DS14C241 Single Supply TIA/EIA-232 4 x 5 Driver/Receiver General Description Features The DS14C241 is four driver, five receiver device which conforms to the TIA/EIA-232-E standard and CCITT V.28 recommendations. This device eliminates ± 12V supplies by employing an internal DC–DC converter to generate the necessary output levels from a single +5V supply. Driver slew rate control and receiver noise filtering have also been internalized to eliminate the need for external slew rate control and noise filtering capacitors. With the addition of TRISTATE ® receiver outputs and a shutdown mode, device power consumption is kept to a minimum. n n n n n n n n n n Connection Diagram Functional Diagram Conforms to TIA/EIA-232-E and CCITT V.28 Internal DC–DC converter Operates with single +5V supply Low power requirement — ICC 10 mA max Shutdown mode — ICX 10 µA max Internal driver slew rate control Receiver noise filtering Operates above 120 kbits/sec TRI-STATE receiver outputs Direct replacement for MAX241 DS011281-1 Order Number DS14C241WM See NS Package Number M28B DS011281-2 TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 1998 National Semiconductor Corporation DS011281 www.national.com DS14C241 Single Supply TIA/EIA-232 4 x 5 Driver/Receiver May 1998 Absolute Maximum Ratings (Note 1) Storage Temperature Range Lead Temperature (Soldering, 4 sec.) Short Circuit Duration (DOUT) ESD Rating (HBM, 1.5 kΩ, 100 pF) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.3V to +6V (VCC − 0.3V) to +15V V+ Pin +0.3V to −15V V− Pin Driver Input Voltage −0.3V to (VCC + 0.3V) Driver Output Voltage (V+ + 0.3V) to (V− − 0.3V) ± 30V Receiver Input Voltage Receiver Output Voltage −0.3V to (VCC + 0.3V) Junction Temperature +150˚C Maximum Package Power Dissipation @ +25˚C (Note 6) WM Package 1520 mW −65˚C to +150˚C +260˚C continuous ≥ 2.0 kV Recommended Operating Conditions Supply Voltage (VCC) Operating Free Air Temp. (TA) DS14C241 Min 4.5 Max 5.5 Units V 0 +70 ˚C Electrical Characteristics (Note 2) Over recommended operating conditions, unless otherwise specified Symbol Parameter Conditions Min Typ Max Units DEVICE CHARACTERISTICS V+ Positive Power Supply RL = 3 kΩ, C1–C4 = 1.0 µF, DIN = 0.8V 9.0 V− Negative Power Supply RL = 3 kΩ, C1–C4 = 1.0 µF, DIN = 2.0V −8.0 ICC Supply Current (VCC) No Load 8.5 RL = 3 kΩ, SD = VCC ICX Supply Current Shutdown VIH High Level Enable Voltage VIL 1.0 V V 10 mA 10 µA 2.4 VCC V Low Level Enable Voltage GND 0.8 V IIH High Level Enable Current −10 +10 µA IIL Low Level Enable Current −10 +10 µA V SD DRIVER CHARACTERISTICS VIH High Level Input Voltage VIL Low Level Input Voltage IIH High Level Input Current IIL VOH VOL Low Level Output Voltage DIN 2.0 VCC GND 0.8 V VIN ≥ 2.0V −10 +10 µA Low Level Input Current VIN ≤ 0.8V −10 +10 µA High Level Output Voltage RL = 3 kΩ 5.0 −6.5 −5.0 V 7.5 V IOS+ Output High Short Circuit Current VO = 0V, VIN = 0.8V −30 −15 −5.0 mA IOS− Output Low Short Circuit Current VO = 0V, VIN = 2.0V 5.0 12 30 mA RO Output Resistance −2V ≤ VO ≤ +2V, VCC = GND = 0V 300 Ω RECEIVER CHARACTERISTICS VTH Input High Threshold Voltage VTL Input Low Threshold Voltage 0.8 1.5 VHY Hysteresis 0.2 0.4 1.0 V RIN Input Resistance 3.0 4.5 7.0 kΩ IIN Input Current VOH VOL High Level Output Voltage Low Level Output Voltage www.national.com 1.9 2.4 V V VIN = +15V 2.14 3.8 5.0 mA VIN = +3V 0.43 0.6 1.0 mA VIN = −3V −1.0 −0.6 −0.43 mA VIN = −15V −5.0 −3.8 −2.14 mA VIN = −3V, IO = −3.2 mA 3.5 4.6 VIN = −3V, IO = −20 µA 4.0 4.9 VIN = +3V, IO = +2.0 mA 2 0.25 V V 0.4 V Electrical Characteristics (Note 2) (Continued) Over recommended operating conditions, unless otherwise specified Symbol Parameter Conditions Min Typ Max Units V RECEIVER CHARACTERISTICS VIH High Level Input Voltage VIL Low Level Input Voltage IIH High Level Input Current IIL Low Level Input Current VIN ≤ 0.8V −10 +10 µA IOZ Output Leakage Current EN = VCC, 0V ≤ ROUT ≤ VCC −10 +10 µA EN VIN ≥ 2.0V 2.0 VCC GND 0.8 V −10 +10 µA Switching Characteristics (Note 4) Over recommended operating conditions, unless otherwise specified Symbol Parameter Conditions Min Typ Max Units µs DRIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH RL = 3 kΩ 0.7 4.0 tPHL Propagation Delay HIGH to LOW CL = 50 pF 0.6 4.0 µs tSK Skew |tPLH–tPHL| (Figures 1, 2) 0.1 1.0 µs 30 V/µs SR1 Output Slew Rate RL = 3 kΩ to 7 kΩ, CL = 50 pF 4.0 15 SR2 Output Slew Rate RL = 3 kΩ, CL = 2500 pF 3.0 5.0 V/µs RECEIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH tPHL Propagation Delay HIGH to LOW tSK Skew |tPLH–tPHL| tPLZ Input Pulse Width > 10 µs CL = 50 pF (Figures 3, 4) 2.0 6.5 µs 2.8 6.5 µs 0.8 2.0 µs (Figures 5, 7) 0.1 2.0 µs 0.6 2.0 µs 0.2 2.0 µs 0.6 2.0 µs 2.5 1.0 µs tPZL (Figures 5, 6) tPHZ tPZH tNW (Figures 3, 4) Noise Pulse Width Rejected Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. Note 3: IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may be exceeded. Note 4: Receiver AC input waveform for test purposes: tr = tf = 200 ns, VIH = 3V, VIL = −3V, f = 64 kHz (128 kbits/sec). Driver AC input waveform for test purposes: tr = tf ≤ 10 ns, VIH = 3V, VIL = 0V, f = 64 kHz (128 kbits/sec). Note 5: All typicals are given for VCC = 5.0V and TA = +25˚C. Note 6: Ratings apply to ambient temperature at +25˚C. Above this temperature derate: WM package 14.3 mW/˚C. Parameter Measurement Information DS011281-4 FIGURE 1. Driver Load Circuit 3 www.national.com Parameter Measurement Information (Continued) DS011281-5 FIGURE 2. Driver Switching Waveform DS011281-6 FIGURE 3. Receiver Load Circuit DS011281-7 FIGURE 4. Receiver Propagation Delays and Noise Rejection DS011281-8 FIGURE 5. Receiver Disable Load Circuit DS011281-9 FIGURE 6. Receiver TRI-STATE Timing (tPHZ, tPZH) www.national.com 4 Parameter Measurement Information (Continued) DS011281-10 FIGURE 7. Receiver TRI-STATE Timing (tPLZ, tPZL) DIN 1–4 (pins 7, 6, 20 and 21) — Driver input pins are TTL/ CMOS compatible. Inputs of unused drivers may be left open, an internal pull-up resistor (500 kΩ minimum, typically 5 MΩ) pulls input to VCC. Output will be LOW for open inputs. DOUT 1–4 (pins 2, 3, 1 and 28) — Driver output pins conform to TIA/EIA-232-E levels. RIN 1–5 (pins 9, 4, 27, 23 and 18) — Receiver input pins accept TIA/EIA-232-E input voltages ( ± 15V). Receivers feature a noise filter and guaranteed hysteresis of 200 mV. Unused receiver input pins may be left open. Internal input resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH output. ROUT 1–5 (pins 8, 5, 26, 22 and 19) — Receiver output pins are TTL/CMOS compatible. Receiver output HIGH voltage is specified for both CMOS and TTL load conditions. GND (pin 10) — Ground pin. Pin Descriptions VCC (pin 11) — Power supply pin for the device, +5V ( ± 10%). V+ (pin 13) — Positive supply for TIA/EIA-232-E drivers. Recommended external capacitor: C4 = 1.0 µF (6.3V). This supply is not intended to be loaded externally. V− (pin 17) — Negative supply for TIA/EIA-232-E drivers. Recommended external capacitor: C3 = 1.0 µF (16V). This supply is not intended to be loaded externally. C1+, C1− (pins 12 and 14) — External capacitor connection pins. Recommended capacitor — 1.0 µF (6.3V). C2+, C2− (pins 15 and 16) — External capacitor connection pins. Recommended capacitor — 1.0 µF (16V). EN (pin 24) — Controls the Receiver output TRI-STATE Circuit. A HIGH level on this pin will disable the Receiver Output. SHUTDOWN (SD) (pin 25) — A High on the SHUTDOWN pin will lower the total ICC current to less than 10 µA. Providing a low power state. Typical Performance Characteristics Slew Rate vs Cap. Load vs VCC (Four Drivers) Slew Rate vs Temperature vs Cap. Load (Four Drivers Switching) DS011281-11 DS011281-12 5 www.national.com Typical Performance Characteristics (Continued) Slew Rate vs Cap. Load vs VCC (One Driver) Slew Rate vs Temperature vs Cap. Load (One Driver Switching) DS011281-13 DS011281-14 Driver Slew Rate vs Cap. Load vs Number of Drivers DS011281-15 DS011281-16 FIGURE 8. Driver Shutdown (SD) Delay Test Circuit www.national.com 6 Typical Performance Characteristics (Continued) DS011281-17 FIGURE 9. Driver Shutdown (SD) Delay Timing Waveforms Typical data only. Symbol Parameter Conditions Typ Units tPHS Propagation Delay High to SD VCC = 5V (Notes 7, 8) 124 µs tPLS Propagation Delay Low to SD TA = 25˚C 110 µs tPSH Propagation Delay SD to High 114 µs tPSL Propagation Delay SD to Low 97 µs Note 7: Sample size = 10 parts; 3 different datecodes. Note 8: All drivers are loaded as shown in Figure 8 . 7 www.national.com DS14C241 Single Supply TIA/EIA-232 4 x 5 Driver/Receiver Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS14C241WM NS Package Number M28B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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