NSC LM2792LD-H

LM2792
Current Regulated Switched Capacitor LED Driver with
Analog Brightness Control
General Description
Features
The LM2792 is a CMOS charge-pump voltage doubler and
regulator that provides two regulated current sources. They
are designed to drive two white (or blue) LEDs with matched
currents (within ± 0.3%) to produce balanced light sources
for display backlights. The LM2792 accepts an input voltage
range from 3.0V to 5.8V and maintain a constant current
determined by an external set resistor.
The LM2792 delivers up to 34mA of load current to accommodate two high forward voltage (typically white) LEDs. The
switching frequency is 900kHz (min.) to keep the conducted
noise spectrum away from sensitive frequencies within portable RF devices.
The LM2792 offers full off to maximum current control
through the BRGT pin. The output current linearly tracks the
BRGT pin voltage. The LM2792 is available in active high or
low shutdown versions. The shutdown pin reduces the operating current to 1µA (max.).
The LM2792 is available in a 10 pin leadless leadframe
(LLP) CSP package.
n
n
n
n
n
n
n
n
n
n
n
n
n
Output matching of ± 0.3% (typ.)
Drives up to two LED’s
3.0V to 5.8V Input Voltage
Up to 34mA output current
Soft start limits inrush current
Analog brightness control
Separate shutdown input
Very small solution size and no inductor
1.4mA typical operating current
1µA (max.) shutdown current
900kHz switching frequency (min.)
Linear regulation generates predictable noise spectrum
LLP-10 package: 3mm X 3mm X 0.8mm
Applications
n White LED Display Backlights
n White LED Keypad Backlights
n 1-Cell Li-Ion battery-operated equipment including
PDAs, hand-held PCs, cellular phones
n Flat Panel Dispalys
Basic Application Circuit
20024201
© 2002 National Semiconductor Corporation
DS200242
www.national.com
LM2792 Current Regulated Switched Capacitor LED Driver with Analog Brightness Control
July 2002
LM2792
Connection Diagram
20024203
Top View
10-Lead LLP
Ordering Information
Order Number
Shutdown Polarity
NSC Package
Drawing
Package
Marking
Supplied As
LM2792LD-L
Active Low
LLP-10
SRB
1000 Units, Tape and Reel
LM2792LDX-L
Active Low
LLP-10
SRB
4500 Units, Tape and Reel
LM2792LD-H
Active High
LLP-10
SPB
1000 Units, Tape and Reel
LM2792LDX-H
Active High
LLP-10
SPB
4500 Units, Tape and Reel
www.national.com
2
LM2792
Pin Description
Pin
Name
Function
1
BRGT
Variable voltage input controls output current.
2
POUT
Charge pump output.
3
C1−
Connect this pin to the negative terminal of C1.
4
C1+
Connect this pin to the positive terminal of C1.
5
D2
Current source outputs. Connect directly to LED.
6
D1
Current source outputs. Connect directly to LED.
7
GND
Power supply ground input.
8
VIN
Power supply voltage input.
9
SD/SD
10
ISET
Shutdown input. Device operation is inhibited when pin is asserted.
Current Sense Input. Connect resistor to ground to set constant current through LED.
Block Diagram
20024202
3
www.national.com
LM2792
Absolute Maximum Ratings
Human Body Model
(Note 1)
Machine Model
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
BRGT, SD
Input Voltage (VIN)
−0.3 to (VIN +0.2V)
Power Dissipation (Note 2)
150˚C
θJA (Note 7)
55˚C/W
Storge Temperature
−65˚C to +150˚C
Lead Temp. (Soldering, 5 sec.)
3.0V to 5.8V
BRGT
400 mW
TJMAX (Note 2)
200V
Operating Conditions
−0.3 to 6.0V
VIN
2KV
0 to 3.0V
Ambient Temperature (TA)
−30˚C to +85˚C
34mAOperating Junction
Temperature
−30˚C to 100˚C
260˚C
ESD Rating
Electrical Characteristics
Limits in standard typeface are for TJ = 25˚C and limits in boldface type apply over the full Operating Temperature Range.
Unless otherwise specified, C1 = CIN = CHOLD = 1 µF, VIN = 3.6V, BRGT pin = 2.75V.
Min
Typ
IDX
Symbol
Available Current at Output Dx
Parameter
3.0V ≤ VIN ≤ 5.8V
VDx ≤ 3.6V
RSET = 1650Ω VBRGT = 3V
Conditions
14.5
16.8
IDX
Line Regulation of Dx Output
Current
3.0V ≤ VIN ≤ 4.4V
VDx ≤ 3.6V
RSET = 1800Ω VBRGT = 2.75V
13.5
16
VDX
Load Regulation of Dx Output
Current
VIN = 3.6V
VDx = 3.0V
VDx = 4.0V
RSET = 1800Ω VBRGT = 2.75V
ID-MATCH
Current Matching Between Any
Two Outputs
VD1 = VD2 = 3.6V,
BRGT = 2.75V, VIN = 3.6V,
RSET = 1800Ω
0.3
IQ
Quiescent Supply Current
3.0V ≤ VIN ≤ 4.4V, Active, No
Load Current
1.4
2.7
mA
ISD
Shutdown Supply Current
3.0V ≤ VIN ≤ 5.5V, Shutdown
At 85˚C
0.1
0.3
1
µA
VIH
SD Input Logic High
3.0V ≤ VIN ≤ 5.5V, Note5
VIL
SD Input Logic Low
3.0V ≤ VIN ≤ 5.5V, Note5
ILEAK-SD
SD Input Leakage Current
0V ≤ VSD ≤ VIN
RBRGT
BRGT Input Resistance
BRGT
Brightness Voltage Range
ISET
ISET Pin Output Current
fSW
Switching Frequency (Note 4)
3.0V ≤ VIN ≤ 4.4V
ID1 = ID2 ≤ 16mA
tSTART
Startup Time (Note 6)
IDx = 90% steady state
Max
Units
mA
17.8
mA
mA
16.1
15.4
%
0.8* VIN
V
0.2* VIN
µA
250
kΩ
0
3.0
IDx/25
900
V
0.01
1100
10
V
mA
1800
kHz
µs
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: D1 and D2 may be shorted to GND without damage. POUT may be shorted to GND for 1sec without damage.
Note 3: In the test circuit, all capacitors are 1.0µF, 0.3Ω maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output
voltage and efficiency.
Note 4: The output switches operate at one half of the oscillator frequency, fOSC = 2fSW.
Note 5: The internal thresholds of the Shutdown bar are set at about 40% of VIN
Note 6: This electrical specification is quarantee by design
Note 7: For more information regarding the LLP package, please refer to National Semiconductor Application note AN1187
www.national.com
4
Unless otherwise specified, C1 = CIN = CHOLD = 1uF, VIN=
Input Supply Current vs. VIN ( ID1=ID2=16mA)
IDIODE vs. VIN
20024225
20024224
Shutdown Threshold vs. VIN
IDIODE vs. Temperature
20024207
20024219
IQ(SHUTSOWN) vs. Temperature
IDIODEvs. RSET
20024210
20024213
5
www.national.com
LM2792
Typical Performance Characteristics
3.6V, BRGT pin =2.75V
LM2792
Typical Performance Characteristics Unless otherwise specified, C1 = CIN = CHOLD = 1uF, VIN=
3.6V, BRGT pin =2.75V (Continued)
IDIODE vs. BRGT
Switch Frequency vs. Temperature
20024216
20024211
VSET vs. VBRGT
IDIODE vs. VDIODE
20024227
20024226
www.national.com
6
The LM2792 provides two matched current sources for driving high forward voltage drop LEDs from Li-Ion battery
sources. The part has on-chip current regulators which are
composed of current mirrors with a 25 to 1 ratio. The mirrors
control the LED current without using current limiting resistors in the LED current path. The device can drive up to
34mA through the Leds.
The LED brightness can be controlled by both analog and/or
digital methods. The digital technique uses a PWM (Pulse
Width Modulation) signal applied to the shutdown input. The
analog technique applies an analog voltage to the brightness
(BRGT) pin (see Application Information section).
20024204
FIGURE 1.
Application Information
CAPACITOR SELECTION
SOFT START
LM2792 includes a soft start function to reduce the inrush
currents and high peak current during power up of the device. Soft start is implemented internally by ramping the
bandgap more slowly than the applied voltage. This is done
by holding the bandgap in shutdown for a short time. During
soft start, the switch resistances limit the inrush current used
to charge the flying and hold capacitors.
Low equivalent series resistance (ESR) capacitors such as
X5R or X7R are recommended to be used for CIN, C1, and
CHOLD for best performance. Ceramic capacitors with less
than or equal to 0.3 ohms ESR value are recommended for
this application. Table 1 below lists suggested capacitor
suppliers for the typical application circuit.
TABLE 1. Low ESR Capacitor Manufactures
SHUTDOWN MODE
A shutdown pin (SD or SD) is available to disable the
LM2792 and reduce the quiescent current to 1µA maximum.
The LM2792 is available with both senses of shutdown
polarity.
During normal operation mode of the ’-L’ options, an active
high logic signal to the SD pin or tying the SD pin to VIN, will
enable the device. Pulling SD low or connecting SD to
ground will disable the device.
During normal operation mode of the ’-H’ options, an active
low logic signal to the SD pin or tying the SD pin to GND, will
enable the device. Pulling SD high or connecting SD to VIN
will disable the device.
Manufacturer
TDK
Contact
website
(847) 803 6100 www.component.tdk.com
MuRata
(800) 831 9172
www.murata.com
Taiyo Yuden
(800) 348 2496
www.t-yuden.com
SCHOTTKY DIODE SELECTION
A schottky diode (SD1) must be used between VIN and POUT
for proper operation. During start-up, the low voltage drop
across this diode is used to charge COUT and start the
oscillator. It is necessary to protect the device from
turning-on its own parasitic diode and potentially latching-up.
As a result, it is important to select a schottky diode that will
carry at least 200mA or higher current to charge the output
capacitor during start-up. A schottky diode like 1N5817 can
7
www.national.com
LM2792
Circuit Description
LM2792
Application Information
BRGT PIN
The BRGT pin can be used to smoothly vary the brightness
of the LEDs. In the LM2792, current on BRGT is connected
to an internal resistor divider which gives a factor of 0.42
(see Figure 1) . This voltage is fed to the operational amplifier that controls the current through the mirror resistor RSET.
The nominal range on BRGT is 0V to 3V.
(Continued)
be used for most applications or a surface mount diode such
as BAT54-series and MA2J704 can be used to reduce the
circuit size.Table 2 below lists suggested schottky diode
manufactures.
This means some current must be provided on the BRGT pin
or no current will flow through the LEDs. The LM2792 can
provide an infinite ratio, from fully off (essentially zero current) to the maximum current set by the RSET resistor. Care
must be taken to prevent voltages on BRGT that cause LED
current to exceed a total of 34mA. Although this will not
cause damage to the IC, it will not meet the guaranteed
specifications listed in the Electrical Characteristics.
Calculation of LED Current When Using BRGT :
VIN = 3.6V
RSET = 1800Ω
ISET = ((VBRGT * (0.42) / RSET )* 25
ISET = ((2.75*(0.42)) / 1800 )*25 = 16mA
Note that making VBRGT = 0V results in ISET ∼ = 0mA
BRIGHTNESS CONTROL USING PWM
Brigthness control can be implemented by pulsing a signal at
the SD pin. The recommended signal should be between
100Hz to 1kHz. If the operating PWM frequency is much less
than 100Hz, flicker may be seen in the LEDs. Likewise, if
frequency is much higher, brightness in the LEDs will not be
linear. When a PWM signal is used to drive the SD pin of the
LM2792, connect BRGT pin to a maximun of 3V to ensure
the widest range. Similarly, the voltage at the BRGT pin can
be set higher than 3V without damage to the IC, it will not
increase the brigthness of the LED significantly. RSET value
is selected using the above I SET equation as if BRGT pin is
used. The brigthness is controlled by increasing and decreasing the duty cycle of the PWM. Zero duty cycle will turn
off the brigthness and a 50% duty cycle waveform produces
an average current of 7.5mA if RSET is set to produce a
maximum LED current of 15mA. So the LED current varies
linearly with the duty cycle.
TABLE 2. Diode Manufactures
Manufacturer
Contact
website
ON
Semiconductor
(800) 344
3860
www.onsemi.com
Phillips
Semiconductors
(800) 234
7381
www.philipssemiconductor.com
Panasonic
Semiconductors
(408) 945
5622
www.panasonic.com
LED SELECTION
The LM2792 is designed to drive LEDs with a forward voltage of about 3.0V to 4.0V or higher. The typical and maximum VF depends highly on the manufacturer and their technology. Table 3 lists two suggested manufactures and
example part numbers. Each supplier makes many LEDs
that work well with the LM2792. The LEDs suggested below
are in a surface mount package and TOPLED or SIDEVIEW
configuration with a maximum forward current of 20mA.
These diodes also come in SIDELED or SIDEVIEW configuration and various chromaticity groups. For applications that
demand color and brigthness matching, care must be taken
to select LEDs from the same chromaticity group. Forward
current matching is assured over the LED process variations
due to the constant current output of the LM2792. For best fit
selection for an application, consult the manufacturer for
detailed information.
TABLE 3. White LED Selection:
Component
Manufacture Contact
LWT673/LWT67C
Osram
NSCW100/NSCW215 Nichia
www.osram-os.com
www.nichia.com
PARALLEL DX OUTPUTS FOR INCREASED CURRENT
DRIVE
Outputs D1 and D2 may be connected together to drive a
single LED. In such a configuration, two parallel current
sources of equal value drive the single LED. RSET and
VBRGT should be chosen so that the current through each of
the outputs is programmed to 50% of the total desired LED
current. For example, if 30mA is the desired drive current for
the single LED, RSET and VBRGT should be selected so that
the current through each of the outputs is 15mA. Connecting
the outputs in parallel does not affect internal operation of
the LM2792 and has no impact on the Electrical Characteristics and limits previously presented. The available Dx output current, maximum Dx voltage, and all other specifications provided in the Electrical Characteristics table apply to
this parallel output configuration, just as they do to the
standard 2-LED application circuit.
ISETPIN
An external resistor, RSET, sets the mirror current that is
required to provide a constant current through the LEDs. The
current through RSET and the LED is set by the internal
current mirror circuitry with a ratio of 25:1 The currents
through each LED are matched within 0.3%. RSET should be
chosen not to exceed the maximum current delivery capability of the device. Table 3 shows a list of RSET values when
maximun BRGT=3V is applied. For other BRGT voltages,
RSET can be calculated using this formula:
RSET = ((0.42*BRGT) / ISET)*25
TABLE 4. RSETSelections ( when BRGT pin = 3V
maximum)
ILED per LED
RSET
15mA
2.1KΩ
10mA
3.15KΩ
5mA
6.3KΩ
www.national.com
THERMAL PROTECTION
The LM2792 has internal thermal protection circuitry to disable the charge pump if the junction temperature exceeds
150˚C. This feature will protect the device from damage due
to excessive power dissipation. The device will recover and
operate normally when the junction temperature falls below
the maximum operating junction temperature of 100˚C. It is
8
The actual power dissipation of the device can be calculated
using this equation:
PDissipation = (2VIN -VDIODE)*ILOAD
(Continued)
important to have good thermal conduction with a proper
layout to reduce thermal resistance.
As an example, if VIN in the target application is 4.2V, VDIODE
= 3.0V and worse case current consumption is 32mA (17mA
for each diode).
PDissipation = ((2*4.2) -3.0)*0.032 = 173mW
POWER EFFICIENCY
An ideal power efficiency for a voltage doubler switched
capacitor converter is given as the output voltage of the
doubler over twice the input voltage as follows:
Efficiency = (VDIODE* IDIODE) / ( VIN * IDIODE* Gain) =
VDIODE / 2VIN
Power dissipation must be less than that allowed by the
package. Please refer to the Absolute Maximum Rating of
the LM2792.
In the case of the LM2792, a more accurate efficiency calculation can be applied as the given formula below.
Efficiency = ((VD1* ID1) + (VD2* ID2)) / (ISUPPLY* VIN)
PCB LAYOUT CONSIDERATIONS
The LLP is a leadframe based Chip Scale Package (CSP)
with very good thermal properties. This package has an
exposed DAP (die attach pad) at the center of the package
measuring 2.0mm x 1.2mm. The main advantage of this
exposed DAP is to offer lower thermal resistance when it is
soldered to the thermal land on the PCB. For PCB layout,
National highly recommends a 1:1 ratio between the package and the PCB thermal land. To further enhance thermal
conductivity, the PCB thermal land may include vias to a
ground plane. For more detailed instructions on mounting
LLP packages, please refer to National Semiconductor Application Note AN-1187.
It is clear that the efficiency will depend on the supply voltage
in the above equation. As such, the lower the supply voltage,
the higher the efficiency.
POWER DISSIPATION
The maximum allowable power dissipation that this package
is capable of handling can be determined as follows:
PDMax = (TJMax - TA) / θJA
where TJMax is the maximum junction temperature, TA is the
ambient temperature, and θJA is the junction-to-ambient
thermal resistance of the specified package.
9
www.national.com
LM2792
Application Information
LM2792 Current Regulated Switched Capacitor LED Driver with Analog Brightness Control
Physical Dimensions
inches (millimeters) unless otherwise noted
LLP-10 Pin Package (LDA)
For Ordering, Refer to Ordering Information Table
NS Package Number LDA10A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Corporation
Americas
Email: [email protected]
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: [email protected]
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.