LBA126 Dual Single-Pole OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 170 15 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount, Tape & Reel Versions Available Description LBA126 comprises two independent 250V, 170mA, 15 solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay. Featuring low on-resistance combined with enhanced peak load current handling capabilities, LBA126 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950 Compliant Ordering Information Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part # LBA126 LBA126S LBA126STR LBA126P LBA126PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration AC/DC Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices IF IF ILOAD 90% ILOAD ton DS-LBA126-R04 Normally Open Pole Form-B Form-A Pb Normally Closed Pole 90% 10% 10% toff toff ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LBA126 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units t = 10ms IL=170mA VL=250VP IL ILPK RON ILEAK - 10 - 170 15 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=170mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LBA126 Form-A/Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Device Count (N) 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 1.25 -20 0 20 40 60 80 100 Form-B Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) LED Forward Voltage Drop (V) 35 Form-A Typical LED Forward Voltage Drop vs. Temperature Typical LED Forward Voltage Drop (N=50, IF=5mA) 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 120 -40 -20 0 Temperature (ºC) LED Forward Voltage Drop (V) 20 40 60 80 100 120 Temperature (ºC) Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) 25 15 10 5 15 10 5 25 20 15 10 5 0 0.625 0.875 1.125 1.375 1.625 1.875 2.125 0.335 0.525 0.715 0.905 1.095 1.285 1.475 Turn-On Time (ms) Turn-Off Time (ms) On-Resistance (:) Form-A Typical IF for Switch Operation (N=50, IL=170mADC) Form-A Typical IF for Switch Dropout (N=50, IL=170mADC) Form-A Typical Blocking Voltage Distribution (N=50) 15 10 5 0.3 0.5 0.7 0.9 1.1 LED Current (mA) 1.3 1.5 7.5 8.5 9.5 10.5 35 30 20 15 10 5 25 20 15 10 5 0 0 6.5 Device Count (N) 20 25 Device Count (N) Device Count (N) Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=170mADC) 30 20 0 0 25 35 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) 0 0.15 0.45 0.75 1.05 1.35 1.65 LED Current (mA) 1.95 305 315 325 335 345 355 365 Blocking Voltage (VP) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA126 Form-A PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A Typical Turn-On Time vs. LED Forward Current (IL=170mADC) 1.4 0.41 0.8 0.6 0.4 LED Current (mA) Turn-Off Time (ms) 0.39 0.38 0.37 0.36 0.35 0.2 0.34 0 0 2.5 5 10 15 20 25 30 35 40 45 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 Form-A Typical IF for Switch Dropout vs. Temperature (IL=170mADC) Form-A Typical Turn-On Time vs. Temperature (IL=170mADC) Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=170mADC) Turn-On Time (ms) 1.0 0.5 -20 0 20 40 60 80 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 100 0.7 80 100 0.5 0.4 0.3 0.2 0 -20 0 20 40 60 80 100 -40 -20 0 Temperature (ºC) 200 100 0.1 -40 Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=170mADC) 80 0.6 IF=5mA IF=10mA IF=20mA Temperature (ºC) 20 40 60 Temperature (ºC) Form-A Typical Load Current vs. Load Voltage (IF=5mA) Form-A Maximum Load Current vs. Temperature 250 40 30 20 10 Load Current (mA) 150 50 Load Current (mA) 100 50 0 -50 -100 200 IF=20mA IF=10mA IF=5mA 150 100 50 -150 0 -40 -20 0 20 40 60 80 -200 -2.5 -2.0 -1.5 -1.0 -0.5 100 0 0 Load Voltage (V) Form-A Typical Blocking Voltage vs. Temperature Form-A Typical Leakage vs. Temperature Measured across Pins 5&6 Leakage (PA) 335 330 325 315 0.015 0.010 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 40 60 80 100 120 10s 100s 1.0 0.005 320 20 Energy Rating Curve 0.020 340 0 1.2 0.025 345 -20 Temperature (ºC) Temperature (ºC) 350 -40 0.5 1.0 1.5 2.0 2.5 Load Current (A) On-Resistance (:) 0.5 Temperature (ºC) 0 Blocking Voltage (VP) 1.0 Forward Current (mA) 1.5 60 1.5 LED Forward Current (mA) 2.0 -40 2.0 0 0 50 Turn-Off Time (ms) Turn-On Time (ms) 1.0 Form-A Typical IF for Switch Operation vs. Temperature (IL=170mADC) 2.5 0.40 1.2 LED Current (mA) Form A Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) 0.8 0.6 0.4 0.2 -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LBA126 Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) 30 35 35 30 20 15 10 25 20 15 10 5 5 0 0 0.30 25 0.42 0.54 0.66 0.78 0.90 0 10.4 11.2 11.6 12.0 12.4 Form-B Typical IF for Switch Operation (N=50, IL=170mADC) Form B Typical IF for Switch Dropout (N=50, IL=170mADC) Form-B Typical Blocking Voltage Distribution (N=50) 35 15 10 5 30 Device Count (N) Device Count (N) Device Count (N) 10.8 On-Resistance (:) 30 25 20 15 10 0.81 0.99 1.17 1.35 1.53 0.45 0.63 0.81 0.99 1.17 1.35 10 291.25 293.75 296.25 298.75 301.25 303.75 LED Current (mA) LED Current (mA) Blocking Voltage (VP) Form-B Typical Turn-On Time vs. LED Forward Current (IL=170mADC) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) Form B Typical IF for Switch Operation vs. Temperature (IL=170mADC) 1.2 Turn-Off Time (ms) 0.632 0.630 0.628 0.626 0.624 3.0 2.5 1.0 0.8 0.6 0.4 0.622 50 0 Form-B Typical IF for Switch Dropout vs. Temperature (IL=170mADC) 5 10 1.2 Turn-On Time (ms) 2.5 2.0 1.5 1.0 0.5 15 20 25 30 35 40 45 0 20 40 60 Temperature (ºC) 80 100 20 40 60 Form-B Typical Turn-Off Time vs. Temperature (IL=170mADC) 2.5 0.8 0.6 0.4 -20 0 Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=170mADC) 1.0 -40 -20 Temperature (ºC) 0 -20 -40 LED Forward Current (mA) 0.2 0 1.0 50 Turn-Off Time (ms) 45 1.5 0 0 10 15 20 25 30 35 40 LED Forward Current (mA) 2.0 0.5 0.2 5 15 1.53 LED Current (mA) 0.634 0.63 20 0 0 0.45 25 5 5 Turn-On Time (ms) 10 Turn-Off Time (ms) 0 LED Current (mA) 15 Turn-On Time (ms) 20 -40 20 0.625 0.875 1.125 1.375 1.625 1.875 2.125 1.02 35 3.0 25 5 40 0 Form-B Typical On-Resistance Distribution (N=50, IL=170mADC) 30 Device Count (N) Device Count (N) 25 Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) 0 20 40 60 Temperature (ºC) 80 100 80 100 80 100 IF=5mA IF=10mA IF=20mA 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Temperature (ºC) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA126 Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-B Typical On-Resistance vs. Temperature (IF=5mA, IL=170mADC) 200 30 20 Load Current (mA) 40 10 100 50 0 -50 -100 200 150 100 50 -150 0 -40 -20 0 20 40 60 80 -200 -2.0 -1.5 -1.0 -0.5 100 0 0 0.5 1.0 1.5 -40 2.0 Load Voltage (V) Form-B Typical Blocking Voltage vs. Temperature Form-B Typical Leakage vs. Temperature Measured across Pins 7&8 1.2 305 0.025 1.0 290 Load Current (A) 0.030 295 0.020 0.015 0.010 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 20 40 60 80 100 120 10s 100s 0.8 0.6 0.4 0.2 0.005 285 0 Energy Rating Curve 310 300 -20 Temperature (ºC) Temperature (ºC) Leakage (PA) Blocking Voltage (VP) 250 150 50 Load Current (mA) On-Resistance (:) 60 Form B Maximum Load Current vs. Temperature (IF=5mA) Form-B Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LBA126 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBA126 / LBA126S / LBA126P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBA126 / LBA126S 250ºC for 30 seconds LBA126P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA126 MECHANICAL DIMENSIONS LBA126 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA126S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA126P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LBA126 MECHANICAL DIMENSIONS LBA126STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LBA126PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LBA126-R04 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012