NSC LMC6008IM

General Description
Features
The LMC6008 octal buffer is designed specifically to buffer
the multi-level voltages going to the inputs of the integrated
circuits. The LMC6008 AC characteristics, including settling
time, are specified for a capacitive load of 0.1 mF for this
reason.
The LMC6008 contains 4 high-speed buffers and 4 lowpower buffers. The high-speed buffers can provide an output current of at least 250 mA (minimum), and the low-power buffers can provide at least 150 mA (minimum). By including the 2 types of buffers, the LMC6008 is able to provide
this function while consuming a supply current of only 6.5
mA (maximum). The buffers are a rail-to-rail design, which
typically swing to within 30 mV of either supply.
The LMC6008 also contains a standby function which puts
the buffer into a high-impedance mode. The supply current
in the standby mode is a low 500 mA max. Also, a thermal
limit circuit is included to protect the device from overload
conditions.
Y
Connection Diagram
Ordering Information
Y
Y
Y
Y
Y
Y
High Output Current:
High Speed Buffers
Low Power Buffers
Slew Rate:
High Speed Buffers
Low Power Buffers
Settling Time, CL e 0.1 mF
Wide Input/Output Range
Supply Voltage Range
Supply Current
Standby Mode Current
Y
Y
AMLCD voltage buffering
Multi-voltage buffering
Temperature Range NSC
Transport
b 40§ C to a 85§ C Drawing
Media
24-Pin
LMC6008IM
Surface Mount LMC6008IMX
TL/H/12321 – 1
Top View
Note: Buffers 1, 3, 5 and 7 are High Speed and
Buffers 2, 4, 6 and 8 are Low Speed.
C1996 National Semiconductor Corporation
TL/H/12321
1.7 V/ms
0.85V/ms
16 ms max
0.1V to VCC b 0.1V min
5V to 16V
6.5 mA max
500 mA
Applications
Package
24-Pin SO
250 mA min
150 mA min
RRD-B30M56/Printed in U. S. A.
M24B
Rail
M24B Tape & Reel
8 Channel Buffer
LMC6008
8 Channel Buffer
LMC6008
April 1996
Absolute Maximum Ratings (Note 1)
Operating Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage
Temperature Range
ESD Tolerance (Note 2)
Voltage at Input Pin
Thermal Resistance (iJA)
M Package, 24-Pin Surface Mount
2000V
Va a
Voltage at Output Pin
Supply Voltage (V a b Vb)
Lead Temperature
(soldering, 10 sec.)
Va
4.5V s V a s 16V
b 20§ C to a 100§ C
50§ C/W
Vb b
0.4V,
0.4V
a 0.4V, V b b 0.4V
16V
260§ C
Storage Temperature Range
Junction Temperature (Note 4)
Power Dissipation (Note 4)
b 55§ C to a 150§ C
150§ C
Internally Limited
DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ e 25§ C, VCC e 14.5V and RL e 0.
Symbol
Parameter
VOS
Input Offset Voltage
AV
VO e 10 VPP
IB
Input Bias Current
ILP
Peak Load Current
Conditions
Typ
(Note 5)
RS e 10 kX
LMC6008
Limit
(Note 6)
Units
25
mV max
0.985
V/V
300
nA max
Hi Speed Buffers
VO e 13 VPP
b 250
mA max
a 250
mA min
Lo Speed Buffers
VO e 13 VPP
b 150
mA max
a 150
mA min
ILP
Peak Load Current
VERR
Output Voltage Difference
(Note 9)
VIH
Standby Logic
HIgh Voltage
3.30
V min
VIL
ISTANDBY Logic
Low Voltage
1.80
V max
IIH
Standby High Input Current
1.0
mA max
IIL
Standby Low Input Current
1.0
mA max
35
mV max
IO (STD-BY)
Output Leakage Current
VSTD-BY e High
5
mA max
ICC
Supply Current
VIL e Low, VIN e 7.25V
6.5
mA max
ISTD-BY
Standby Current
VSTD-BY e High
500
mA max
PSRR
Power Supply Rejection Ratio
5V k VCC k 14.5V
55
dB min
VO
Voltage Output Swing
http://www.national.com
2
0.1
V min
VCC b 0.1
V max
AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ e 25§ C, VCC e 14.5V and RL e 0X.
Symbol
SR
Parameter
Slew Rate
tS
Settling Time
tON
Standby Response Time ON
tOFF
Standby Response Time OFF
PBW
Power Bandwidth
CL
Conditions
Typ
(Note 5)
LMC6008
Limit
(Note 6)
Units
Buffers 1, 3, 5, 7 (Note 3)
1.70
V/ms min
Buffers 2, 4, 6, 8 (Note 3)
0.85
V/ms min
(Notes 3, 7)
VO e 10 VPP for Hi-Speed
VO e 5 VPP for Lo-Speed
(Note 3)
Load Capacitance
16
ms max
10
ms max
10
ms max
45
KHz min
0.1
mF max
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5 kX in series with 100 pF.
Note 3: The Load is a series connection of a 0.1 mF capacitor and a 1X resistor.
Note 4: The maximum power dissipation is a function of TJ(max), iJA, and TA. The maximum allowable power dissipation at any ambient temperature is
PD e (TJ(max) b TA)/iJA, where the junction-to-ambient thermal resistance iJA e 50§ C/W. If the maximum allowable power dissipation is exceeded, the thermal
limit circuit will limit the die temperature to approximately 160§ C. All numbers apply for packages soldered directly into a PC board.
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: The settling time is measured from the input transition to a point 50 mV of the final value, for both rising and falling transitions. The input swing is 0.5V to
13.5V for buffers 1, 3, 5, 7 and 3.75V to 10.25V for buffers 2, 4, 6, 8. Input rise time should be less than 1 ms.
Note 8: High-Speed Buffers are 1, 3, 5, 7 and Low-Speed Buffers are 2, 4, 6, 8.
Note 9: Output Voltage Difference is the difference between the highest and lowest buffer output voltage when all buffer inputs are at identical voltages.
3
http://www.national.com
8 Channel Buffer
LMC6008
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead (3.00× Wide) Small Outline Molded Package (M)
Order Number LMC6008IM or LMC6008IMX
NS Package Number M24B
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
http://www.national.com
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Europe
Fax: a49 (0) 180-530 85 86
Email: europe.support @ nsc.com
Deutsch Tel: a49 (0) 180-530 85 85
English Tel: a49 (0) 180-532 78 32
Fran3ais Tel: a49 (0) 180-532 93 58
Italiano Tel: a49 (0) 180-534 16 80
National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
National Semiconductor
Japan Ltd.
Tel: 81-043-299-2308
Fax: 81-043-299-2408
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.