HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer HIGH SPEED LOGIC - SMT 7 Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement Propagation Delay: 55 ps • Serial Data Transmission up to 13 Gbps Fast Rise and Fall Times: 24 / 22 ps • Clock Buffering up to 13 GHz Programmable Differential Output Voltage Swing: 400 - 1100 mV Power Dissipation: 240 mW 16 Lead Ceramic 3x3mm SMT Package: 9mm 2 Functional Diagram General Description The HMC670LC3C is a 1:2 Fanout Buffer designed to support data transmission rates up to 13 Gbps, and clock frequencies as high as 13 GHz. All differential inputs and outputs are DC coupled and terminated on chip with 50 Ohm resistors to ground. The outputs may be used in either single-ended or differential modes, and should be AC or DC coupled into 50 Ohm resistors connected to ground. The HMC670LC3C also features an output level control pin, VR which allows for loss compensation or for signal level optimization. The HMC670LC3C operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3x3 mm SMT package. Electrical Specifi cations, TA = +25 ºC, Vee = -3.3V Parameter Conditions Power Supply Voltage Min. Typ. Max -3.6 -3.3 -3.0 Units V Power Supply Current 75 mA Maximum Data Rate 13 Gbps Maximum Clock Rate 13 GHz Clock Bandwidth, 3 dB 200 mVpp Input 12.2 GHz Input High Voltage -0.5 0.5 V Input Low Voltage -1.0 0.0 V Input Return Loss Frequency <13 GHz 10 dB Single-Ended, peak-to-peak 550 mVpp Differential, peak-to-peak Output Amplitude 7-2 1100 mVpp Output High Voltage -10 mV Output Low Voltage -570 mV For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Electrical Specifi cations, (continued) Conditions Min. Typ. Single-Ended, 20% - 80% Output Return Loss Max Frequency <13 GHz Small Signal Gain ps 10 dB 27 dB rms [1] Random Jitter JR 0.2 δ - δ, 215 -1 PRBS input [2] Deterministic Jitter, JD Units 24 / 22 2 ps rms 6 ps Propagation Delay, td 55 ps D1 to D2 Data Skew, tSKEW 0 ps [1] Upper limit of random jitter, JR, determined by measuring and integrating output phase noise with a sinusodal input at 5, 10, and 13.5 GHz over temperature. [2] Deterministic jitter measured at 5, 10, and 13.5 GHz with a 200 mVpp, 215 -1 PRBS input sequence. DC Current vs. Supply Voltage Output Low Voltage vs. Supply Voltage [1] [2] [1] -200 +25C +85C -40C 90 DC CURRENT (mA) LOW VOLTAGE OUTPUT (mV) 100 80 70 60 50 40 -3.7 +25C +85C -40C -300 -400 -500 -600 -700 -800 -3.6 -3.5 -3.4 -3.3 -3.2 -3.1 -3 -3.7 -2.9 -3.6 -3.3 -3.2 -3.1 -3 -2.9 -3 -2.9 0 COMMON MODE VOLTAGE (mV) 0 HIGH VOLTAGE OUTPUT (mV) -3.4 Common Mode Voltage vs. Supply Voltage [1] [2] Output High Voltage vs. Supply Voltage [1] [2] -10 -20 +25C +85C -40C -30 -40 -50 -3.6 -3.5 -3.4 -3.3 -3.2 -3.1 SUPPLY VOLTAGE Vee (V) [1] VR = 0.0V -3.5 SUPPLY VOLTAGE Vee (V) SUPPLY VOLTAGE Vee (V) -3.7 7 HIGH SPEED LOGIC - SMT Parameter Output Rise / Fall Time -3 -2.9 -50 -100 +25C +85C -40C -150 -200 -250 -300 -350 -400 -450 -3.7 -3.6 -3.5 -3.4 -3.3 -3.2 -3.1 SUPPLY VOLTAGE Vee (V) [2] Frequency = 1 GHz For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7-3 HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Output Differential vs. Supply Voltage [1] [2] Rise / Fall Time vs. VR [3] 27 RISE/FALL TIME, 20%-80% (ps) 1400 1200 1000 800 600 +25C +85C -40C 400 200 0 -3.7 25 23 21 19 tr tf 17 15 -3.6 -3.5 -3.4 -3.3 -3.2 -3.1 -3 -2.9 -1.2 -1 -0.8 -0.2 0 0.2 0.4 Input Return Loss vs. Frequency 1600 0 1400 -10 RETURN LOSS (dB) 1200 1000 800 600 400 +25C +85C -40C 200 -20 -30 Typical S11 Differential S11 -40 -50 -60 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0 3 VR (V) 6 9 12 15 12 15 FREQUENCY (GHz) Output Return Loss vs. Frequency Large Signal Gain @ 25ºC 0 14 -5 12 -10 10 -15 GAIN (dB) RETURN LOSS (dB) -0.4 VR (V) Output Differential vs. VR [2] 0 -1.2 -20 -25 8 6 4 -30 Typical S22 Differential S22 -35 Single Ended S21 Differential S21 2 -40 0 0 3 6 9 12 15 [1] VR = 0.0V [2] Frequency = 1 GHz 0 3 6 9 FREQUENCY (GHz) FREQUENCY (GHz) 7-4 -0.6 SUPPLY VOLTAGE Vee (V) DIFFERENTIAL VOLTAGE (mV) HIGH SPEED LOGIC - SMT 7 DIFFERENTIAL VOLTAGE (mV) 1600 [3] Frequency = 5 GHz For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Eye Diagram Conditions Bit Rate 10.00000 Gbps Pattern Length 32767 Bits DJ (δ-δ) 7.2 ps Vertical Scale 100 mV / div Time Scale 16.7 ps / div [1] Test Conditions: Pattern generated with an Agilent N4901B Serial BERT Eye diagram data presented on an Infinium DCA 86100A Rate = 10.0 GB/s Pseudo Random Code = 215 -1 Vin = 400 mVpp differential [2] Vertical Scale = 100 mV/Div Timing Diagram 7 HIGH SPEED LOGIC - SMT Parameter Truth Table Input Outputs DIN D1 L L L H H H Notes: DIN = DINP - DINN D1 = D1P - D1N D2 = D2P - D2N D2 H - Positive differential voltage L - Negative differential voltage For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7-5 HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Absolute Maximum Ratings HIGH SPEED LOGIC - SMT 7 Power Supply Voltage (Vee) -3.75V to +0.5V Input Signals -2V to +0.5V Output Signals -1.5V to +1V Storage Temperature -65°C to +150°C Operating Temperature -40°C to +85°C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. GROUND PADDLE MUST BE SOLDERED TO Vee. 7-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Pin Descriptions [1] Pin Number Function Description 1, 4, 5, 8, 9, 12 GND Signal Grounds Interface Schematic 2, 3 D1P. D1N Clock / Data Output Port 1 6, 7 DINP, DINN Clock / Data Inputs 10, 11 D2N D2P Clock / Data Output Port 2 13, 16 GND Supply Ground 14 VR Output level control. Output level may be adjusted by either applying a voltage to VR per “Output Differential vs. VR” plot, or by tying VR to GND with a resistor per the following equation: V0 (R) = 1.2 / (2.1 + R), R in kΩ 15, Package Base Vee Negative Supply HIGH SPEED LOGIC - SMT 7 [1] Contact HMC for alternate pinouts For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7-7 HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Evaluation PCB HIGH SPEED LOGIC - SMT 7 Item Description J1 DO1P J2 DO1N J3 DINP J4 DINN J5 DO2N J6 DO2P J7, J8, J12 - J14 GND J10 VR J11 Vee List of Materials for Evaluation PCB 118777 [1] Item Description J1 - J6 PCB Mount SMA RF Connectors J7 - J14 DC Pin C1 - C3 100 pF Capacitor, 0402 pkg C4 - C5 4.7 μF Capacitor, Tantalum R1 10 Ohm Resistor, 0603 Pkg. U1 HMC670LC3C High Speed Logic, Fanout Buffer PCB [2] 118775 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 7-8 The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. The exposed packaged base should be connected to Vee. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Application Circuit HIGH SPEED LOGIC - SMT 7 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7-9