HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 1/7 MICROELECTRONICS CORP. H431 Series H431 Series Pin Assignment 3-Lead Plastic SOT-23 Package Code: N Pin 1: Reference Pin 2: Cathode Pin 3: Anode 3 ADJUSTABLE SHUNT REGULATOR 1 2 Description The H431 series are three-terminal adjustable regulators with guarante-ed thermal stability over applicable temperature ranges. The output voltage may be set to any value between VREF (approximately 2.495 volts) and 36 volts with two external resistors. These devices have a typical dynamic output impedance of 0.2Ω. Active output circuitry provides a very sharp turn-on characteristic, making these devices excellent replacement for zener diodes in many applications. 1 2 3-Lead Plastic SOT-89 Package Code: M Pin 1: Reference Pin 2: Anode Pin 3: Cathode 3 3-Lead Plastic TO-92 Package Code: A Pin 1: Reference Pin 2: Anode Pin 3: Cathode Features 12 • Programmable output voltage • Temperature coefficient is 50ppm/oC typical • Temperature compensated for operation over full temperature range • Low output noise voltage • Fast turn on response 8 • 1 2 3 4 3 3-Lead Plastic SO-8 Package Code: S 7 6 Pin 1: Cathode 5 Pin 2/3/6/7: Anode Pin 4/5: NC Pin 8: Reference Ordering Information Package VREF: 2.495±2% VREF: 2.495±1% VREF: 2.495±0.5% SOT-23 H431AN H431BN H431CN SOT-89 H431AM H431BM H431CM TO-92 H431AA H431BA H431CA SO-8 H431AS H431BS H431CS Absolute Maximum Ratings (Operating temperature range applies unless otherwise specified) Characteristics Cathode Voltage Cathode Current Range (Continuous) Reference Input Current Range Symbol Value VKA 36 V IK -100~+150 mA IREF 0.05~+10 mA Power Dissipation PD Operating Temperature Range Topr SOT-23 280 SOT-89 770 TO-92 770 SO-8 Storage Temperature Range Unit Tstg mW 770 -40~+125 o -65~+150 o C C Operating Conditions Characteristics Cathode Voltage Cathode Current Range (Continuous) H431 Series Symbol Min. Max. Unit VKA VREF 36 V IK 1 100 mA HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 2/7 MICROELECTRONICS CORP. Functional Block Diagram & Symbol Functional Block Diagram Symbol Cathode Reference + Cathode - Reference VREF Anode Anode Test Circuits Fig 1. VK=VREF Fig 2. VK>VREF II Fig 3. Off-State Current II IN VK IN IREF VK R1 IN VK IREF IK IOFF IK VREF R2 VREF Note: VK=VREF(1+R1/R2)+IREFxR1 Electrical Characteristics (TA=25oC unless otherwise specified) Characteristics Reference Input Voltage (Fig1) H431AN/AM/AA/AS H431BN/BM/BA/BS H431CN/CM/CA/CS Symbol VREF Deviation of Reference Input Voltage Over-Temperature (Fig1) VREF(dev) Ratio of Change in Reference Input Voltage to the Change in Cathode Voltage (Fig2) ΔVREF / ΔVK Reference Input Current (Fig2) Deviation of Reference Input Current Over Full Temperature Range (Fig2) Minimum Cathode Current for Regulation (Fig1) Off-State Cathode Current (Fig3) Dynamic Output Impedance (Fig1) H431 Series IREF IREF(dev) IK(min) IK(off) ZK Test Conditions VK=VREF, IK=10mA VK=VREF, IK=10mA Tmin≤Ta≤Tmax IK=10mA, ΔVK=10V to VREF IK=10mA, ΔVK=36V to 10V IK=10mA, R1=10kΩ, R2=∞ IK=10mA, R1=10kΩ, R2=∞, Ta=Full Range VK=VREF VK=36V, VREF=0 VK=VREF, f≤1kHz IK=1 to 100mA Min Typ Max Unit 2.445 2.470 2.483 2.495 2.495 2.495 2.545 2.520 2.507 V - 4 17 mV - -1.4 -2.7 mV/V - -1.0 -2.0 mV/V - 2 4 uA - 0.4 1.2 uA - 0.4 0.1 1.0 1.0 mA uA - 0.2 0.5 Ω HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 3/7 MICROELECTRONICS CORP. Characteristics Curve Cathode Current & Cathode Voltage Change in Reference Input Voltage & Cathode Voltage 150 5 Change in Reference Input Voltage (mV) 125 Cathode Current (mA) 100 75 50 25 0 -25 -50 o VK=VREF, Ta=25 C Test Circuit (Fig1) -75 -100 0 -5 -10 -15 -20 -25 -30 o IK=10mA, Ta=25 C Test Circuits (Fig2) -35 -40 -2 -1 0 1 Cathode Voltage (V) 2 3 0 Reference Input Voltage & Temperature 20 30 Cathode Voltage (V) 50 40 Cathode Current & Cathode Voltage 1000 2.58 2.56 800 2.54 Cathode Current (uA) Reference Input Voltage (V) 10 2.52 2.50 2.48 2.46 600 400 200 0 2.44 VK=VREF, IK=10mA Test Circuit (Fig1) 2.42 -200 2.40 -40 -20 0 20 40 60 80 100 120 o Temperature ( C) o VK=VREF, Ta=25 C Test Circuit (Fig1) -400 -2 -1 0 1 Cathode Voltage (V) 2 3 Small Signal Voltage Amplification & Frequency 60 Voltage Amplification (dB) 50 40 30 Vout 20 15K Ik 240 + 10 10uF 8.2K 0 -10 1000 H431 Series GND 10000 100000 Frequency (Hz) 1000000 10000000 HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 4/7 MICROELECTRONICS CORP. Typical Application Fig 4. Shunt Regulator Fig 5. High Current Shunt Regulator Vcc Vout Vcc Vout R1 R1 R2 R2 Vout=(1+R1/R2)VREF Vout=(1+R1/R2)VREF Fig 6. Output Control of a Three-Terminal Fixed Fig 7. Series Pass Regulator Regulator Vcc Vcc H7805 IN Vout Vout OUT COMMON R1 R1 R2 R2 Vout=(1+R1/R2)VREF; Vout(min)=VREF+5V Vout=(1+R1/R2)VREF; Vout(min)=VREF+VBE Fig 8. Current Limiter or Current Source Fig 9. Constant Current Sink Vcc Vcc Isink Iout RCL Rs Iout=VREF/RCL H431 Series Isink=VREF/RS HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 5/7 MICROELECTRONICS CORP. SOT-23 Dimension Marking: A L 4 3 1 Pb Free Mark 3 Pb-Free: " " (Note) Normal: None B S 1 2 Note: Pb-free product can distinguish by the green label or the extra description on the right side of the label. G V Pin Style: 1.Reference 2.Cathode 3.Anode DIM A B C D G H J K L S V Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 C D Max. 3.04 1.60 1.30 0.50 2.30 0.10 0.177 0.67 1.15 2.75 0.65 *: Typical, Unit: mm J K H Min. 2.80 1.20 0.89 0.30 1.70 0.013 0.085 0.32 0.85 2.10 0.25 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N SOT-89 Dimension C Marking: H Date Code Control Code Pb Free Mark HSMC Logo D B 1 2 H 4 3 1 Pb-Free: " . " (Note) Normal: None 3 Note: Green label is used for pb-free packing E J F G A I Pin Style: 1.Reference 2.Anode 3.Cathode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35 Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41 *: Typical, Unit: mm 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M H431 Series HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 6/7 MICROELECTRONICS CORP. TO-92 Dimension α2 A Pb Free Mark Pb-Free: " . " (Note) Normal: None B 1 DIM A B C D E F G H I α1 α2 α3 Marking: 2 H 4 3 1 A 3 Control Code Date Code α3 Note: Green label is used for pb-free packing C D Pin Style: 1.Reference 2.Anode 3.Cathode H Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 G α1 I Min. 4.33 4.33 12.70 0.36 3.36 0.36 - Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 *5° *2° *2° *: Typical, Unit: mm E F 3-Lead TO-92 Plastic Package HSMC Package Code: A SO-8 Dimension A DIM A B C D E F G H I J K L M N O Marking: G Pb Free Mark 7 8 B 6 5 C Pin1 Index 2 3 Pb-Free: " . " (Note) Normal: None I Pin 1 Mark Date Code H Control Code Pin Style: 1.Cathode 2/3/6/7.Anode 4/5.NC 8.Reference K E Part A Part A S Note: Green label is used for pb-free packing 4 J D H 4 3 1 M L N Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.85 3.85 5.80 1.22 0.37 3.74 1.45 4.80 0.05 0.30 0.19 0.37 0.23 0.08 0.00 Max. 5.10 3.95 6.20 1.32 0.47 3.88 1.65 5.10 0.20 0.70 0.25 0.52 0.28 0.13 0.15 *: Typical, Unit: mm O F 8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H431 Series HSMC Product Specification HI-SINCERITY Spec. No. : IC200401 Issued Date : 2004.03.01 Revised Date : 2008.04.01 Page No. : 7/7 MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) 60~150 sec 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time Pb devices. 245 C ±5 C 10sec ±1sec Pb-Free devices. 260 C ±5 C 10sec ±1sec Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature o 60~150 sec 240 C +0/-5 C Peak Temperature (TP) o 3. Flow (wave) soldering (solder dipping) Products H431 Series o o o o HSMC Product Specification