HI-SINCERITY MICROELECTRONICS CORP. H211 Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 1/9 2 Phase DC Motor Drive IC General Description The H211, a one-chip composed of hall sensor and output coil drivers, applied to 2-phase brush-less DC motor. The device includes an on-chip Hall sensor for magnetic sensing, an amplifier that amplifies the Hall voltage, a Schmitt trigger to provide switch hysteresis for noise rejection, a temperature compensation circuit to compensate the temperature drift of Hall sensitivity, two complementary open-collector drivers for sinking large load current. It also includes an internal band-gap regulator which is used to provide bias voltage for internal circuits. The high sensitivity of Hall Effect sensor is suitable for motors from mini-type CPU coolers to blowers and DC fans. Typical operation current is 0.3A with wide range of operating voltage. FG single, an open collector, provides a square waveform output for the detection of the motor speed. Place the device in a variable magnetic field, while the magnetic flux density is larger than threshold BOP, NO will be turned on (low) and SO (and FG) will be turned off (high). This output state is held till the magnetic flux density reversal falls below BRP causing NO to be turned off (high) and SO (and FG) turned on(low). Features ․ On-chip Hall Sensor/Drivers ․ 4V to 20V Supply Voltage ․ Output Sink Current up to 0.4A ․ Low Quiescent Supply Current under 5mA ․ Built-in FG Output ․ Low Profile TO-94 (SIP-4L) Package Typical Application Circuit C1, C2, R2, R3 is optional for reduce electromagnetism noise. R2, R3 must be greater than 50 ohm. Fig.2 H211 Typical Application Circuit H211 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 2/9 Pin Configuration Mark View Pin No. 1 Pin Name FG P/I/O O 2 NO O/P 3 SO O/P 4 GND P Description Rotation speed output (O.C.) Coil driver output/Power input. It is low state during the N magnetic field. Coil driver output/Power input. It is low state during the S magnetic field. IC Ground Block Diagram Fig.3 Functional Block Diagram of H211 H211 HSMC Product Specification HI-SINCERITY Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 3/9 MICROELECTRONICS CORP. Absolute Maximum Ratings Characteristics Symbol Value Unit Zener Breakdown Voltage VZ 35 V NO/SO Pin Voltage VO 30 V 500 mA 350 mA IR 100 mA FG pin OFF voltage VFG 30 V FG sink current IFG 20 mA PD (Ta=25℃) 600 mW PD (Ta=70℃) 450 mW Operating Temperature Range TOP -20~85 ℃ Storage Temperature Range TS -65~150 ℃ Junction Temperature TJ 150 ℃ 260 ℃ Hold Output Current IO Continuous Peak Reverse Current Power Dissipation Lead Temperature (Soldering，10 sec) Electrical Characteristics Parameter Symbol Test Condition Min Operating Voltage VCP ICC < 10mA (fig.1) Quiescent Supply Current ICC VCC: 3~20V (fig.1) NO/SO Saturation Voltage VSAT FG Leakage Current Typ Max Unit 4 20 V 2 7 mA Io=300mA (fig.1) 1.5 V IOFF V FG=30V (fig.1) 1 uA FG Saturation Voltage ION I FG=5mA (fig.2) 0.2 0.5 V Rise Time TR RL=1K CL=10PF 3.0 10 uS Fall Time TF RL=1K CL=10PF 0.3 10 uS Note: No use pin is open when the device is under test. Magnetic Characteristics Characteristics H211A H211B H211C H211D H211 (TA =-20℃～85℃) Symbol Min Max Unit Operate Point BOP 5 50 G Release Point BRP -50 -5 G Operate Point BOP - 70 G Release Point BRP -70 - G Operate Point BOP - 90 G Release Point BRP -90 - G Operate Point BOP - 130 G Release Point BRP -130 - G Rank A B C D HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Fig.4 VNO vs. Magnetic Flux Density Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 4/9 Fig.5 VSO vs. Magnetic Flux Density Typical Performance Characteristics Fig.6 ICC vs. VCC Fig.8 BOP / BRP / BHYS vs. Ambient Temperature H211 Fig.7 BOP / BRP / BHYS vs. VCC Fig.9 PD vs. Ambient Temperature HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 5/9 Typical Performance Characteristics (Continued) Fig.10 VSAT vs. Ambient Temperature Test Circuits Fig.11 Test Circuit 1 (Under N Magnetic field) Fig.12 Test Circuit 2 H211 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 6/9 Application Information 1). Hall Sensor Location The Fig.13 is the hall sensor location, where marks the IC number. The best sensitivity, which can be intensified as much as possible, depends on the vertical distance and position between magnetic pole and the hall sensor (Fig.14). For the 2-phase motor, this design is very important. Fig.13 H211 Hall Sensor Location 2). Darlington-pair Transistor Output The Fig.15 is the circuit diagram of Darlington-pair transistor. Under the heavy current loading, the power loss of the high saturation voltage can be calculated into the following formula: PC=(VBEQ1+VCE(SAT)Q2)*IO ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒(1) According to the IC package and the curve of the power loss, the PC should be applied to and within the safety value. 30V is the voltage of Zener breakdown diode. However, if the voltage, excluding that of the power supply, is more than 30V under the long-time operation, the diode will be destroyed, and meanwhile, the device will de destroyed. H211 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 7/9 Fig.15 H211 Darlington-pair Transistor Output 3). FG Output: The Circuit Diagram of Open Collector Transistor Fig.16 the small signal transistor output connected with the pull-up resistance is to limit the current and confirm the voltage level of rotation speed. The situation of the long-time operation with the high voltage or with the high current will do damage to the transistor and cause FG malfunction. Fig.17 illustrates the relation between dynamic magnetic field and FG. Fig.16 H211 FG Circuit Diagram Fig.17 H211 FG Waveform 4). Application Note Fig.18 is the example of typical application circuit. The red, yellow, and black wires are the input points of the motor system: red, the input of power supply; yellow, the output of FG; black, the ground signal. RC is an external pull-up resistance for the use of measuring FG signal. In view of the design, the value of RC could be decided by the transistor saturation voltage (Von), sink current (Ic), and off-level voltage (Vc). The formula is: Rc=(Vc-Von)/Ic ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒(2) For example： Vc=+5V for TTL level, Ic=5mA at 0.5V saturation voltage (IC specification). H211 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 8/9 The safety value of Rc=1kΩ. D1 is the reverse protection diode. As if the red and black wires reversely a r e connected with the power source, the current will flow through the ground via IC and coils L1 and L2 to power supply. Under such kind of circumstance, the IC and coils are easy to be burned out. Therefore, D1, the reverse protection diode, is necessary for the design. However, D1 will also cause an extra voltage drop on the supply voltage. C1 is a capacitor to reduce the ripple noise caused during the transient of the output stages. The volume of the ripple noise depends on the coil impedance and characteristics. Fig.18 H211 Typical Application Circuit H211 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200918 Issued Date : 2009.09.14 Revised Date : 2009.10.29 Page No. : 9/9 Package Dimensions A B C 1 2 3 Marking: I J a1 a2 4 H D Note: Green label is used for pb-free packing K Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND Hall Sensor Location: 2 .0 0 m m G a2 F E E 1 .2 5 m m To p Min. 5.12 4.10 3.55 0.43 0.35 1.24 3.78 1.32 1.45 0.93 13.00 Max. 5.32 4.30 3.75 0.49 0.41 1.30 3.84 1.52 1.65 1.13 15.50 3o 5o 5o 7o V ie w *: Typical, Unit: mm Marking Site a1 DIM A B C D E F G H I J K L a1 a2 L 4-Lead SIP-4L Plastic Package HSMC Package Code: AD Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office: • Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong Tel: +852-2755-7162 Fax: +852-2755- 7795 AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China Tel: +86(21) 61637118 Fax: +86(21)61637006 H211 HSMC Product Specification