IXYS LCB717

LCB717
Single-Pole, Normally Closed
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Load Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
30
1.5
0.3
2
Units
VP
Arms / ADC

mA
Features
•
•
•
•
•
•
•
•
•
•
•
•
1.5A Load Current
0.3 Max On-Resistance
2mA Control Current
3750Vrms Input/Output Isolation
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Small 6-Pin Package
Tape & Reel, Surface Mount Version Available
LCB717 is a single-pole normally closed
(1-Form-B) solid state relay that uses optically
coupled technology to provide an enhanced
3750Vrms isolation barrier between the input and the
output of the relay. The efficient MOSFET switches
use IXYS Integrated Circuits Division's patented
OptoMOS architecture. The optically coupled output
is controlled by a highly efficient GaAlAs infrared
LED.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LCB717
LCB717S
LCB717STR
Applications
•
•
•
•
•
•
•
•
•
•
Description
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
Pb
DS-LCB717-R01
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1
INTEGRATED CIRCUITS DIVISION
LCB717
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
30
5
50
1
Units
VP
V
mA
A
100
800
3750
8
-40 to +85
-40 to +125
mW
mW
Vrms
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
DC Configuration, Continuous
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Switching Speeds
Turn-On
Turn-Off
Off-State Leakage Current
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
IF=0mA
IL
ILPK
-
-
1.5
3
5
Arms / ADC
ADC
A
IF=0mA , t < 10ms
IF=0mA, IL=1.5A
IF=0mA, IL=3A
RON
-
-
0.3
0.08

ton
-
-
2
toff
COUT
-
160
459
5
1
-
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
IF=2mA, VL=30V
IF=2mA, VL=25V, f=1MHz
IF=2mA, VL=1V, f=1MHz
1
Measurement taken within 1 second of on-time.
2
For high temperature operation (>60ºC) a LED current of 4mA is recommended.
2
ILEAK
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ms
A
pF
R01
INTEGRATED CIRCUITS DIVISION
LCB717
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
25
20
15
10
5
0
1.230 1.245 1.260 1.275
LED Forward Voltage (V)
15
10
5
0.45
30
Device Count (N)
15
10
5
20
15
10
IF=10mA
IF=5mA
IF=2mA
1.1
36
37
38
39
Blocking Voltage (VP)
-40
-20
0
20
40
60
Temperature (ºC)
80
0.50
520
510
20
30
LED Current (mA)
40
0.30
0.25
0.20
Typical Turn-On Time
vs. Temperature
(VL=10V, IL=100mA)
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
8
6
4
2
10
20
30
40
LED Forward Current (mA)
50
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
14
12
550
IF=2mA
500
450
400
IF=2mA
10
8
6
IF=5mA
4
IF=10mA
2
0
350
-40
5
0
Turn-Off Time (ms)
Turn-On Time (Ps)
LED Current (mA)
0.35
10
50
IF=5mA
0.40
15
0
10
600
0.45
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=1A)
10
530
0
Typical LED Current to Operate
vs. Temperature
(IL=750mA)
4.1
On-Resistance (:)
540
100
3.8
0.1700 0.1725 0.1750 0.1775 0.1800 0.1825 0.1850
500
1.0
2.6 2.9 3.2 3.5
Turn-Off Time (ms)
20
40
Turn-Off Time (ms)
1.2
Turn-On Time (Ps)
1.3
35
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
550
1.4
2.3
0
34
Typical LED Forward Voltage Drop
vs. Temperature
1.5
5
25
0
IF=50mA
IF=20mA
10
2.0
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
0.275 0.300 0.325 0.350 0.375 0.400 0.425
LED Forward Current (mA)
1.6
15
0.70
5
0
LED Forward Voltage (V)
0.50
0.55
0.60
0.65
Turn-On Time (ms)
25
20
20
0
1.290
Typical LED Current to Operate
(N=50, IL=100mA)
25
Device Count (N)
20
0
1.215
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
25
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R01
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3
INTEGRATED CIRCUITS DIVISION
LCB717
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
2.0
0.19
0.18
0.17
0.16
1.0
0.5
0.0
-0.5
-1.0
1.4
1.2
1.0
0.8
-1.5
-2.0
-0.3
0.15
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical On-Resistance vs. Temperature
DC-Only Configuration
(IF=0mA, IL=1.5A)
3.5
0.6
-0.2
-0.1
0.0
0.1
Load Voltage (V)
0.2
0.3
-40
0.050
0.045
0.040
2.5
2.0
1.5
1.0
0.0
0.00
0.030
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
(IF=4mA)
44
Leakage Current (nA)
42
41
40
39
38
37
0.04 0.06 0.08 0.10
Load Voltage (V)
0.12
-20
0
20
40
60
Temperature (ºC)
80
2.5
2.0
-40
800
35
30
25
20
15
10
5
100
100
3.0
0.14
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=2mA, f=1MHz)
700
600
500
400
300
200
100
0
-40
80
1.0
0.02
Leakage Current vs. Temperature
Measured Across Pins 4 & 6
(IF=4mA, VL=30V)
40
43
20
40
60
Temperature (ºC)
1.5
0.5
0.035
0
3.5
Load Current (A)
Load Current (A)
0.055
-20
Maximum Load Current vs. Temperature
DC-Only Configuration
(IF=0mA)
Typical Load Current vs. Load Voltage
DC-Only Configuration
(IF=0mA)
3.0
0.060
On-Resistance (:)
1.6
Load Current (A)
Load Current (A)
On-Resistance (:)
0.20
Blocking Voltage (VP)
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=0mA)
1.5
0.21
0.065
Typical Load Current vs. Load Voltage
AC/DC Configuration
(IF=0mA)
Output Capacitance (pF)
0.22
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IF=0mA, IL=750mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
5
10
15
Load Voltage (V)
20
25
Energy Rating Curve
Load Current (A)
6
5
4
3
2
1
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R01
INTEGRATED CIRCUITS DIVISION
LCB717
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LCB717 / LCB717S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LCB717 / LCB717S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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5
INTEGRATED CIRCUITS DIVISION
LCB717
Mechanical Dimensions
LCB717
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
LCB717S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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R01
INTEGRATED CIRCUITS DIVISION
LCB717
LCB717S Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-LCB717-R01
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/9/2012