ISSI IS31LT3350

IS31LT3350
40V LED DRIVER WITH INTERNAL SWITCH
GENERAL DESCRIPTION
The IS31LT3350 is a continuous mode inductive
step-down converter, designed for driving a single LED or
multiple series connected LEDs efficiently from a voltage
source higher than the LED voltage. The chip operates
from an input supply between 6V and 40V and provides
an externally adjustable output current of up to 750mA.
Depending upon supply voltage and external
components, this can provide up to 30 watts of output
power.
The IS31LT3350 includes an integrated output switch
and a high-side output current sensing circuit, which uses
an external resistor to set the nominal average output
current.
Output current can be adjusted linearly by applying an
external control signal to the ADJ pin. The ADJ pin will
accept either a DC voltage or a PWM waveform. This will
provide either a continuous or a gated output current.
Applying a voltage of 0.2V or lower to the ADJ pin turns
the output off and switches the chip into a low current
standby state.
The chip is assembled in SOT23-5 and SOT89-5
package. SOT23-5 is available for 350mA output current
application. SOT89-5 is available for 750mA output
current application.
OCTOBER 2011
FEATURES
 Simple low parts count
 Internal 40V power switch
 Wide input voltage range: 6V to 40V
 Up to 750mA output current(SOT89-5
package)
 High efficiency (up to 95% )
 Typical 1200:1 dimming ratio
 Typical 5% output current accuracy
 Single pin on/off and brightness control using DC
voltage or PWM
 Up to 1MHz switching frequency
 Inherent open-circuit LED protection
 Thermal shutdown protection circuitry
 Two packages available for different current
APPLICATIONS
 Low voltage halogen replacement LEDs
 Automotive lighting
 Low voltage industrial lighting
 LED back-up lighting
 Illuminated sign
APPLICATION CIRCUIT
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
1
IS31LT3350
PIN CONFIGURATIONS
Package
SOT23-5
Pin Configurations (Top View)
LX
1
GND
2
ADJ
3
5
VIN
4
ISENSE
SOT89-5
PIN DESCRIPTION
Pin Name
NO. Description
LX
1
Drain of power switch
GND
2
Ground (0V)
Multi-function On/Off and brightness control pin:
* Leave floating for normal operation.(VADJ = VREF = 1.2V giving nominal average output current
IOUT nom =0.1/RS )
* Drive to voltage below 0.2V to turn off output current
ADJ
3
* Drive with DC voltage (0.3V<VADJ <1.2V) to adjust output current from 25% to 100% of IOUTnom
* Drive with PWM signal to adjust output current.
* When driving the ADJ pin above 1.2V, the current will be clamped to 100% brightness
automatically.
ISENSE
4
Connect resistor RS from this pin to VIN to define nominal average output current IOUTnom =0.1/RS
Input voltage (6V to 40V). Decouple to ground with 1μF or higher X7R ceramic capacitor close to
VIN
5
device
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
2
IS31LT3350
ORDERING INFORMATION
Industrial Range: -40°C to +85°C
Order Part No.
Package
QTY/Reel
V SENSE
IS31LT3350-V1STLS2-TR
IS31LT3350-V2STLS2-TR
IS31LT3350-V1SDLS2-TR
IS31LT3350-V2SDLS2-TR
SOT23-5, Lead-free
SOT23-5, Lead-free
SOT89-5, Lead-free
SOT89-5, Lead-free
3000
3000
2500
2500
91mV~101mV
99mV~110mV
91mV~101mV
99mV~110mV
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Rev. A, 10/18/2011
3
IS31LT3350
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
Symbol Parameter
VIN
Input voltage
Rating
-0.3V to +50V
VIN+0.3V to VIN-5V ,VIN>5V
VISENSE
ISENSE voltage
VLX
VADJ
ILX
Ptot
TOP
TST
Tj MAX
LX output voltage
Adjust pin input voltage
Switch output current
Power dissipation
Operating temperature
Storage temperature
Junction temperature
VIN+0.3V to -0.3V,VIN<5V
-0.3V to +50V
-0.3V to +6V
[email protected];[email protected] SOT23-5
1.2w @SOT89-5;[email protected]
-40 to 85°C
-55 to 150°C
150°C
RθJA
Junction to ambient
108°C/W @SOT23-5; 45°C/W @SOT89-5
ESD Susceptibility(human body mode)
2kV
ELECTRICAL CHARACTERISTICS
(VIN=12V, TA=25°C unless otherwise stated) (NOTE 2)
Symbol
Parameter
VIN
Input voltage
IINQoff
Quiescent supply current with output off
ADJ pin grounded
IINQon
Quiescent supply current with output
switching
ADJ pin floating
VSENSE
Mean current sense threshold voltage
VSENSEHYS
Sense threshold hysteresis
ISENSE
ISENSE pin input current
VSENSE = 0.1V
VREF
Internal reference voltage
Measured on ADJ pin
with pin floating
VADJ
VADJoff
VADJon
External control voltage range on ADJ pin
for dc brightness control
DC voltage on ADJ pin to switch chip
from active (on) state to quiescent (off)
state
DC voltage on ADJ pin to switch chip
from quiescent (off) state to active (on)
state
RADJ
Resistance between ADJ pin and VREF
ILXmean
Continuous LX switch current
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
Conditions
Min.
Typ.
Max.
Unit
40
V
60
80
μA
450
600
μA
6
40
IS31LT3350-V1
91
95
101
IS31LT3350-V2
99
105
110
±15
8
%
10
1.2
0.3
mV
μA
V
1.2
V
VADJ falling
0.15
0.2
0.25
V
VADJ rising
0.2
0.25
0.3
V
SOT23-5 package
SOT89-5 package
500
KΩ
0.35
0.65
A
4
IS31LT3350
ELECTRICAL CHARACTERISTICS (CONTINUED)
(VIN=12V, TA=25°C unless otherwise stated) (NOTE 2)
Symbol Parameter
Conditions
ILX(leak)
LX switch leakage current
RLX
LX Switch ‘On’ resistance
Min.
Typ.
0.9
Max.
1
1.5
Unit
μA
Ω
DPWM(LF)
Brightness control range at low
frequency PWM signal
PWM frequency =100Hz PWM
amplitude=5V,Vin=15V,
L=27uH, Driving 1 LED
1200:1
DPWM(HF)
Brightness control range at low
frequency PWM signal
PWM frequency =10KHz PWM
amplitude=5V,Vin=15V,
L=27uH, Driving 1 LED
13:1
fLX
Operating frequency
ADJ pin floating
L=100μH (0.82Ω) IOUT=350mA
@ VLED=3.4V Driving 1 LED
154
KHz
TONmin
Minimum switch ‘ON’ time
LX switch ‘ON’
200
ns
TOFFmin
LX switch ‘OFF’
200
ns
TSD
Minimum switch ‘OFF’ time
Recommended maximum
operating frequency
Recommended duty cycle
range of output switch at fLXmax
Internal comparator
propagation delay
Thermal shutdown
temperature
TSD-HYS
Thermal shutdown hysteresis
fLXmax
DLX
TPD
1
0.3
0.7
MHz
0.9
50
ns
140
°C
20
°C
NOTES:
1. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2. All parts are production tested at TA=25°C. Other temperature limits are guaranteed by design.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
5
IS31LT3350
TYPICAL PERFORMANCE CHARACTERISTICS
For typical application circuit and Tamb=25°C unless otherwise stated.
100
6
1LED
4LED
5LED
80
6LED
7LED
70
8LED
9LED
60
10LED
D e vi l a ti o n f r om n om i na l
cu r r en t ( %)
Efficiency (%)
3LED
1LED
5
2LED
90
2LED
4
3LED
3
4LED
5LED
2
6LED
1
7LED
8LED
0
9LED
-1
50
5
10
15
20
25
30
35
10LED
-2
40
5
10
15
1LED
2LED
Effiency (%)
90
3LED
4LED
80
5LED
6LED
7LED
70
8LED
9LED
60
10LED
50
15
20
25
30
35
40
Vin(V)
Efficiency vs. No. of LEDs
L=47uH, Rs=0.33Ohm
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
Devilation from nominal current(%)
100
10
25
30
35
40
Output current variation with
Supply Voltage L=100uH,Rs=0.33Ohm
Efficiency vs. No. of LEDs
L=100uH, Rs=0.33Ohm
5
20
V i n (V )
Vin(V)
7
6
1LED
5
2LED
4
3LED
4LED
3
5LED
2
6LED
1
7LED
0
8LED
-1
9LED
-2
10LED
-3
5
10
15
20
25
30
35
40
Vin(V)
Output current variation with Supply Voltage
L=47uH, Rs=0.33Ohm
6
IS31LT3350
TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)
1.4
1.201
1.2
1.2005
Vref(V)
Vref(V)
1
1.2
1.1995
0.8
0.6
0.4
1.199
0.2
0
1.1985
5
10
15
20
25
30
35
0
40
2
4
Vref vs. Vin over nominal supply voltage range
8
10
Vref vs. Vin at low supply voltage
600
120
500
100
400
80
Iin(uA)
Iin(uA)
6
Vin(V)
Vin(V)
300
60
200
40
100
20
0
0
0
5
10
15
20
25
30
35
Vin(V)
Supply Current vs. Vin (Operating)
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/18/2011
40
0
5
10
15
20
25
30
35
40
Vin(V)
Shutdown Current vs. Vin (Quiescent)
7
IS31LT3350
APPLICATION INFORMATION
Setting nominal average output current with external
resistor RS
The nominal average output current in the LED(s) is
determined by the value of the external current sense
resistor (RS) connected between VIN and ISENSE and is
given by:
I OUT nom = 0.1/RS [for RS >0.13Ω]
The table below gives values of nominal average output
current for several preferred values of current setting
resistor (RS) in the typical application circuit shown on
page 1:
RS (Ω)
Nominal average
output current (mA)
0.13
769
0.15
667
0.27
0.3
370
333
Driving the ADJ input from a microcontroller
Another possibility is to drive the chip from the open drain
output of a microcontroller. The diagram below shows
one method of doing this:
10K
Vsense is divided into two ranges to improve current
accuracy, please refer to bin information on page 3.
The above values assume that the ADJ pin is floating and
at a nominal voltage of VREF =1.2V.
Note that RS=0.13Ω is the minimum allowed value of
sense resistor under these conditions to maintain switch
current below the specified maximum value.
It is possible to use different values of RS if the ADJ pin is
driven from an external voltage.
Output current adjustment by external DC
control voltage
The ADJ pin can be driven by an external dc voltage
(VADJ), as shown, to adjust the output current to a value
above or below the nominal average value defined by RS.
IS31LT3350
DC
A Pulse Width Modulated (PWM) signal with duty cycle
DPWM can be applied to the ADJ pin, as shown below, to
adjust the output current to a value below the nominal
average value set by resistor RS, the signal range is from
0V~5V. The PWM signal must have the driving ability to
drive the internal 500KΩ pull-up resistor.
ADJ
GND
GND
The nominal average output current in this case is given
by:
IOUTdc = 0.083*V ADJ /R S [for 0.3V< V ADJ <1.2V]
Note that 100% brightness setting corresponds to VADJ =
VREF. When driving the ADJ pin above 1.2V, the current
will be clamped to 100% brightness automatically.
The input impedance of the ADJ pin is 500kΩ ±25%.
Output current adjustment by PWM control
Directly driving ADJ input
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Rev. A, 10/18/2011
MCU
ADJ IS31LT3350
GND
GND
The diode and resistor suppress possible high amplitude
negative spikes on the ADJ input resulting from the
drain-source capacitance of the FET. Negative spikes at
the input to the chip should be avoided as they may
cause errors in output current or erratic device operation.
See the section on PWM dimming for more details of the
various modes of control using high frequency and low
frequency PWM signals.
Shutdown mode
Taking the ADJ pin to a voltage below 0.2V will turn off
the output and supply current will fall to a low standby
level of 60μA nominal.
Inherent open-circuit LED protection
If the connection to the LED(s) is open-circuited, the coil
is isolated from the LX pin of the chip, so the chip will not
be damaged, unlike in many boost converters, where the
back EMF may damage the internal switch by forcing the
drain above its breakdown voltage.
Capacitor selection
A low ESR capacitor should be used for input decoupling,
as the ESR of this capacitor appears in series with the
supply source impedance and lowers overall efficiency.
This capacitor has to supply the relatively high peak
current to the coil and smooth the current ripple on the
input supply.
8
IS31LT3350
If the source is a DC supply, the capacitor is decided by
ripple of the source, the value is given by:
C min 
I F * Ton
U MAX
IF is the value of output current, U MAX is the ripple of
power supply. Ton is the “ON” time of MOSFET. The
value is normally 2 times of the minimum value.
If the source is an AC supply, the typical output voltages
ripple from a nominal 12V AC transformer can be ±10%.
If the input capacitor value is lower than 200μF, the AC
input
waveform is distorted, sometimes the lowest value will be
lower than the forward voltage of LED strings. This will
lower the average current of the LEDs. So it is
recommended to set the value of the capacitor bigger
than 200uF.
For maximum stability over temperature and voltage,
capacitors with X7R, X5R, or better dielectric are
recommended. Capacitors with Y5V dielectric are not
suitable for decoupling in this application and should not
be used.
Inductor selection
Recommended inductor values for the IS31LT3350 are in
the range of 47μH to 220μH.
Higher values of inductance are recommended at higher
supply voltages and low output current in order to
minimize errors due to switching delays, which result in
increased ripple and lower efficiency. Higher values of
inductance also result in a smaller change in output
current over the supply voltage range. (See graphs). The
inductor should be mounted as close to the chip as
possible with low resistance connections to the LX and
VIN pins.
The chosen coil should have a saturation current higher
than the peak output current and a continuous current
rating above the required mean output current. It is
recommended to use inductor with saturation current
bigger than 1.2A for 700mA output current and inductor
with saturation current bigger than 500mA for 350mA
output current.
The inductor value should be chosen to maintain
operating duty cycle and switch 'on/off' times within the
specified limits over the supply voltage and load current
range.
The following equations can be used as a guide.
LX Switch 'On' time
TON 
V IN  V LED
Where:
L is the coil inductance (H)
rL is the coil resistance (Ω)
Iavg is the required LED current (A)
∆I is the coil peak-peak ripple current (A) {Internally set to
0.3 × Iavg}
VIN is the supply voltage (V)
VLED is the total LED forward voltage (V)
RLX is the switch resistance (Ω)
VD is the diode forward voltage at the required load
current (V)
Example:
For VIN=12V, L=47μH, rL=0.64Ω, VLED=3.4V, Iavg =333mA
and VD =0.36V
TON = (47e-6 × 0.105)/(12 - 3.4 - 0.612) = 0.62μs
TOFF = (47e-6 × 0.105)/(3.4 + 0.36 + 0.322)= 1.21μs
This gives an operating frequency of 546kHz and a duty
cycle of 0.34
Optimum performance will be achieved by setting the
duty cycle close to 0.5 at the nominal supply voltage. This
helps to equalize the undershoot and overshoot and
improves temperature stability of the output current.
Diode selection
For maximum efficiency and performance, the rectifier
(D1) should be a fast low capacitance Schottky diode
with low reverse leakage at the maximum operating
voltage and temperature.
If alternative diodes are used, it is important to select
parts with a peak current rating above the peak coil
current and a continuous current rating higher than the
maximum output load current. It is very important to
consider the reverse leakage of the diode when operating
above 85°C. Excess leakage will increase the power
dissipation in the device.
The higher forward voltage and overshoot due to reverse
recovery time in silicon diodes will increase the peak
voltage on the LX output. If a silicon diode is used, care
should be taken to ensure that the total voltage appearing
on the LX pin including supply ripple, does not exceed
the specified maximum value.
Reducing output ripple
Peak to peak ripple current in the LED can be reduced, if
required, by shunting a capacitor Cled across the LED(s)
as shown below:
LI
 I AVG ( R S  rL  R LX )
Note: TONmin>200ns
LX Switch 'Off' time
TOFF 
V LED
LI
 V D  I AVG (rL  R S )
Note: TOFFmin>200ns
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Rev. A, 10/18/2011
9
IS31LT3350
Rs
VIN
C1
Cled
LED
D1
VIN
ADJ
L1
ISENSE LX
IS31LT3350
GND
A value of 1μF will reduce nominal ripple current by a
factor three (approx.). Proportionally lower ripple can be
achieved with higher capacitor values. Note that the
capacitor will not affect operating frequency or efficiency,
but it will increase start-up delay, by reducing the rate of
rise of LED voltage.
Operation at low supply voltage
The internal regulator disables the drive to the switch until
the supply has risen above the startup threshold set
internally which makes power MOSFET on-resistance
small enough. Above this threshold, the chip will start to
operate. However, with the supply voltage below the
specified minimum value, the switch duty cycle will be
high and the chip power dissipation will be at a maximum.
Care should be taken to avoid operating the chip under
such conditions in the application, in order to minimize
the risk of exceeding the maximum allowed die
temperature. (See next section on thermal
considerations).
Note that when driving loads of two or more LEDs, the
forward drop will normally be sufficient to prevent the chip
from switching below approximately 6V. This will
minimize the risk of damage to the chip.
Thermal considerations
When operating the chip at high ambient temperatures,
or when driving maximum load current, care must be
taken to avoid exceeding the package power dissipation
limits. Two packages are available for different
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Rev. A, 10/18/2011
application because of thermal consideration. SOT23-5 is
only available for 350mA current output application. The
SOT89-5 package’s thermal resistance is much lower so
that it can handle 700mA current and suitable for 700mA
application.
Note that the chip power dissipation will most often be a
maximum at minimum supply voltage. It will also increase
if the efficiency of the circuit is low. This may result from
the use of unsuitable coils, or excessive parasitic output
capacitance on the switch output.
Layout considerations
LX pin
The LX pin of the chip is a fast switching node, so PCB
traces should be kept as short as possible. To minimize
ground 'bounce', the ground pin of the chip should be
soldered directly to the ground plane.
Coil and decoupling capacitors
It is particularly important to mount the coil and the input
decoupling capacitor close to the chip to minimize
parasitic resistance and inductance, which will degrade
efficiency. It is also important to take account of any trace
resistance in series with current sense resistor RS.
ADJ pin
The ADJ pin is a high impedance input, so when left
floating, PCB traces to this pin should be as short as
possible to reduce noise pickup. ADJ pin can also be
connected to a voltage between 1.2V~5V. In this case,
the internal circuit will clamp the output current at the
value which is set by ADJ=1.2V.
High voltage traces
Avoid running any high voltage traces close to the ADJ
pin, to reduce the risk of leakage due to board
contamination. Any such leakage may raise the ADJ pin
voltage and cause excessive output current. A ground
ring placed around the ADJ pin will minimize changes in
output current under these conditions.
10
IS31LT3350
PACKAGE INFORMATION
SOT23-5
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Rev. A, 10/18/2011
11
IS31LT3350
SOT89-5
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Rev. A, 10/18/2011
12