HSMC H6850

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200912
Issued Date : 2009.07.15
Revised Date :
Page No. : 1/13
H6850 Series
Novel Low Cost Green-Power PWM Controller
With Low EMI Technique
Feature
z
z
z
z
z
z
z
z
z
z
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Low Cost, PWM&PFM&CRM (Cycle
Reset Mode)
Low Start-up Current (about 3μA)
Low Operating Current (about 1.2mA)
Current Mode Operation
Under Voltage Lockout (UVLO)
Built-in Synchronized Slope
Compensation
Built-in Low EMI Technique
Programmable PWM Frequency
Audio Noise Free Operation
Leading edge Blanking on Sense input
Constant output power limiting for
universal AC input Range
SOT-23-6L 、SOP8 and DIP-8 Pb-Free
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¾
Packaging
Good Protection Coverage With Auto
Self-Recovery
Compatible with SG6848 (6849) /
SG5701/SG5848/LD7535 (7550) /
OB2262 (2263)/OB2278(2279)
¾
¾
¾
¾
¾
Complete Protection with
Soft Clamped GATE output voltage
18.0V
VDD over voltage protect 34.0V
Cycle-by-cycle current limiting
Output SCP (Short circuit Protection)
Output OLP (Over Load Protection)
High-Voltage CMOS Process with ESD
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Standby Power Supplies
Set-Top Box Power Supplies
384X Replacement
Applications
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z
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Switching AC/DC Adaptor
Battery Charger
Open Frame Switching Power Supply
General Description
The H6850 is a highly integrated low cost
current mode PWM controller, which is ideal
for small power current mode of offline
AC-DC fly-back converter applications.
Making use of external resistors, the IC
changes the operating frequency and
automatically enters the PFM/CRM (Cycle
Reset Mode) under light-load/zero-load
conditions. This can minimize standby
power consumption and achieve powersaving functions. With a very low start-up
current, the H6850 could use a large value
start-up resistor (2MΩ).
Built-in synchronized slope compensation
enhances the stability of the system and
avoids sub-harmonic oscillation. Dynamic
peak current limiting circuit minimizes output
power change caused by delay time of the
system over a universal AC input range.
H6850P, H6850S,H6850NF
Leading edge blanking circuit on current
sense input could remove the signal glitch
due to snubber circuit diode reverse
recovery and thus greatly reduces the
external component count and system cost
in the design. Cycle-by-Cycle current
limiting ensures safe operation even during
short-circuit.
Excellent EMI performance is achieved
built-in soft driver and low EMI technique.
The H6850 offers perfect protection like
OVP(Over Voltage Protection)、OLP(Over
Load Protection) 、 SCP(Short circuit
protection)、OTP、Sense Fault Protection
and OCP(Over current protection). The
H6850’s output driver is soft clamped to
maximum 18.0V to protect the power
MOSFET. H6850 is offered in SOT-23-6L,
SOT-8 and DIP-8 packages.
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 2/13
Pin Assignment
Part Number
Description
H6850NF
SOT26, Pb-free,in T/R
H6850S
SOP-8, Pb-free in T/R
H6850P
DIP-8, Pb-free in Tube
Pin Descriptions
Package
Function
SOT-26
6
5
4
Description
DIP-8
Pin6: GATE Pin1: GATE Totem-pole output to drive the external power MOSFET
Pin5: VDD Pin2: VDD Supply voltage pin.
1
2
3
SOT-26
8
1
7
2
6
3
5
4
Pin3: NC
NC Pin.
Pin4:
SENSE
Pin4:
SENSE
Current sense pin, a resistor connects to sense the
MOSFET current.
Pin3: RI
Pin5: RI
This pin is to program the switching frequency. By
connecting a resistor to ground to set the switching
frequency.
Pin6: NC
NC Pin
Pin7:FB
Voltage feedback pin. Output current of this pin could
controls the PWM duty cycle、OLP and SCP.
Pin2: FB
DIP -8(SOP-8) Pin1: GND Pin8: GND GND Pin
TYPICAL APPLICATION
H6850
H6850P, H6850S,H6850NF
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 3/13
MICROELECTRONICS CORP.
Block Diagram
Simplified Internal Circuit Architecture
Absolute Maximum Ratings
Symbol
VDD
IOVP
VFB
VSEN
PD
TL
TSTG
Parameter
Supply voltage Pin Voltage
VDD OVP maximal enter current
Input Voltage to FB Pin
Input Voltage to SEN Pin
Power Dissipation
ESD Capability, HBM Model
ESD Capability, Machine Model
SOT-23-6L (20S)
Lead Temperature
DIP-8
(10S)
(Soldering)
SOP-8
(10S)
Storage Temperature Range
Rating
40
20
-0.3 to 6V
-0.3 to 6V
300
2500
250
220
260
230
-55 to + 150
Unit
V
mA
V
V
mW
V
V
℃
℃
℃
℃
RECOMMENDED OPERATION CONDITION
Symbol
VDD
RI
TOA
Parameter
VDD Supply Voltage
RI PIN Resistor Value
Operation Ambient Temperature
Min ~ Max
10~30
100
-20~85
℃
POMAX
FPWM
Maximal Output Power
Frequency of PWM
0~80
30~150
W
kHz
H6850P, H6850S,H6850NF
Unit
V
K ohm
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 4/13
MICROELECTRONICS CORP.
Electrical Characteristics
Symbol
(Ta=25°C unless otherwise noted, VDD = 16V)
Parameter
Conditions
Min.
Typ.
Max.
Unit
3.0
20.0
μA
Supply Voltage (VDD Pin)
IST
ISS
Startup Current
Operating Current
VFB=0V
3.0
mA
VFB=3V
1.2
mA
VFB=Open
0.8
mA
VDDON
Turn-on Threshold Voltage
13.0
14.0
15.0
V
VDDOFF
Turn-off Threshold Voltage
7.8
8.8
9.8
V
VDDCLAMP
VDD Clamp Voltage
VDDAIS
IVDD=10mA
Anti Intermission Surge
VDD Voltage
34.0
V
9.4
V
Voltage Feedback (FB Pin)
IFB
Short Circuit Current
VFB=0V
0.7
mA
VFB
Open Loop Voltage
VFB=Open
4.8
V
Zero Duty Cycle FB current
0.59
mA
IPFM
Enter PFM FB current
0.50
mA
ICRM
Enter CRM FB current
0.55
mA
VPFM
Enter PFM Threshold VFB
1.80
V
VCRM
Enter CRM Threshold VFB
1.40
V
IOLP&SCP
Enter OLP&SCP FB current
170
uA
VOLP&SCP
Enter OLP&SCP FB voltage
3.7
V
TOLP&SCP
OLP&SCP min. delay Time
IFB_0D
RI=100K
33
35
50
mS
Current Sensing (SEN Pin)
VTH_L
VTH_H
TPD
SEN Maximum Voltage Level
RI=100K,
(Dmin=0%)
FB=3.3V
SEN Maximum Voltage
RI=100K,
Level(Dmax=78%)
FB=3.3V
Delay to Output
FB=3.3V
H6850P, H6850S,H6850NF
0.80
V
1.05
V
75
ns
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 5/13
MICROELECTRONICS CORP.
RCS
TLEB
Input Impedance
Leading edge blanking time
( LEB )
RI=100K
40
KΩ
300
nS
Oscillator (RI Pin)
FOSC
Normal Frequency
RI=100Kohm
FPFM
PFM Frequency
RI=100Kohm
22
KHZ
DCMAX_W
Maximum Duty Cycle PWM
RI=100Kohm
78
%
DCMAX_F
Maximum Duty Cycle PFM
RI=100Kohm
78
%
ΔFTEMP
Frequency Temp. Stability
-30-100℃
5
%
300
nS
TBLANK
Leading-Edge Blanking Time
FJITTER
Frequency jitter
RI=100Kohm
60
65
-4
70
KHz
4
%
0.8
V
GATE Drive Output (GATE Pin)
VOL
VOH
Output Low Level
VDD=16V,
IO=20mA
Output High Level
VDD=16V,
IO=20mA
10
V
TR1
Rising Time
CL=500pF
123
ns
TF1
Falling Time
CL=500pF
71
ns
TR2
Rising Time
CL=1000pF
248
ns
TF2
Falling Time
CL=1000pF
116
ns
TR3
Rising Time
CL=1500pF
343
ns
TF3
Falling Time
CL=1500pF
153
ns
TR4
Rising Time
CL=2000pF
508
ns
TF4
Falling Time
CL=2000pF
209
ns
Output Clamp Voltage
VDD=20V
18.0
V
65
KHz
VGCLAMP
Low EMI technique
fEMI
∆f_osc
Low EMI frequency
Frequency modulation range
/Base frequency
H6850P, H6850S,H6850NF
RI=100Kohm
RI=100Kohm
-3
3
%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
OPERATION DESCRIPTION
Current Mode
Compared to voltage mode control,
current mode control has a current feedback
loop. When the voltage of the Sense resistor
peak current of the primary winding reaches
the internal setting value VTH, the register
resets and the power MOSFET cuts off. So,
to detect and modulate the peak current
cycle-by-cycle could control the output of the
power supply. The current feedback has a
good linear modulation rate and a fast input
and output dynamic impact, and avoid the
pole that the output filter inductance brings
and the two-class system descends to the
one-class. So it widens the frequency range
and optimizes overload protection and short
circuit protection.
Startup Current and Under Voltage
Lockout
The startup current of H6850 is set to
be very low so that a large value startup
resistor can be used to minimize the power
loss. For AC to DC adaptor with universal
input range design, a 2 MΩ, 1/8 W startup
resistor and a 10uF/25V VDD hold capacitor
could be used.
The turn-on and turn-off threshold of the
H6850 is designed to 14V/8.8V. During
startup, the hold-up capacitor must be
charge to 14.0V through the startup resistor.
The hysteresis is implemented to prevent
the shutdown from the voltage dip during
startup.
Internal Bias and OSC Operation
A resistor connected between RI pin
and GND pin sets the internal constant
current source to charge or discharge the
internal fixed capacitor. The charge time and
discharge time determines the internal clock
speed and the switching frequency.
Increasing the resistance will reduce the
value of the input current and reduce the
switching frequency. The relationship
between RI and PWM switching frequency
follows the below equation within the RI
allowed range.
H6850P, H6850S,H6850NF
FOSC =
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 6/13
6500
(kHz )
RI ( KΩ)
For example, a 100kΩ resistor RI could
generate a 20uA constant current and a
65kHz PWM switching frequency. The
suggested operating frequency range of
H6850 is within 50KHz to 150KHz.
Green Power Operation
The power dissipation of switching
mode power supply is very important in zero
load or light load condition. The major
dissipation results from conduction loss、
switching loss and consume of the control
circuit. However, all of them relates to the
switching frequency. There are many
difference topologies has been implemented
in different chip. The basic operation theory
of all these approaches intends to reduce
the switching frequency under light-load or
no-load condition.
The H6850`s green power function
adapts PWM、PFM and CRM combining
modulation. When RI resistor is 100kΩ, the
PWM frequency is 65kHz in medium or
heavy load operation. Through modifying
the pulse width, The H6850 could control
output voltage. The current of FB pin
increases when the load is in light condition
and the internal mode controller enters
PFM&PWM when the feedback current is
over 0.5mA. The operation frequency of
oscillator is to descend gradually. When the
feedback current is over 0.55mA, the
frequency of oscillator is invariable, namely
22kHz.
H6850 Green-Power Function
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
To decrease the standby consumption
of the power supply, Chip-Rail introduces
the Cycle Reset Mode technology (CRM). If
the feedback current is over 0.59mA, mode
controller of the H6850 would reset internal
register all the time and cut off the GATE pin.
While the output voltage is lower than the
set value, the register would be set, the
GATE pin operate again. So the frequency
of the internal OSC is invariable, the register
would reset some pulses so that the
practical frequency is decreased at the
GATE pin.
Internal Synchronized Slop
Compensation
Although there are more advantages of
the current mode control than conventional
voltage mode control, there are still several
drawbacks of peak-sensing current-mode
converter, especially the open loop
instability when it operates in higher than
50% of the duty-cycle. To solve this problem,
the H6850 is introduced an internal slope
compensation adding voltage ramp to the
current sense input voltage for PWM
generation. It improves the close loop
stability greatly at CCM, prevents the
sub-harmonic oscillation and thus reduces
the output ripple voltage.
VSLOP = 0.33 ×
DUTY
= 0.4389 × DUTY
DUTYMAX
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 7/13
MOSFET comes into being a voltage VSENSE
on the Sense pin cycle-by-cycle, which
compares to the internal reference voltage,
and controls the reverse of the internal
register, limits the peak current IMAX of the
primary of the transformer. The transformer
energy is E =
1
2
× L × I MAX . So adjusting
2
the RSENSE can set the maximal output
power of the power supple. The current
flowing by the power MOSFET has an extra
value ( ΔI =
VIN
× TD ) due to the system
LP
delay time that is from detecting the current
through the Sense pin to power MOSFET off
in the H6850 (Among these, VIN is the
primary winding voltage of the transformer
and LP is the primary wind inductance). VIN
ranges from 85VAC to 264VAC. To
guarantee the output power is a constant for
universal input AC voltage, there is a
dynamic peak limit circuit to compensate the
system delay T that the system delay brings
on.
Vsense
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
Duty Cycle
0.65
0% 10%20%30%40%50%60%70%80%90%
OLP&SCP
Slop Compensation
Current Sensing & Dynamic peak
limiting
The current flowing by the power
H6850P, H6850S,H6850NF
To protect the circuit from being
damaged under the over load or short circuit
condition, a smart OLP&SCP function is
implemented in the H6850. When short
circuit or over load occurs in the output end,
the feedback cycle would enhance the
voltage of FB pin, while the voltage is over
3.7V or the current from FB is below 170uA,
the internal detective circuit would send a
signal to shut down the GATE and pull down
the VDD voltage, then the circuit is restart.
To avoid the wrong operation when circuit
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 8/13
MICROELECTRONICS CORP.
starts, the delay time is set. When the RI
resistance is 100Kohm, the delay time
TOLP&SCP is between 33mS and 50mS. The
relationship between RI and TOLP&SCP
follows the below equation.
Over Voltage Protection (OVP)
When the power supplies change the
heavy load to light load immediately, there
could be tow phenomena caused by system
delay. They are output voltage overshot and
intermission surge. To avoid it, the anti
intermission surge is built in the H6850. If it
occurs, the FB current is to increase rapidly,
the GATE would be cut off for a while, VDD
pin voltage descends gradually. When VDD
reaches 9.4V, the GATE pin would operate
again, which the frequency is 22KHz.
GATE Driver & Soft Clamped
RI × 2
RI × 3
(mS ) < TOLP & SCP <
(mS )
3
6 × 10
6 × 10 3
Anti Intermission Surge
Leading-edge Blanking (LEB)
Each time the power MOSFET is
switched on, a turn-on spike will inevitably
occur at the Sense pin, which would disturb
the internal signal from the sampling of the
RSENSE. There is a 300nS leading edge
blanking time built in to avoid the effect of
the turn-on spike, and the power MOSFET
cannot be switched off during the moment.
So that the conventional external RC
filtering on sense input is no longer required.
There is a 34V over-voltage protection
circuit in the H6850 to improve the credibility
and extend the life of the chip. When the
VDD voltage is over 34V, the GATE pin is to
shutdown immediately and the VDD voltage
is to descend rapidly.
The H6850’ output designs a totem pole
to drive a periphery power MOSFET. The
dead time is introduced to minimize the
transfixion current during the output
operating. The novel soft clamp technology
is introduced to protect the periphery power
MOSFET from breaking down and current
saturation of the Zener.
Low EMI technique
The frequency low EMI technique is
introduced in the H6850. As following figure,
the internal oscillation frequency is
modulated by itself. A whole surge cycle
includes 128 pulses and the jittering ranges
from -4% to +4%. Thus, the function could
minimize the electromagnetic interferer from
the power supply module.
Frequency(HZ)
70K
65K
60K
Time
Frequency low EMI
H6850
H6850P, H6850S,H6850NF
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 9/13
CHARACTERIZATION PLOTS
VDD=16V,RI=100Kohm,TA=25℃ condition applies if not otherwise noted.
H6850P, H6850S,H6850NF
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
H6850P, H6850S,H6850NF
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 10/13
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 11/13
MICROELECTRONICS CORP.
PACKAGE DEMENSIONS
DIP-8L
Dimensions
Symbol
Millimeters
Min.
Typ.
A
0.381
A2
3.175
b
Typ.
Max.
0.210
0.015
3.302
3.429
0.125
9.271
6.350
L
2.921
eB
θ˚
0.135
0.018
10.160
0.355
7.620
6.223
0.130
0.060
0.457
9.017
E
0.365
0.400
0.300
6.477
0.245
0.250
3.302
3.810
0.115
0.130
0.150
8.509
9.017
9.525
0.335
0.355
0.375
0˚
7˚
15˚
0˚
7˚
15˚
e
H6850P, H6850S,H6850NF
Min.
1.524
b1
E1
Max.
5.334
A1
D
Inches
2.540
0.255
0.100
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 12/13
SOT-23-6L
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
H6850P, H6850S,H6850NF
HSMC Product Specification
HI-SINCERITY
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 13/13
MICROELECTRONICS CORP.
SOP-8L
Dimensions DISCLAIMERS
Symbol
Min.
Millimeter
Typ.
Max.
Min.
Inch
Typ.
Max.
A
1.346
1.752
0.053
0.069
A1
0.101
0.254
0.004
0.010
b
0.406
c
0.016
0.203
D
4.648
E
3.810
e
1.016
F
0.008
4.978
1.270
0.381X45
°
0.183
3.987
0.150
1.524
0.040
0.196
0.157
0.050
0.015X45
°
0.060
H
5.791
6.197
0.228
0.244
L
0.406
1.270
0.016
0.050
θ˚
0°
8°
0°
8°
H6850P, H6850S,H6850NF
HSMC Product Specification