Product Brief Dual-Core Intel® Xeon® Processors LV and ULV Embedded Computing Dual-Core Intel® Xeon® Processors LV and ULV for Embedded Computing Product Overview Dual-Core Intel® Xeon® processors LV and ULV are members of Intel’s growing product line of multi-core processors, utilizing Intel’s 65nm process technology to integrate two cores, along with many advanced features, into one physical package. With a thermal design power (TDP) of 31W (LV) and 15W (ULV), these processors combine the benefits of two high-performance execution cores with intelligent power management features to deliver significantly greater performance-per-watt over previous single-core Intel® Xeon® processors. Available in three speeds – 2.16 GHz (LV), 2.0 GHz (LV) and 1.66 GHz (LV and ULV) – these dual-core processors are ideal for a wide range of low-power embedded, storage and communications applications such as storage area networks (SAN), network attached storage (NAS), routers, virtual private networks (VPN), ruggedized small form factor systems, intrusion detection systems, and telecommunications (wireless and wireline) servers, particularly in AdvancedTCA* form-factor designs. While incorporating advanced processor technology, they remain software-compatible with previous IA-32 processors. Product Highlights Intel’s comprehensive processor/chipset validation process enables fast deployment of next-generation platforms to help developers maximize competitive advantage while minimizing development risks. Dual-Core Intel Xeon processors LV and ULV are validated with the following: L1 Cache Execution Resources Arch State L1 Cache Execution Resources Arch State L1 Cache Execution Resources Arch State L1 Cache Execution Resources Arch State Thermal Control Thermal Control Thermal Control Thermal Control APIC APIC APIC APIC Power Management Logic Power Management Logic Shared L2 Cache Shared L2 Cache Bus Interface Bus Interface 667 MHz Front-Side Bus Figure 1: Dual-processor configuration for Dual-Core Intel® Xeon® processors LV and ULV, supported by the Intel® E7520 chipset, provides four high-performance cores per platform. Product Highlights (continued) • Intel® E7520 chipset, featuring high bandwidth for increased memory and I/O throughput with dual-processor support, providing four high-performance cores per platform (see Figure 1). • Intel® 3100 chipset, providing a single chip system controller. This integrated chipset combines the Memory Controller Hub (MCH) and I/O Controller Hub (ICH) into a single component, significantly conserving board real-estate and power consumption. • Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements. • High-performance front-side bus (FSB) provides dual-processor support for demanding high-performance, volume applications. Combined with dual-core processing, this supports up to four simultaneous threads on the system. • Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production. • Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness. • Intel® Advanced Thermal Manager supports new digital temperature sensors and thermal monitors on each execution core to enhance thermal monitoring accuracy. • Streaming SIMD Extensions 3 (SSE3) provides significant performance enhancement for multi-media applications. Additional instructions designed to improve thread synchronization, complex arithmetic, graphics, and video encoding. • Fully code compatible with existing Intel® architecture-based 32-bit application software. • Utilizing Intel® Dynamic Power Coordination, application software or operating system can change the sleep state of each execution core, allowing the platform to balance performance and power dissipation. • FSB address, data, and response parity protection provides a key reliability and data integrity feature for the communications, storage, and other embedded market segments. • Enhanced 36-bit memory addressing supports up to 16 GB of DDR2 memory, when paired with the Intel E7520 chipset. • Embedded lifecycle support protects system investment by enabling extended product availability. • Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance (intel.com/go/ica), Intel helps developers cost-effectively meet design challenges and shorten time-to-market. Benchmark Tests Demonstrate Improvements in Performance and Performance-per-Watt Dual-core LV and ULV processors versus single-core LV processors The Dual-Core Intel® Xeon® processor LV 2.0 GHz can provide a greater than 2x performance gain, and the Dual-Core Intel Xeon processor ULV 1.66 GHz can provide a greater than 1.9x performance gain, compared to the single-core LV Intel® Xeon® processor 2.8 GHz (see Figure 2). Due to lower thermal dissipation, the Dual-Core Intel Xeon processor LV 2.0 GHz can deliver a 4x improvement in performance/watt, and the Dual-Core Intel Xeon processor ULV 1.66 GHz can deliver a 7.1x improvement in performance/watt, compared to the single-core LV Intel Xeon processor 2.8 GHz (see Figure 3). Figure 2: Relative Performance (Specint_rate_base2000)1,2 Figure 3: Relative Performance/Watt (Specint_rate_base2000/TDP)1,2,3 Source: Intel Corporation Source: Intel Corporation 1 Platform Configurations: •Two Dual-Core Intel Xeon Processors LV 2.0 GHz, Intel E7520 Memory Controller Hub, DDR2-400 MHz, 8 DIMMS, each with 512 MB memory. (Dual-Core Intel® Xeon® Processor LV with Intel® E7520 Chipset Development Kit). • Two Low Voltage Intel Xeon Processors with 800 MHz System Bus, Intel E7520 Memory Controller Hub, DDR2-400 MHz, 8 DIMMS, each with 256 MB memory. (Intel® Xeon® Processor with 800 MHz system bus, Intel® E7520 Chipset, and Intel® 6300ESB ICH Development Kit). Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel product as measured by those tests. Any difference in system hardware or software design configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm 2 SPEC CPU2000 benchmark tests reflect the performance of the microprocessor, memory architecture, and compiler of a computer system on compute-intensive, 32-bit applications. SPEC benchmark test results for Intel microprocessors are determined using particular, well-configured systems. These results may or may not reflect the relative performance of Intel microprocessors in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information, including system benchmarks, to evaluate the performance of systems they are considering for purchase. For more information about SPEC CPU2000, visit http://www.intel.com/ performance/resources/limits.htm 3 Performance/watt reflects the Spec CPU2000 benchmark test results (as described above), divided by Thermal Design Power (TDP) for the respective processors. For the Dual-Core Intel Xeon Processor LV 2.0 GHz, TDP is specified at 31W. For the Low Voltage Intel Xeon Processor with 800 MHz System Bus, TDP is specified at 55W. 4 Intel branded product name for “LV Intel Xeon Processor 2.8 GHz” is Low Voltage Intel Xeon Processor with 800 MHz System Bus. Dual-Core Intel® Xeon® Processor LV for Dual-Processor Embedded Computing Product Number Core Speed Front-Side Bus Speed L2 Cache Thermal Design Power VID Tjunction Package LF80539KF0482M 2.16 GHz 667 MHz 2M 31W 0.825V – 1.275V 0-100° C 478 µFC-PGA LF80539KF0412M 2.0 GHz 667 MHz 2M 31W 0.825V – 1.275V 0-100° C 478 µFC-PGA LF80539KF0282M 1.66 GHz 667 MHz 2M 31W 0.825V – 1.275V 0-100° C 478 µFC-PGA Dual-Core Intel® Xeon® Processor ULV for Dual-Processor Embedded Computing Product Number Core Speed Front-Side Bus Speed L2 Cache Thermal Design Power VID Tjunction Package LF80539JF0282M 1.66 GHz 667 MHz 2M 15W 0.825V – 1.2125V 0-100° C 478 µFC-PGA Intel Access Embedded Intel® Architecture Home Page: Developer’s Site: Intel in Communications: General Information Hotline: Intel® Literature Center: intel.com/design/intarch developer.intel.com intel.com/communications (800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST (800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada) International locations please contact your local sales office. UNITED STATES AND CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 USA EUROPE Intel Corporation (UK) Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Two Pacific Place 88 Queensway, Central Hong Kong, SAR JAPAN Intel Kabushiki Kaisha P.O. Box 115 Tsukuba-gakuen 5-6 Tokodai, Tsukuba-shi Ibaraki-ken 305 Japan SOUTH AMERICA Intel Semicondutores do Brazil Rue Florida, 1703-2 and CJ22 CEP 04565-001 Sao Paulo-SP Brazil INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL MAY MAKE CHANGES TO SPECIFICATIONS, PRODUCT DESCRIPTIONS, AND PLANS AT ANY TIME, WITHOUT NOTICE. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. The Dual-Core Intel® Xeon® processors LV and ULV may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request. Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Xeon, and Intel SpeedStep are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2006 Intel Corporation. All rights reserved. Printed in USA 1206/KSC/OCG/XX/PDF Please Recycle 315786-002US