NSC 74F573PC

54F/74F573
Octal D-Type Latch with TRI-STATEÉ Outputs
General Description
Features
The ’F573 is a high speed octal latch with buffered common
Latch Enable (LE) and buffered common Output Enable
(OE) inputs.
This device is functionally identical to the ’F373 but has
different pinouts.
Y
Y
Y
Y
Y
Commercial
Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
Useful as input or output port for microprocessors
Functionally identical to ’F373
TRI-STATE outputs for bus interfacing
Guaranteed 4000V minimum ESD protection
Package
Number
Military
74F573PC
54F573DM (Note 2)
Package Description
N20A
20-Lead (0.300× Wide) Molded Dual-In-Line
J20A
20-Lead Ceramic Dual-In-Line
74F573SC (Note 1)
M20B
20-Lead (0.300× Wide) Molded Small Outline, JEDEC
74F573SJ (Note 1)
M20D
20-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F573FM (Note 2)
W20A
20-Lead Cerpak
54F573LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbols
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9566–1
IEEE/IEC
TL/F/9566 – 3
TL/F/9566 – 2
TL/F/9566–4
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9566
RRD-B30M115/Printed in U. S. A.
54F/74F573 Octal D-Type Latch with TRI-STATE Outputs
August 1995
Unit Loading/Fan Out
54F/74F
Pin Names
D 0 – D7
LE
OE
O0 – O7
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Data Inputs
Latch Enable Input (Active HIGH)
TRI-STATE Output Enable Input
(Active LOW)
TRI-STATE Latch Outputs
1.0/1.0
1.0/1.0
20 mA/b0.6 mA
20 mA/b0.6 mA
1.0/1.0
20 mA/b0.6 mA
150/40(33.3)
b 3 mA/24 mA (20 mA)
Functional Description
The ’F573 contains eight D-type latches with 3-state output
buffers. When the Latch Enable (LE) input is HIGH, data on
the Dn inputs enters the latches. In this condition the latches are transparent, i.e., a latch output will change state each
time its D input changes. When LE is LOW the latches store
the information that was present on the D inputs a setup
time preceding the HIGH-to-LOW transition of LE. The 3state buffers are controlled by the Output Enable (OE) input.
When OE is LOW, the buffers are in the bi-state mode.
When OE is HIGH the buffers are in the high impedance
mode but this does not interfer with entering new data into
the latches.
Function Table
Inputs
Outputs
OE
LE
D
O
L
L
L
H
H
H
L
X
H
L
X
X
H
L
O0
Z
H e HIGH Voltage Level
L e LOW Voltage Level
X e Immaterial
O0 e Value stored from previous clock cycle
Logic Diagram
TL/F/9566 – 5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
ESD Last Passing Voltage (Min)
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
Typ
Units
2.0
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
74F 5% VCC
74F 5% VCC
VCC
Conditions
Max
V
Recognized as a HIGH Signal
0.8
V
Recognized as a LOW Signal
b 1.2
V
2.5
2.4
2.5
2.4
2.7
2.7
Min
IIN e b18 mA
V
Min
IOH
IOH
IOH
IOH
IOH
IOH
IOL e 20 mA
IOL e 24 mA
e
e
e
e
e
e
b 1 mA
b 3 mA
b 1 mA
b 3 mA
b 1 mA
b 3 mA
VOL
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.5
0.5
V
Min
IIH
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
IBVI
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
IIL
Input LOW Current
b 0.6
mA
Max
VIN e 0.5V
IOZH
Output Leakage Current
50
mA
Max
VOUT e 2.7V
IOZL
Output Leakage Current
b 50
mA
Max
VOUT e 0.5V
IOS
Output Short-Circuit Current
b 150
mA
Max
VOUT e 0V
IZZ
Bus Drainage Test
500
mA
0.0V
VOUT e 5.25V
ICCL
Power Supply Current
35
55
mA
Max
VO e LOW
ICCZ
Power Supply Current
35
55
mA
Max
VO e HIGH Z
4.75
b 60
3
AC Electrical Characteristics
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Units
Min
Typ
Max
Min
Max
Min
Max
tPLH
tPHL
Propagation Delay
Dn to On
3.0
2.0
5.3
3.7
7.0
6.0
3.0
2.0
9.0
7.0
3.0
2.0
8.0
6.5
ns
tPLH
tPHL
Propagation Delay
LE to On
5.0
3.0
9.0
5.2
11.0
7.0
5.0
3.0
13.5
7.5
5.0
3.0
12.0
7.0
ns
tPZH
tPZL
Output Enable Time
2.0
2.0
5.0
5.6
8.0
8.5
2.0
2.0
10.0
10.0
2.0
2.0
9.0
9.5
tPHZ
tPLZ
Output Disable Time
1.5
1.5
4.5
3.8
5.5
5.5
1.5
1.5
7.0
5.5
1.5
1.5
6.5
5.5
ns
AC Operating Requirements
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
TA, VCC e Mil
TA, VCC e Com
Min
Min
Min
Max
Max
ts(H)
ts(L)
Setup Time, HIGH or LOW
Dn to LE
2.0
2.0
2.0
2.0
2.0
2.0
th(H)
th(L)
Hold Time, HIGH or LOW
Dn to LE
3.0
3.5
3.0
4.0
3.0
3.5
tw(H)
LE Pulse Width, HIGH
4.0
4.0
4.0
4
Units
Max
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
573
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reels
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M20B
6
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300× Wide) Small Outline Package, EIAJ (SJ)
NS Package Number M20D
20-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N20A
7
54F/74F573 Octal D-Type Latch with TRI-STATE Outputs
Physical Dimensions inches (millimeters) (Continued)
20 Lead Ceramic Flatpak (F)
NS Package Number W20A
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