GULFSEMI SBYG23MG

SBYG23MG
SURFACE MOUNT FAST
SWITCHING RECTIFIER
VOLTAGE:
:1000V
CURRENT:
:1.5A
SMA/
/DO-214AC
FEATURE
Ideal for surface mount pick and place application
Low profile package
Built-in strain relief
Low reverse current
Soft recovery characteristics
High temperature soldering guaranteed
260℃/10sec/at terminals
Glass passivated chip
Fast reverse recovery time
MECHANICAL DATA
Terminal:Plated axial leads solderable per
MIL-STD 202E, method 208C
Case:Molded with UL-94 class V-0 recognized Flame
Retardant Epoxy
Polarity:Color band denotes cathode
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated,
for capacitive load, date current by 20%)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Reverse Breakdown Voltage at IR = 100µA
Maximum Average Forward Rectified
Peak Forward Surge Current 8.3ms single
half sine- wave superimposed on rated load
Maximum Instantaneous Forward Voltage at
Forward Current 1.0A
Maximum DC Reverse Current
Tj =25℃
at rated DC blocking voltage
Tj =100℃
Maximum Reverse Recovery Time
Pulse energy in avalanche mode,
non repetitive(inductive load switch off)
Typical Thermal Resistance
(Note1 )
(Note 2)
(Note 3)
(Note 4)
Storage and Operating Junction Temperature
SYMBOL
SBYG23MG
units
Vrrm
Vrms
Vdc
V(BR)R
If(av)
1000
700
1000
1000min
1.5
V
V
V
V
A
Ifsm
50.0
A
Vf
1.7
V
Trr
5.0
50.0
75
Ersm
20
Rth(jl)
Rth(ja)
Tstg, Tj
25.0
150
-50 to +150
Ir
µA
nS
mJ
K/W
℃
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. I(BR)R=1.0A, Tj=25℃
3. TL=const.
4. Thermal Resistance from Junction to terminal mounted on epoxy-glass hard tissue, 17mm2 35μm Cu
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES SBYG23MG
Rev.A1
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