. A resistive divider is or a series diode are two ways to accomplish this. The diode has the
advantage that no current flows through it when the chip is powered down.
Ftest/LD
It is an option to use the lock detect information from this pin.
Fout
This is the high frequency output. This needs to be AC coupled, and matching may also be required. The
value of the DC blocking capacitor may be changed, depending on the output frequency.
CPout
Vtune
In most cases, it is sufficient to short these together. C1_LF, C2_LF, and R2_LF are used in conjunction with
the internal loop filter to make a fourth order loop filter. However, the user always has the option of adding
additional poles.
R2pLF
This is the fastlock resistor, which can be useful in many cases, since the spurs are often better with low
charge pump currents, and the internal loop filter can be adjusted during fastlock.
OSCin
This is the crystal oscillator input pin. It needs to be AC coupled.
OSCin*
If the device is being driven single-ended, this pin needs to be shunted to ground with a capacitor.
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4
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Parameter
Symbol
Ratings
Units
-0.3 to 3.5
Power Supply Voltage
VCC
(VccDIG, VccVCO,
VccBUF, VccPLL)
All other pins (Except
Ground)
-0.3 to 3.0
Storage Temperature
Range
TSTG
-65 to 150
˚C
Lead Temperature (solder 4 sec.)
TL
+ 260
˚C
V
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
Power Supply Voltage
(VccDig, VccVCO, VccBUF)
Vcc
2.8
3.0
3.2
V
Serial Interface and Power Control
Voltage
Vi
0
2.75
V
Ambient Temperature
(Note 3)
TA
-40
+85
˚C
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical
Characteristics. The guaranteed specifications apply only to the test conditions listed.
5
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LMX2531
Absolute Maximum Ratings (Note 1)
LMX2531
Electrical Characteristics
Symbol
Parameter
ICC
Power Supply Current
(All Parts Except
LMX2531LQ2265E,
LMX2531LQ2570E)
(VCC = 3.0 V, -40˚C ≤ TA ≤ 85 ˚C; except as specified.)
Conditions
Min
Typ
Max
Divider Disabled
34
41
Divider Enabled
37
46
Power Supply Current
(LMX2351LQ2265E,
LMX2531LQ2570E)
Divider Disabled
38
44
Divider Enabled
41
49
ICCPD
Power Down Current
CE = 0 V, Part Initialized
7
IIHOSC
Oscillator Input High Current
VIH = 2.75 V
IILOSC
Oscillator Input Low Current
VIL = 0
Units
Current Consumption
mA
µA
Oscillator
100
-100
µA
µA
fOSCin
Frequency Range
5
80
MHz
vOSCin
Oscillator Sensitivity
0.5
2.0
Vpp
20
MHz
PLL
fCOMP
Phase Detector Frequency
ICP = 0
90
µA
ICPout
Charge Pump
Output Current Magnitude
ICP = 1
180
µA
ICP = 3
360
µA
ICP = 15
1510
ICPoutTRI
CP TRI-STATE Current
0.4 V < VCPout < 2.0 V
2
10
nA
ICPoutMM
Charge Pump
Sink vs. Source Mismatch
VCPout = 1.2 V
TA = 25˚C
2
8
%
ICPoutV
Charge Pump
Current vs. CP Voltage Variation
0.4 V < VCPout < 2.0 V
TA = 25˚C
4
%
ICPoutT
CP Current vs. Temperature
Variation
VCPout = 1.2 V
8
%
ICP = 1X Charge Pump Gain
4 kHz Offset
-202
LN(f)
Normalized Phase Noise
Contribution
(Note 2)
ICP = 16X Charge Pump Gain
4 kHz Offset
-212
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6
µA
dBc/Hz
Symbol
Parameter
Conditions
(Continued)
Min
Typ
Max
Units
VCO Frequencies
fFout
Operating Frequency Range
(All options have a frequency
divider, this applies before the
divider. The frequency after the
divider is half of what is shown)
LMX2531LQ1570E
1530
1636
LMX2531LQ1650E
1590
1700
LMX2531LQ1700E
1662
1770
LMX2531LQ1778E
1726
1840
LMX2531LQ1910E
1834
2028
LMX2531LQ2080E
1904
2274
LMX2531LQ2265E
2178
2400
LMX2531LQ2570E
2336
2790
MHz
Other VCO Specifications
∆TCL
Continuous Lock Temperature
Range
(Note 3)
LMX2531LQ1570E, LMX2531LQ1650E
90
LMX2531LQ1700E, LMX2531LQ1778E,
LMX2531LQ1910E, LMX2531LQ2080E,
LMX2531LQ2265E,LMX2531LQ2570E
125
LMX2531LQ1570E
2.0
4.5
8.0
LMX2531LQ1650E
2.0
4.5
8.0
LMX2531LQ1700E
1.0
3.5
7.0
LMX2531LQ1778E
1.0
3.5
7.0
1.0
3.5
7.0
LMX2531LQ2080E
1.0
3.5
7.0
LMX2531LQ2265E
1.0
3.5
7.0
LMX2531LQ2570E
0.0
3.0
6.0
LMX2531LQ1910E
pFout
Output Power to a 50Ω/5pF Load
(Applies across entire tuning
range.)
LMX2531LQ1570E
1.0
2.5
6.0
1.0
2.5
6.0
LMX2531LQ1700E
1.0
3.0
6.0
1.0
3.0
6.0
1.0
3.0
6.0
LMX2531LQ2080E
0.0
2.5
5.0
LMX2531LQ2265E
1.0
2.5
5.0
LMX2531LQ2570E
-1.0
1.5
4.0
LMX2531LQ1910E
KVtune
HSFout
Divider Enabled
LMX2531LQ1570E
4-7
LMX2531LQ1650E
4-7
LMX2531LQ1700E
6-10
LMX2531LQ1778E
6-10
LMX2531LQ1910E
8-14
LMX2531LQ2080E
9-20
LMX2531LQ2265E
10-17
LMX2531LQ2570E
10-23
2nd Harmonic, 50Ω /
5pF Load
Harmonic Suppression
(Applies Across Entire Tuning
Range)
Divider Disabled
LMX2531LQ1650E
LMX2531LQ1778E
Fine Tuning Sensitivity
(When a range is displayed in the
typical column, indicates the lower
sensitivity is typical at the lower
end of the tuning range, and the
higher tuning sensitivity is typical
at the higher end of the tuning
range.)
˚C
3rd Harmonic, 50Ω /
5pF Load
-30
-25
Divider Enabled
-20
-15
Divider Disabled
-40
-35
Divider Enabled
LMX2531LQ1570E
LMX2531LQ1650E
-20
-15
Divider Enabled
All Other Options
-25
-20
300
Frequency Pushing
Creg = 0.1uF, VDD ± 100mV, Open Loop
PULLFout
Frequency Pulling
VSWR=2:1, Open Loop
ZFout
Output Impedance
7
dBc
kHz/V
± 600
50
dBm
MHz/V
Divider Disabled
PUSHFout
dBm
kHz
Ω
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LMX2531
Electrical Characteristics (VCC = 3.0 V, -40˚C ≤ TA ≤ 85 ˚C; except as specified.)
LMX2531
Electrical Characteristics (VCC = 3.0 V, -40˚C ≤ TA ≤ 85 ˚C; except as specified.)
Symbol
Parameter
Conditions
(Continued)
Min
Typ
Max
Units
VCO Frequencies
VCO Phase Noise (Note 4)
10 kHz Offset
fFout = 1583 MHz
DIV2 = 0
L(f)Fout
Phase Noise
(LMX2531LQ1570E)
fFout = 791.5 MHz
DIV2 = 1
fFout = 1645 MHz
DIV2 = 0
L(f)Fout
Phase Noise
(LMX2531LQ1650E)
fFout = 822.5 MHz
DIV2 = 1
fFout = 1716 MHz
DIV2 = 0
L(f)Fout
Phase Noise
(LMX2531LQ1770E)
fFout = 858 MHz
DIV2 = 1
fFout = 1783 MHz
L(f)Fout
Phase Noise
(LMX2531LQ1778E)
fFout = 891.5 MHz
fFout = 1931
L(f)Fout
Phase Noise
(LMX2531LQ1910E)
fFout = 965.5
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8
-93
100 kHz Offset
-118
1 MHz Offset
-140
5 MHz Offset
-154
10 kHz Offset
-99
100 kHz Offset
-122
1 MHz Offset
-144
5 MHz Offset
-155
10 kHz Offset
-93
100 kHz Offset
-118
1 MHz Offset
-140
5 MHz Offset
-154
10 kHz Offset
-99
100 kHz Offset
-122
1 MHz Offset
-144
5 MHz Offset
-155
10 kHz Offset
-92
100 kHz Offset
-117
1 MHz Offset
-139
5 MHz Offset
-153
10 kHz Offset
-98
100 kHz Offset
-122
1 MHz Offset
-144
5 MHz Offset
-154
10 kHz Offset
-92
100 kHz Offset
-117
1 MHz Offset
-139
5 MHz Offset
-152
10 kHz Offset
-97
100 kHz Offset
-122
1 MHz Offset
-144
5 MHz Offset
-154
10 kHz Offset
-89
100 kHz Offset
-115
1 MHz Offset
-138
5 MHz Offset
-151
10 kHz Offset
-95
100 kHz Offset
-121
1 MHz Offset
-143
5 MHz Offset
-155
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Symbol
Parameter
Conditions
(Continued)
Min
Typ
Max
Units
VCO Frequencies
fFout = 2089 MHz
L(f)Fout
Phase Noise
(LMX2531LQ2080E)
fFout = 1044.5 MHz
fFout = 2264 MHz
L(f)Fout
Phase Noise
(LMX2531LQ2265E)
fFout = 1132 MHz
fFout = 2563 MHz
L(f)Fout
Phase Noise
(LMX2531LQ2570E)
fFout = 1281.5 MHz
9
10 kHz Offset
-87
100 kHz Offset
-113
1 MHz Offset
-136
5 MHz Offset
-150
10 kHz Offset
-93
100 kHz Offset
-119
1 MHz Offset
-142
5 MHz Offset
-154
10 kHz Offset
-90
100 kHz Offset
-114
1 MHz Offset
-137
5 MHz Offset
-151
10 kHz Offset
-95
100 kHz Offset
-118
1 MHz Offset
-142
5 MHz Offset
-152
10 kHz Offset
-86
100 kHz Offset
-112
1 MHz Offset
-135
5 MHz Offset
-149
10 kHz Offset
-91
100 kHz Offset
-117
1 MHz Offset
-139
5 MHz Offset
-152
dBc/Hz
dBc/Hz
dBc/Hz
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LMX2531
Electrical Characteristics (VCC = 3.0 V, -40˚C ≤ TA ≤ 85 ˚C; except as specified.)
LMX2531
Electrical Characteristics (VCC = 3.0 V, -40˚C ≤ TA ≤ 85 ˚C; except as specified.)
Symbol
Parameter
Conditions
(Continued)
Min
Typ
Max
Units
2.75
V
0.4
V
Digital Interface (DATA, CLK, LE, CE, Ftest/LD, FLout)
VIH
High-Level Input Voltage
VIL
Low-Level Input Voltage
IIH
High-Level Input Current
VIH = 1.75
-3.0
3.0
µA
IIL
Low-Level Input Current
VIL = 0 V
-3.0
3.0
µA
VOH
High-Level Output Voltage
IOH = 500 µA
2.0
VOL
Low-Level Output Voltage
1.6
IOL = -500 µA
V
0.4
V
MICROWIRE Timing
tCS
Data to Clock Set Up Time
See Data Input Timing
25
ns
tCH
Data to Clock Hold Time
See Data Input Timing
20
ns
tCWH
Clock Pulse Width High
See Data Input Timing
25
ns
tCWL
Clock Pulse Width Low
See Data Input Timing
25
ns
tES
Clock to Enable Set Up Time
See Data Input Timing
25
ns
tCES
Enable to Clock Set Up Time
See Data Input Timing
25
ns
tEWH
Enable Pulse Width High
See Data Input Timing
25
ns
Note 2: Normalized Phase Noise Contribution is defined as: LN(f) = L(f) – 20log(N) – 10log(Fcomp) where L(f) is defined as the single side band phase noise
measured at an offset frequency, f, in a 1 Hz Bandwidth and Fcomp is the comparison frequency of the synthesizer. The offset frequency, f, must be chosen
sufficiently smaller then the PLL’s loop band-width, and large enough to avoid a substantial noise contribution from the reference.
Note 3: Continuous Lock Temperature Range is how far the temperature can drift in either direction from it’s original value at the time of the part being programmed,
before the PLL has to be reprogrammed. The action of programming the R0 register activates a calibration routine. However, if this register is not reprogrammed,
the temperature drift spec applies. Note that regardless of what temperature the part was initially programmed at, the temperature can never drift outside the
frequency range of -40˚C ≤TA≤ 85˚C without violating specifications.
Note 4: The VCO phase noise is measured assuming that the loop bandwidth is sufficiently narrow that the VCO noise dominates. The maximum limits apply only
at center frequecy and over temperature, assuming that the part is reloaded at each test frequency. Over frequency, the phase noise can vary 1-2 dB, with the worst
case performance typically occurring at the highest frequency. Over temperature, the phase noise typically varies 1-2 dB, assuming the part is reloaded.
Serial Data Timing Diagram
20101103
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10
The LMX2531 is a low power, high performance frequency
synthesizer system which includes the PLL, VCO, and partially integrated loop filter. Section 2.0 on programming describes the bits mentioned in this section in more detail.
1.1 Reference Oscillator Input
Because the VCO frequency calibration algorithm is based
on clocks from the OSCin pin, there are certain bits that need
to be set depending on the OSCin frequency.
XTLSEL ( R6[22:20] ) and XTLDIV ( R7[9:8] ) are both need
to be set based on the OSCin frequency. For the
LMX2531LQ2080E and the LMX2531LQ2570E, the
XTLMAN[11:0] and XTLMAN2.
The gain of the VCO can change considerably over frequency. It is lowest at the minimum frequency and highest at
the maximum frequency. This range is specified in the
datasheet. When designing the loop filter, the following
method is recommended. First, take the gemetric mean of
the minimum and maximum frequencies that are to be used.
Then use a linear approximation to extrapolate the VCO
gain. An example is in order. Suppose the application requires the LMX2531LQ2080E PLL to tune from 2100 to 2150
MHz. The geometric mean of these freqeuncies is sqrt(2100
x 2150) MHz = 2125 MHz. The VCO gain is specified as 9
MHz/V at 1904 MHz and 20 MHz/V at 2274 MHz. Over this
range of 370 MHz, the VCO gain changes 11 MHz/volt. So at
2125 MHz, the VCO gain would be approximately 9 + (21251904)* 11/370 = 15.6 MHz/V. Although the VCO gain can
change from part to part, this variation is small to how much
the VCO gain can change over frequency.
1.2 R Divider
The R divider divides the OSCin frequency down to the
phase detector frequency. The only valid R counter values
are 2, 4, 8, 16, and 32. The R divider also has an impact on
the fractional modulus that can be used, if it is greater than 8.
1.3 N Divider
The N divider on the LMX2531 is fractional and can achieve
any fractional denominator between 1 and 4,194,303 using a
delta-sigma modulator of selectable order of 2, 3, or 4.
Depending on the prescaler used, there are restrictions on
how small the N counter can be.
1.4 Phase Detector
The phase detector compares the outputs of the R and N
counters and puts out a correction current corresponding to
the phase error. The choice of the phase detector freqeuncy
does have an impact on performance.
1.7 Programmable Divide by 2
All options of the LMX2531 offer a divide by 2 option. This
allows the user to get exactly half of the VCO frequency. In
order to use this feature, the VCO is programmed to it’s
non-divided frequency. Note that R0 register should be reprogrammed the first time after the DIV2 bit is enabled or
disabled for optimal phase noise performance.
1.5 Partially Integrated Loop Filter
The LMX2531 integrates the third pole (formed by R3 and
C3) and fourth pole (formed by R4 and C4) of the loop filter.
This loop filter can be enabled or bypassed using the
EN_LPFLTR ( R6[15] ). The values for C3, C4, R3, and R4
can also be programmed independently through the MICROWIRE interface . Also, the values for R3 and R4 can be
changed during FastLock, for minimum lock time. It is recommended that the integrated loop filter be set to the maximum possible attenuation (R3=R4=40kΩ, C3=C4=100pF),
the internal loop filter is more effective at reducing certain
spurs than the external loop filter. However, the attenuation
of the internal loop filter is too high, it limits the maximum
attainable loop bandwidth that can be achieved, which corresponds to the case where the shunt loop filter capacitor,
C1, is zero. Increasing the charge pump current and/or the
comparison frequency increases the maximum attainable
loop bandwidth when desigining with the integrated filter.
Furthermore, this often allows the loop filter to be better
optimized and have stronger attenuation. If the charge pump
current and comparison frequency are already as high as
they go, and the maximum attainable loop bandwidth is still
too low, the resistor and capacitor values can be decreased
or the internal loop filter can even be bypassed. For design
tools and more information on partially integrated loop filters,
go to wireless.national.com.
1.8 Choosing the Charge Pump Current and
Comparison Frequency
The LMX2531 has 16 levels of charge pump currents and a
highly flexible fractional modulus. This gives the user many
degrees of freedom. This section discusses some of the
design considerations. From the perspective of the PLL
noise, choosing the charge pump current and comparison
frequency as high as possible are best for optimal phase
noise performance. The far out PLL noise improves 3 dB for
every doubling of the comparison frequency, but at lower
offsets, this effect is much less due to the PLL 1/f noise.
Increasing the charge pump current inproves the phase
noise about 3 dB per doubling of the charge pump current,
although there are small diminishing returns as the charge
pump current goes higher.
So, from a loop filter design perspective and from a PLL
phase noise perspective, one might think to always design
with the highest possible comparison frequency and charge
pump current. However, if one considers the worst case
fractional spurs that occur at an output frequency equal to 1
channel spacing away from a multiple of the OSCin frequency, then this gives reason to reconsider. If the comparison frequency or charge pump currents are too high, then
these spurs could be degraded, and the loop filter may not
be able to filter these spurs as well as theoretically predicted.
For optimal spur performance, a comparison frequency in
the ballpark of 2.5 MHz and a charge pump current of 1X are
recommended.
1.6 Low Noise, Fully Integrated VCO
The LMX2531 includes a fully integrated VCO, including the
inductors. In order for optimum phase noise performance,
this VCO has frequency and phase noise calibration algo-
11
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LMX2531
rithms. The VCO internally divides up the frequency range
into several bands, in order to achieve a lower tuning gain,
and therefore better phase noise performance. The frequency calibration routine is activated any time that the R0
register is programmed. If the temperature shifts considerably and the R0 register is not programmed, then it can not
drift more than continuous lock temperature range, ∆TCL, or
else the VCO is not guaranteed to stay in lock. There is also
a routine for optimum phase noise performance as well, for
each
version
of
the
LMX2531,
the
VCO_ACI_SEL bit ( R6[19:16] ) needs to be set to the
correct value to ensure the best possible phase noise.
1.0 Functional Description
LMX2531
2.0 General Programming Information
The LMX2531 is programmed using 14 24-bit registers used to control the LMX2531 operation. A 24-bit shift register is used as
a temporary register to indirectly program the on-chip registers. The shift register consists of a data field and an address field. The
last 4 register bits, CTRL[3:0] form the address field, which is used to decode the internal register address. The remaining 20 bits
form the data field DATA[19:0]. While LE is low, serial data is clocked into the shift register upon the rising edge of clock (data is
programmed MSB first). When LE goes high, data is transferred from the data field into the selected register bank.
Although there are actually 14 registers in this part, only a portion of them should be programmed, since the state of the other
hidden registers (R13, R11, and R10) are set during the initialization sequence. Although it is possible to program these hidden
registers, as well as a lot of bits that are defined to either ’1’ or ’0’, the user should not experiment with these bits, since doing so
may easily lead to degraded performance. The optimal settings for these bits have already been found, and not programming
them would not be consistent with how the part is tested.
DATA[19:0]
CONTROL[3:0]
MSB
LSB
D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 C3 C2 C1
C0
2.01 Register Location Truth Table
C3
C2
C1
C0
Data Address
1
1
0
0
R12
1
0
0
1
R9
1
0
0
0
R8
0
1
1
1
R7
0
1
1
0
R6
0
1
0
1
R5
0
1
0
0
R4
0
0
1
1
R3
0
0
1
0
R2
0
0
0
1
R1
0
0
0
0
R0
2.02 Initialization Sequence
The initial loading sequence from a cold start is described below. The registers must be program in order shown.
REGISTER
23 22 21 20 19 18 17 16 15 14 13 12
11
10
9
8
7
6
5
4
DATA[19:0]
3
2
1
0
C3 C2 C1 C0
R5
INIT1
1
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
R5
INIT2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
R5
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
1
0
1
R12
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
0
1
0
0
0
1
1
0
0
R9
See individual section for R9 programming information.
1
0
0
1
R8
See individual section for Register R8 programming information.
Register R8 only needs to be programmed for a few options of the LMX2531 and
and only in the case that the OSCin frequency is greater than 40 MHz.
1
0
0
0
R7
See individual section for Register R7 programming information.
0
1
1
1
R6
See individual section for Register R6 programming information.
0
1
1
0
R4
See individual section for Register R4 programming information.
Register R4 only needs to be program if FastLock is used.
0
1
0
0
R3
See individual section for Register R3 programming information.
0
0
1
1
R2
See individual section for Register R2 programming information.
0
0
1
0
R1
See individual section for Register R1 programming information.
0
0
0
1
R0
See individual section for Register R0 programming information.
0
0
0
0
Note: There must be a minimum of 10 mS between the time when R5 is last loaded and when R1 is loaded to ensure time for
the LDOs to power up properly.
2.03 Complete Register Content Map
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12
0
0
0
0
R8
R9
R12
R5
R7
1
R4
0
0
R3
R6
FDM
R2
0
0
0
0
0
0
1
R1
N
[7:0]
0
0
0
XTLSEL
[2:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
VCO_ACI_SEL
[3:0]
0
FoLD
[3:0]
DEN
[11:0]
N
[10:8]
15
ORDER
[1:0]
ICP
[3:0]
0
0
0
XTLMAN
[11:0]
16
17
18
19
ICPFL
[3:0]
DITHER
[1:0]
0
0
0
R0
PRESC16
DIV2
20
EN_LPFLTR
21
0
0
0
0
0
0
0
0
11
0
0
0
0
1
0
R4_ADJ_FL
[1:0]
0
12
TOC
[13:0]
NUM
[11:0]
10
1
0
0
0
1
0
1
0
XTLDIV
[1:0]
0
R3_ADJ
[1:0]
8
R
[5:0]
7
1
1
0
0
R3_ADJ_FL
[1:0]
DEN
[21:12]
NUM
[21:12]
9
EN_PLLLDO1
13
DATA[19:0]
R4_ADJ
[1:0]
0
14
EN_DIGLDO
22
EN_PLLLDO2
23
EN_VCOLD
REGISTER
0
0
0
0
6
EN_OSC
0
1
0
0
0
0
0
1
0
0
0
0
0
1
1
1
XTL
MAN2
0
0
0
1
0
0
1
1
1
0
0
0
2
C2
3
C3
0
C3_4_ADJ
[2:0]
4
5
EN_VCO
(Continued)
REG_RST
LDDIV4
EN_PLL
2.0 General Programming Information
1
0
0
0
1
1
0
0
1
1
0
0
C1
0
0
1
0
1
0
1
0
1
0
1
0
C0
LMX2531
13
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LMX2531
2.0 General Programming Information
(Continued)
2.1 REGISTER R0
Note that the action of programming the R0 register activates a calibration routine for the VCO. This calibration is necessary to
get the VCO to center the tuning voltage for optimal performance. If the temperature drifts considerably, then the PLL should stay
in lock, provided that the temperature drift specification is not violated.
2.1.1 NUM[10:0] and NUM[21:12] -- Fractional Numerator
The NUM word is split between the R0 register and R1 register. The Numerator bits determine the fractional numerator for the
delta sigma PLL. This value can go from 0 to 4095 when the FDM bit ( R3[22] ) is 0 (the other bits in this register are ignored),
or 0 to 4194303 when the FDM bit is 1.
NUM[21:12]
NUM[11:0]
Fractional
Numerator
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
409503
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
4096
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
...
...
4194303
Note that there are restrictions on the fractional numerator value depending on the R counter value. These restrictions are related
to the coarse tuning algorithm of the VCO. A numerator value of zero is the exception and is always allowed. If the R counter is
≤ 8, then there is no restriction on the fractional numerator. If R > 8, the LSB of the fractional numerator must be 0. If R > 16, the
two LSB bits of the fractional numerator must be 0. If R > 32, the three LSB bits of the fractional numerator must be 0. If this
becomes an issue, recall that smaller fractions can be expressed as larger ones. For instance, 1/65 can be expressed as 8/520.
2.1.2 N[7:0] and N[10:8]
The N counter is 11 bits. 8 of these bits are located in the R0 register, and the remaining 3 (MSB bits) are located in the R1
register. The LMX2531 consists of an A, B, and C counter, which work in conjunction with the prescaler in order to form the final
N counter value.
Operation with the 8/9/12/13 Prescaler
N[10:8]
N[7:0]
N Value
C
< 31
31
B
A
Values less than 31 are prohibited.
0
0
0
0
0
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
...
1023
Operation with the 16/17/20/21 Prescaler
N[10:8]
N[7:0]
N Value
C
< 55
55
B
A
Values less than 55 are prohibited.
0
0
0
0
0
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
...
2039
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14
LMX2531
2.0 General Programming Information
(Continued)
2.2 REGISTER R1
2.2.1 NUM[21:12]
These are the MSB bits in for the fractional numerator that already have been described.
2.2.2 N[10:8] -- 3 MSB Bits for the N Counter
These are the 2 MSB bits for the N counter, which were discussed in the R0 register section.
2.2.3 ICP[3:0] -- Charge Pump Gain
This bit programs the charge pump current when the charge pump gain. The current is programmable between 100uA and 1.6mA
in 100uA steps. In general, higher charge pump currents yield better phase noise for the PLL, but also can cause higher spurs.
ICP
Charge Pump State
Typical Charge Pump Current at 3 Volts (µA)
0
1X
95
1
2X
180
2
3X
285
3
4X
380
4
5X
475
5
6X
970
6
7X
665
7
8X
760
8
9X
855
9
10X
950
10
11X
1045
11
12X
1140
12
13X
1235
13
14X
1330
14
15X
1425
15
16X
1520
2.2.4 PRESC16 -- PLL Prescaler
PRESC16
Prescaler
Minimum Continuous Divide Ratio
Maximum VCO Frequency
(Before the Divider by 2)
0
8/9/12/13
31
1.2 GHz
1
16/17/20/21
55
3.0 GHz
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LMX2531
2.0 General Programming Information
(Continued)
2.3 REGISTER R2
2.3.1 R[5:0] -- R Counter Value
These bits determine the phase detector frequency. The OSCin frequency is divided by this R counter value. In single-ended
mode, values of 1-63 are allowed. In differential mode, only 1,2,4,8,16, and 32 are allowed.
R Value
R[5:0]
0-1,3,5-7,9-15
,17-31,33-63
Illegal State
2
0
0
0
0
1
0
4
0
0
0
1
0
0
8
0
0
1
0
0
0
16
0
1
0
0
0
0
32
1
0
0
0
0
0
2.3.2 DEN[21:12] and DEN[11:0]-- Fractional Denominator
These bits determine the fractional denominator. Note that the MSB bits for this word are in register R3. If the FDM bit is set to
0, DEN[21:12] are ignored.
DEN[21:12]
DEN[11:0]
Fractional
Denominator
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4095
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
4096
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
...
...
4194303
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16
LMX2531
2.0 General Programming Information
(Continued)
2.4 REGISTER R3
2.4.1 DEN[21:12] -- Extension for the Fractional Denominator
These are the MSB bits of the fractional denominator (DEN word), which have already been discussed.
2.4.2 FoLD[3:0] -- Multiplexed Output for Ftest/LD Pin
The FoLD[3:0] word is used to program the output of the FoLD Pin in accordance with the table below:
FoLD
Output Type
0
High Impedance
Function
Disabled
1
Push-Pull
Logical "High" State
2
Push-Pull
Logical "Low" State
3
Push-Pull
Digital Lock Detect
4
N/A
Reserved
5
Push-Pull
RF N Counter divided by 2
6
Open-Drain
Analog Lock Detect
7
Push-Pull
Analog Lock Detect
8
N/A
Reserved
9
N/A
Reserved
10
N/A
Reserved
11
N/A
Reserved
12
N/A
Reserved
13
N/A
Reserved
14
N/A
Reserved
15
N/A
Reserved
2.4.3 ORDER -- Order of Delta Sigma Modulator
This bit determines the order of the delta sigma modulator in the PLL. In general, higher order fractional modulators tend to
reduce the primary fractional spurs that occur at increments of the channel spacing, but can also create spurs that are at a fraction
of the channel spacing, if there is not sufficient filtering. The optimal choice of modulator order is very application specific,
however, a third order modulator is a good starting point if not sure what to try first.
ORDER
Delta Sigma Modulator Order
0
Fourth
1
Reset Modulator
(Integer Mode -- all fractions are ignored)
2
Second
3
Third
2.4.4 DITHER -- Dithering
Dithering is useful in reducing fractional spurs, especially those that occur a a fraction of the channel spacing. The only exception
is when the fractional numerator is zero. In this case, dithering usually is not a benefit. Dithering also can sometimes increase the
PLL phase noise by a fraction of a dB. In general, if dithering is disabled, phase noise may be slightly better inside the loop
bandwidth of the system, but spurs are likely to be worse too.
DITHER
Dithering Mode
0
Weak Dithering
1
Reserved
2
Strong Dithering
3
Dithering Disabled
2.4.5 FDM -- Fractional Denominator Mode
When this bit is set to 1, the 10 MSB bits for the fractional numerator and denominator are considered. Otherwise they are
ignored. When this bit is disabled, the current consumption is about 0.5 mA lower.
17
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LMX2531
2.0 General Programming Information
(Continued)
2.4.6 -- DIV2
When this bit is enabled on the appropriate option, the output of the VCO is divided by 2 on options that offer this feature. This
has a small impact on harmonic content and output power.
www.national.com
DIV2
VCO Output Frequency
0
Not Divided by 2
1
Divided by 2
18
LMX2531
2.0 General Programming Information
(Continued)
2.5 REGISTER R4
2.5.1 TOC[13:0] -- Time Out Counter for FastLock
When the value of this word is 3 or less, then FastLock is disabled, and this pin can only be used for general purpose I/O. When
this value is 4 or greater, the time out counter is engaged for the amount of phase detector cycles shown in the table below.
TOC Value
FLout Pin State
Timeout Count
0
High Impedance
0
1
Low
Always Enabled
2
Low
0
3
High
0
4
Low
4 X 2 Phase Detector
.
.
.
16383
Low
16383 X 2 Phase Detector
When this count is active, the FLout Pin is grounded, the FastLock current is engaged, and the resistors R3 and R4 are also
potentially changed. The table below summarizes the bits that control various values in and out of FastLock differences.
FastLock State
FLoutRF
Charge Pump Current
R3
R4
Steady State
High Impedance
ICP
R3_ADJ
R4_ADJ
Fastlock
Grounded
ICPFL
R3_ADJ_FL
R4_ADJ_FL
2.5.2 ICPFL[3:0] -- Charge Pump Current for Fastlock
When FastLock is enabled, this is the charge pump current that is used for faster lock time.
ICPFL
Fastlock Charge Pump State
Typical Fastlock Charge Pump Current at 3 Volts (µA)
0
1X
95
1
2X
190
2
3X
285
3
4X
380
4
5X
475
5
6X
570
6
7X
665
7
8X
760
8
9X
855
9
10X
950
10
11X
1045
11
12X
1140
12
13X
1235
13
14X
1330
14
15X
1425
15
16X
1520
19
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LMX2531
2.0 General Programming Information
(Continued)
2.6 REGISTER R5
2.6.1 EN_PLL -- Enable Bit for PLL
When this bit is set to 1, the PLL is powered up, otherwise, it is powered down.
2.6.2 EN_VCO -- Enable Bit for the VCO
When this bit is set to 1, the VCO is powered up, otherwise, it is powered down.
2.6.3 EN_OSC -- Enable Bit for the Oscillator Inverter
When this bit is set to 1 (default), the reference oscillator is powered up, otherwise it is powered down.
2.6.4 EN_VCOLDO -- Enable Bit for the VCO LDO
When this bit is set to 1 (default), the VCO LDO is powered up, otherwise it is powered down.
2.6.5 EN_PLLLDO1 -- Enable Bit for the PLLLDO 1
When this bit is set to 1 (default), the PLLLDO 1 is powered up, otherwise it is powered down.
2.6.6 EN_PLLLDO2 -- Enable Bit for the PLLLDO 2
When this bit is set to 1 (default), the PLLLDO 2 is powered up, otherwise it is powered down.
2.6.6 EN_PLLLDO2 -- Enable Bit for the PLLLDO 2
When this bit is set to 1 (default), the PLLLDO 2 is powered up, otherwise it is powered down.
2.6.7 EN_DIGLDO -- Enable Bit for the Digital LDO
When this bit is set to 1 (default), the Digital LDO is powered up, otherwise it is powered down.
2.6.8 REG_RST -- Resets all registers to default settings
This bit needs to be programmed three times to initialize the part. When this bit is set to one, all registers are set to default mode,
and the part is powered down. The second time the R5 register is programmed with REG_RST=0, the register reset is released
and the default states are still in the registers. However, since the default states for the blocks and LDOs is powered off, it is
therefore necessary to program R5 a third time so that all the LDOs and blocks can be programmed to a power up state.When
this bit is set to 1, all registers are set to the default modes, but part is powered down. For normal operation, this bit is set to 0.
Note that once this initialization is done, it is not necessary to initialize the part any more.
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20
LMX2531
2.0 General Programming Information
(Continued)
2.7 REGISTER R6
2.7.1 C3_C4_ADJ[2:0] -- Value for C3 and C4 in the internal Loop Filter
C3_C4_ADJ
C3 (pF)
0
50
C4 (pF)
50
1
50
100
2
50
150
3
100
50
4
150
50
5
100
100
6
50
150
7
50
150
2.7.2 R3_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R3 During Fastlock
R3_ADJ_FL Value
R3 Resistor During Fastlock (kΩ)
0
10
1
20
2
30
3
40
2.7.3 R3_ADJ[1:0] -- Value for Internal Loop Filter Resistor R3
R3_ADJ
R3 Value (kΩ)
0
10
1
20
2
30
3
40
2.7.4 R4_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R4 During Fastlock
R4_ADJ_FL
R4 Value during Fast Lock (kΩ)
0
10
1
20
2
30
3
40
2.7.5 R4_ADJ[1:0] -- Value for Internal Loop Filter Resistor R4
R4_ADJ
R4 Value (kΩ)
0
10
1
20
2
30
3
40
2.7.6 EN_LPFLTR-- Enable for Partially Integrated Internal Loop Filter
The Enable Loop Filter bit is used to enable/disable the 3rd and 4th pole on-chip loop filters.
EN_LPFLTR
3rd and 4th Poles of Loop Filter
0
disabled
(R3 = R4 = 0 ohms and C3 = C4 = 100 pF)
1
enabled
21
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LMX2531
2.0 General Programming Information
(Continued)
2.7.7 VCO_ACI_SEL
This bit is used to optimize the VCO phase noise. The recommended values are what are used for all testing purposes, and this
bit should be set as the table below instructs.
Part
VCO_ACI_SEL
LMX2531LQ1570E
LMX2531LQ1650E
LMX2531LQ1700E
LMX2531LQ1778E
LMX2531LQ1910E
LMX2531LQ2080E
8
LMX2531LQ2265E
LMX2531LQ2570E
6
2.7.8 XTLSEL[2:0] -- Crystal Select
XTLSEL
Crystal Frequency
0
< 20 MHz
1
30 - 50 MHz
2
50 - 70 MHz
3
> 70 MHz
4
Manual Mode
5
Reserved
6
Reserved
7
Reserved
The value of this word needs to be changed based on the frequency presented to the OSCin pin in accordance to the table above.
2.8 Register R7
2.8.1 XTLDIV[1:0] -- Division Ratio for Higher Crystal Frequencies
The VCO frequency calibration algorithm is clocked from the OSCin pin frequency. However, this frequency needs to be divided
down in accordance to the table below:
XTLDIV
Crystal Division Ratio
Crystal Range
0
Reserved
Reserved
1
Divide by 2
< 20 MHz
2
Divide by 4
20-40 MHz
3
Divide by 8
> 40 MHz
2.8.2 XTLMAN[11:0] -- Sets the calibration timing for lock time
With the exception of the parts listed in the table below, this bit should be set to zero for normal operation. For those parts in the
table. For fOSCin frequencies (expressed in MHz) not shown in the table, this bit value can be calculated as 16 X fOSCIN / Kbit.
Part
Kbit
LMX2531LQ2080E
LMX2531LQ2570E
fOSCin
10 MHz
20 MHz
30.72 Mhz
61.44 MHz
76.8 MHz
4.5
36
71
109
218
273
4.5
36
71
109
218
273
2.9 REGISTER R8
2.9.1 XTLMAN2 -- Calibration Select
In the case that manual mode for XTLSEL is selected and the OSCin frequency is greater than 40 MHz, this bit should be
enabled, otherwise it should be 0.
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22
LMX2531
2.0 General Programming Information
(Continued)
2.10 REGISTERS R9 and R12
2.10.1 LDDIV4- RF Digital Lock Detect Divide By 4
Because the digital lock detect function is based on a phase error, it becomes more difficult to detect a locked condition for larger
comparison frequencies. When this bit is enabled, it subdivides the RF PLL comparison frequency presented to the digital lock
detect circuitry by 4. This enables this circuitry to work at higher comparison frequencies. It is recommended that this bit be
enabled whenever the comparison frequency exceeds 20 MHz and RF digital lock detect is used. This does not apply to the IF
comparison frequency.
2.11 REGISTER R12
This register does not have user selectable bits. This register should be loaded as shown in section 2.02 Complete Register
Content Map.
23
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LMX2531
Physical Dimensions
inches (millimeters) unless otherwise noted
Leadless Leadframe Package (Bottom View)
Order Number LMX2531LQX for 2500 Unit Reel
Order Number LMX2531LQ for 250 Unit Reel
NS Package Number LQA036AA
Part
Marking
Part
Marking
LMX2531LQ1570E
311570EB
LMX2531LQ1910E
311910EB
LMX2531LQ1650E
311650EA
LMX2531LQ2080E
312080EB
LMX2531LQ1700E
311778EB
LMX2531LQ2265E
312265ED
LMX2531LQ1778E
311778EA
LMX2531LQ2570E
312570EC
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24
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LMX2531 High Performance Frequency Synthesizer System with Integrated VCO
Notes