IAD110P Integrated Telecom Circuits INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 100 35 Units VP mArms / mADC Features • • • • • • • • • • 3750Vrms Input/Output Isolation Bidirectional Current Sensing Bidirectional Current Switching Replaces up to Three or Four Components Three Functions in One Package Small 16-Pin SOIC Package (PCMCIA Compatible) FCC Compatible No EMI/RFI Generation Machine Insertable, Wave Solderable Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Description The IAD110P Multifunction Telecom switch combines a 350V normally open (1-Form-A) relay and two optocouplers in a single package. The relay uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. The efficient MOSFET switch and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS® architecture. The optically coupled output is controlled by highly efficient GaAIAs infrared LEDs. The IAD110P enables telecom circuit designers to combine three discrete functions in a single component that uses less space than traditional discrete component solutions. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1305490 • EN/IEC 60950-1 Certified Component: TUV Certificate: B 09 07 49410 006 Ordering Information Part # IAD110P IAD110PTR Description 16-Pin SOIC (50/Tube) 16-Pin SOIC (1000/Reel) Pin Configuration (N/C) (N/C) 1 16 2 15 (Form A) 3 14 4 13 5 12 6 11 7 10 8 9 (N/C) 1. (N/C) 2. + LED - Relay Input 3. – LED - Relay Input 4. Emitter - Phototransistor #1 5. Collector - Phototransistor #1 6. Emitter - Phototransistor #2 7. Collector - Phototransistor #2 8. (N/C) 9. LED - Phototransistor +/– #2 10. LED - Phototransistor –/+ #2 11. LED - Phototransistor +/– #1 12. LED - Phototransistor –/+ #1 13. (N/C) 14. Output - Relay 15. Common - Relay 16. Output - Relay Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD Pb DS-IAD110P-R04 ton e3 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION IAD110P Absolute Maximum Ratings @ 25ºC Parameter Input Control Current, Relay Total Package Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 50 1 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units mA W Vrms °C °C Derate linearly 1.67 mW / ºC Electrical Characteristics @25ºC: Relay Section Parameter Output Characteristics Blocking Voltage (Peak) Load Current Continuous Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Voltage Reverse Input Current Conditions Symbol Min Typ Max Units IL=1A VL - - 350 VP t=10ms IL=100mA VL=350V, TJ=25ºC IL ILPK RON ILEAK - - 100 350 35 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 25 3 3 - ms ms pF IL=100mA IL=1mA IF=5mA VR=5V IF IF VF VR IR 0.4 0.9 - 1.2 - 5 1.4 5 10 mA mA V V A IF=5mA, VL=10V A Electrical Characteristics @25ºC: Detector Section Parameter Output Characteristics Phototransistor Blocking Voltage Phototransistor Dark Current Saturation Voltage Current Transfer Ratio Input Characteristics Input Control Current Input Voltage Drop Input Current (Detector Must be Off) Capacitance, Input to Output Isolation, Input to Output 2 Conditions Symbol Min Typ Max Units IC=10A VCE=5V, IF=0mA IC=2mA, IF=16mA IF=6mA, VCE=0.5V BVCEO ICEO VSAT CTR 20 33 50 50 0.3 - 500 0.5 - V nA V % IC=2mA, VCE=0.5V IF=5mA IC=1A, VCE=5V VL=50V, f=1MHz - IF VF CI/O VI/O 0.9 5 3750 2 1.2 25 3 - 6 1.4 - mA V A pF Vrms www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION IAD110P RELAY PERFORMANCE DATA* 25 Device Count (N) Device Count (N) 30 25 20 15 10 Typical Turn-On Time (N=50, IF=5mA, IL=100mADC, TA=25ºC) 25 20 Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) 15 10 5 5 0 0 1.17 1.21 1.23 20 15 10 5 0 0.3 1.25 0.9 1.5 2.1 2.7 3.3 3.9 0.05 0.15 0.25 0.35 0.45 0.55 0.65 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=100mADC, TA=25ºC) Typical IF for Switch Dropout (N=50, IL=100mADC, TA=25ºC) Typical On-Resistance Distribution (N=50, IF=5mA, IL=100mADC, TA=25ºC) 25 15 10 5 35 30 20 Device Count (N) 20 Device Count (N) Device Count (N) 25 1.19 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC, TA=25ºC) 15 10 5 0.39 0.65 0.91 1.17 1.43 1.69 20 15 10 5 0 0 25 0 0.39 1.95 0.65 0.91 1.17 1.43 1.69 18.75 19.85 20.95 22.05 23.15 24.25 25.35 1.95 On-Resistance (:) LED Current (mA) LED Current (mA) 35 Typical Blocking Voltage Distribution (N=50, TA=25ºC) Device Count (N) 30 25 20 15 10 5 0 377.5 388.5 399.5 410.5 421.5 432.5 443.5 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (ºC) 80 100 120 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 0.7 0.6 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 Forward Current (mA) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION IAD110P RELAY PERFORMANCE DATA (cont.)* -40 3.0 -20 0 20 40 60 80 100 180 160 140 120 100 60 40 0 -20 0 20 40 60 80 -40 100 -20 0 20 40 60 80 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical IF for Switch Dropout vs. Temperature (IL=100mADC) Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) 3.0 60 LED Current (mA) 2.0 1.5 1.0 2.0 1.5 1.0 0.5 0.5 0 0 0 20 40 60 80 100 120 80 100 50 40 30 20 10 0 -40 100 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical Load Current vs. Load Voltage (IF=5mA, TA=25ºC) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured across Pins 14&16 Load Current (mA) 100 80 60 40 20 0 -20 -40 -60 -80 -100 -2.5 -2 -1.5 -1 -0.5 0 Blocking Voltage (VP) -20 On-Resistance (:) 2.5 -40 IF=20mA IF=10mA IF=5mA 80 20 -40 2.5 LED Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Load Current (mA) IF=5mA IF=10mA IF=20mA Maximum Load Current vs. Temperature Typical Turn-Off vs. Temperature (IF=5mA, IL=100mADC) 430 0.016 425 0.014 420 0.012 Leakage (PA) Turn-On Time (ms) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Turn-Off Time (ms) Typical Turn-On Time vs. Temperature (IL=100mADC) 415 410 405 1 1.5 2 -20 0 20 40 60 80 100 Temperature (ºC) Load Voltage (V) 0.006 0.002 -40 2.5 0.008 0.004 400 395 0.5 0.010 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION IAD110P DETECTOR PERFORMANCE DATA* Typical Normalized CTR vs. Temperature (VCE=0.8V) Typical Normalized CTR vs. Forward Current (VCE=0.8V) 3.0 2.0 1.5 1.0 0.5 16 IF=1mA IF=2mA IF=5mA IF=10mA IF=15mA IF=20mA 2.5 2.0 1.5 Collector Current (mA) Normalized CTR (%) Normalized CTR (%) 2.5 Typical Collector Current vs. Forward Current (VCE=0.8V) 1.0 0.5 0 0 0 2 4 6 8 10 12 14 Forward Current (mA) 16 18 20 14 12 10 8 6 4 2 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 2 4 6 8 10 12 14 16 18 20 Forward Current (mA) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION IAD110P Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IAD110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time IAD110P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 6 e3 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION IAD110P MECHANICAL DIMENSIONS IAD110P 10.160±0.381 (0.400±0.015) PCB Land Pattern 0.254 ±0.0127 (0.010±0.0005) PIN 16 10.363±0.127 (0.408±0.005) 7.493±0.127 (0.295±0.005) 0.635 X 45° (0.025 X 45°) 1.016 TYP (0.040 TYP) 9.30 (0.366) 1.90 (0.075) PIN 1 1.270 TYP (0.050 TYP) 0.406 TYP (0.016 TYP) 8.890 TYP (0.350 TYP) 0.508±0.1016 (0.020±0.004) 1.27 (0.050) 2.108 MAX (0.083 MAX) See Note 3 0.60 (0.024) Lead to Package Standoff: MIN: 0.0254 (0.001) MAX: 0.102 (0.004) DIMENSIONS mm (inches) NOTES: 1. Coplanarity = 0.1016 (0.004) max. 2. Leadframe thickness does not include solder plating (1000 microinch maximum). 3. Sum of package height, standoff, and coplanarity does not exceed 2.108 (0.083). IAD110PTR Tape & Reel 330.2 DIA. (13.00 DIA.) W=16 (0.630) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) B0=10.70 (0.421) K0=3.20 (0.126) A0=10.90 (0.429) P=12.00 (0.472) K1=2.70 (0.106) Embossed Carrier Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-IAD110P-R04 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012