LBB110 Dual Single-Pole, Normally Closed OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount, Tape & Reel Version Available Description LBB110 is a dual normally closed (1-Form-B) solid state relay that has two independently controlled, optically coupled MOSFET switches in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. Approvals Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Part # LBB110 LBB110P LBB110PTR LBB110S LBB110STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD Pb DS-LBB110-R08 e3 90% 10% toff www.ixysic.com ton 1 INTEGRATED CIRCUITS DIVISION LBB110 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 35 1 mArms / mADC AP VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. www.ixysic.com A ms pF R08 INTEGRATED CIRCUITS DIVISION LBB110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 25 20 15 10 5 1.17 25 1.19 1.21 1.23 15 10 5 20 15 10 5 0 0.09 1.25 0.27 0.45 0.63 0.81 0.99 0.27 0.45 0.63 0.81 0.99 1.17 1.35 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=120mADC) Typical IF for Switch Dropout (N=50, IL=120mADC) Typical On-Resistance Distribution (N=50, IL=120mADC) 25 20 Device Count (N) Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 15 10 5 25 20 Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 0 0 0.33 0.55 0.77 0.99 1.21 1.43 20 15 10 5 0 0.11 1.65 0.33 0.55 0.77 0.99 1.21 1.43 25.5 26.5 LED Current (mA) LED Current (mA) Device Count (N) 25 27.5 28.5 29.5 30.5 31.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) 20 15 10 5 0 357.5 372.5 387.5 402.5 417.5 432.5 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.30 1.8 0.6 1.4 IF=50mA 1.2 IF=10mA IF=5mA 1.0 0.8 Turn-Off Time (ms) 1.6 0.20 0.15 0.10 0.05 -20 0 20 40 60 Temperature (ºC) 80 100 120 0.5 0.4 0.3 0.2 0.1 0 0 -40 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.7 0.25 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBB110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical IF for Switch Operation vs. Temperature (IL=120mADC) 0.6 Turn-On Time (ms) 2.0 1.5 1.0 0.5 0.3 0.2 0.1 3.0 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Typical Turn-Off Time vs. Temperature (IL=120mADC) 2.0 1.8 Turn-Off Time (ms) 2.5 2.0 1.5 1.0 0.5 80 1.2 1.0 0.8 0.6 -20 0 20 40 60 80 -40 100 -20 0 20 40 60 80 Temperature (ºC) Temperature (ºC) Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature (IF=5mA) 410 180 Blocking Voltage (VP) 160 140 120 100 80 60 40 20 0 -20 0 20 40 60 80 100 80 100 50 0 -50 -3 -2 0 -1 1 2 3 4 Load Voltage (V) Typical Leakage vs. Temperature (Measured across Pins 5&6 or 7&8) 0.045 0.040 0.035 400 395 390 0.030 0.025 0.020 0.015 0.010 385 0.005 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) 60 100 -4 405 -40 120 40 -150 100 380 -40 20 -100 0 -40 0 Typical Load Current vs. Load Voltage 0.4 0 -20 150 IF=10mA 1.4 Dual Pole Single Pole Instantaneous Temperature (ºC) IF=5mA 1.6 50 45 40 35 30 25 20 15 10 5 0 -40 100 Load Current (mA) -40 LED Current (mA) 0.4 0 0 Load Current (mA) 0.5 Leakage (PA) LED Current (mA) 2.5 Typical On-Resistance vs. Temperature (IL=120mADC) On-Resistance (:) 3.0 Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LBB110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBB110 / LBB110S / LBB110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBB110 / LBB110S 250ºC for 30 seconds LBB110P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R08 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBB110 MECHANICAL DIMENSIONS LBB110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBB110P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) LBB110S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LBB110 LBB110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LBB110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LBB110-R08 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012