SEMICONDUCTOR GN1G TECHNICAL DATA Surface Mount Glass Passivated Rectifier FEATURES Plastic package has Underwriters Laboratory flammability Classification 94V-0. B For surface mounted aplications. 2 E Low profile package. A Glass passivated chip junction. D Built-in strain relief, ideal for automated placement. E High temperature soldering guaranteed : 250 /10 seconds at terminals. 1 C ) CHARACTERISTIC F MAXIMUM RATING (Ta=25 DIM A B C D E F G SYMBOL RATING UNIT Repetitive peak reverse voltage VRRM 400 V RMS voltage VRMS 280 V DC blocking voltage VDC 400 V IF(AV) 1 A IFSM 40 A Tj, Tstg -55~150 Average forward rectified current (see fig.1) G Unit : mm MILLIMETERS _ 0.3 4.3 + _ 0.12 2.525 + _ 0.18 1.45 + _ 0.2 5.0 + _ 0.35 1.15 + _ 0.175 2.075 + _ 0.08 0.23 + 1. ANODE 2. CATHODE SMA(1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=110 Operating Junction and Storage Temperature Range Marking Cathode Mark Type Name E140 Lot No. ELECTRICAL CHARACTERISTICS (Ta=25 CHARACTERISTIC ) SYMBOL CONDITION MIN TYP MAX UNIT - - 1.1 V - - 1.0 - - 50 VF IF=1A IR VRRM=400V Reverse recovery time trr IF=0.5A, IR=1.0A - 1.8 - S Junction capacitance CJ VR=4.0V, f=1MHz - 12 - pF Junction to ambient - - 75 Junction to lead - - 27 Forward voltage Leakage current Ta=25 Ta=125 Rth(A) (Note1) Thermal resistance Rth(L) A /W Note 1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B with (5.0 5.0mm) copper pads. 2006. 5. 16 Revision No : 1 1/2 GN1G Fig.2 Maximum Non-Repetitive Peak Forward Surge Current Fig.1 Forward Current Derating Curve Peak Forward Surge Current (A) Average Forward Current (A) 1.2 Resistive or Inductive Load 1.0 0.8 0.6 0.4 0.2 0 0.2x0.2 (5.0x5.0mm) Thick Copper Pad Areas 0 20 40 60 80 100 120 140 100 TL=110 C 8.3mS Single Half Sine-Wave (JEDEC Method) 10 0 1 160 10 Number of Cycles at 60Hz Instantaneous Forward Current (A) Fig.3 Typical Instantaneous Forward Characteristics 80 5 C Tj=2 10 1 0.1 Pulse Width=300ט 1% Duty Cycle 0.01 0.4 0.8 1.2 1.6 2.0 Instantaneous Reverse Leakage Current (µA) Lead Temperature ( C) Fig.4 Typical Reverse Leakage Characteristics 10 Tj=75 C 0.1 0.001 0 Reverse Voltage (V) 2006. 5. 16 Revision No : 1 100 transient thermal Impedance ( C/W) Junction Capacitance (pF) 1 10 40 60 80 100 Fig.6 Transient Thermal Impedance 10 1 20 Percent of rated Peak Reverse Voltage (%) Tj=25 C f=1.0MHz Vsig=50mVp-p 0.1 Tj=25 C 0.01 Fig.5 Typical Junction Capacitance 0.01 Tj=125 C 1 Instantaneous Forward Voltage (V) 100 100 1000 100 10 Units Mounted on 0.20x0.20"(5.0x5.0mm) x0.5 mil. Inches(0.013mm) Thick Copper Land Areas 1 0.01 0.1 1 10 100 t, Pulse Duration (sec.) 2/2