54F/74F521 8-Bit Identity Comparator General Description Features The ’F521 is an expandable 8-bit comparator. It compares two words of up to eight bits each and provides a LOW output when the two words match bit for bit. The expansion input IA e B also serves as an active LOW enable input. Y Commercial Military 74F521PC 54F521DM (Note 2) Y Y Compares two 8-bit words in 6.5 ns typ Expandable to any word length 20-pin package Package Number Package Description N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F521SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F521SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ 74F521MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ type II Note 1: Devices also available in 13× reel. Use suffix e SCX, SJX and MSAX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB. Logic Symbols IEEE/IEC TL/F/9545 – 1 TL/F/9545 – 4 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9545 RRD-B30M75/Printed in U. S. A. 54F/74F521 8-Bit Identity Comparator May 1995 Unit Loading/Fan Out 54F/74F Pin Names A 0 – A7 B 0 – B7 IA e B OA e B Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Word A Inputs Word B Inputs Expansion or Enable Input (Active LOW) Identity Output (Active LOW) 1.0/1.0 1.0/1.0 1.0/1.0 50/33.3 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA b 1 mA/20 mA Truth Table Inputs Output IA e B A, B OA e B L L H H A e B* L H H H AiB A e B* AiB Connection Diagrams H e HIGH Voltage Level L e LOW Voltage Level *A0 e B0, A1 e B1, A2 e B2, etc. Logic Diagram Pin Assignment for DIP, SOIC, SSOP and Flatpak TL/F/9545–2 Pin Assignment for LCC TL/F/9545 – 5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. TL/F/9545–3 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEÉ Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage Typ Units VCC Conditions Max 2.0 V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V Min IIN e b18 mA V Min IOH e b1 mA IOH e b1 mA IOH e b1 mA VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 74F 10% VCC 74F 5% VCC VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.5 0.5 V Min IOL e 20 mA IOL e 20 mA IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current IOS Output Short-Circuit Current ICCH Power Supply Current 2.5 2.5 2.7 4.75 b 60 21 3 b 0.6 mA Max VIN e 0.5V b 150 mA Max VOUT e 0V 32 mA Max VO e HIGH AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Units Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay An or Bn to OA e B 3.0 4.5 7.0 7.0 10.0 10.0 3.0 4.0 14.0 15.0 3.0 4.0 11.0 11.0 ns tPLH tPHL Propagation Delay IA e B to OA e B 3.0 3.5 5.0 6.5 6.5 9.0 3.0 3.5 8.5 13.5 3.0 3.5 7.5 10.0 ns Applications Ripple Expansion TL/F/9545 – 6 Parallel Expansion TL/F/9545 – 7 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 521 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reel Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ MSA e Shrink Small Outline (EIAJ SSOP) Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) NOTE: Not required for MSA package code 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M20B 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M20D 20-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300× Wide) Molded Shrink Outline Package, EIAJ, Type II (MSA) NS Package Number MSA20 7 54F/74F521 8-Bit Identity Comparator Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. 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