SPK0415HM4H-B Digital High-SNR SiSonicTM Microphone The SPK0415HM4H-B is a miniature, highperformance, low power, top port silicon digital microphone with a single bit PDM output. Using Knowles’ proven high performance SiSonicTM MEMS technology, the SPK0415HM4H-B consists of an acoustic sensor, a low noise input buffer, and a sigma-delta modulator. These devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent audio performance and RF immunity are required. The high Signal-to-Noise-Ratio (SNR) of the SPK0415HM4H-B enhances the performance of far-field applications and many complex, multi-microphone algorithms. Revision: E Sheet 1 of 13 Features: • Low Noise • Low Current • RF Shielded • PDM Output • Supports Dual Multiplexed Channels • Ultra-Stable Performance • Standard SMD Reflow • Omnidirectional 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 1. ABSOLUTE MAXIMUM RATINGS Parameter Absolute Maximum Rating Units VDD, DATA to Ground -0.3, +5.0 V CLOCK to Ground -0.3, +5.0 V SELECT to Ground -0.3, +5.0 V ±5 mA Indefinite to Ground or VDD sec -40 to +100 °C Input Current Short Circuit Current to/from DATA Temperature Range Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. 2. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD=1.8 V, FCLOCK=2.4 MHz, SELECT pin grounded, no load, unless otherwise indicated Parameter Symbol Conditions Min Typ Max Units Supply Voltage1 VDD 1.6 - 3.6 V 1,2,3 IDD - - 650 µA Supply Current Sleep Current3 Sensitivity 1 Signal to Noise Ratio Total Harmonic Distortion Acoustic Overload Point Power Supply Rejection Ratio Power Supply Rejection ISLEEP FCLOCK < 1 kHz - 25 50 µA S 94 dB SPL @ 1 kHz -29 -26 -23 dBFS SNR 94 dB SPL @ 1 kHz, A-weighted - 61 - dB(A) THD 94 dB SPL @ 1 kHz, S = Typ - .10 .35 % AOP 10% THD @ 1 kHz, S = Typ 119 122 - PSRR 200 mVpp sinewave @ 1 kHz - 39 - PSR 100 mVpp square wave @ 217 Hz, A-weighted - -71 - Fullscale = ±100 - -4 - DC Output Directivity Increasing sound pressure Increasing density of 1’s Data Format Revision: E Sheet 2 of 13 % FS Omnidirectional Polarity Logic Input High dB SPL dBV /FS dBFS (A) ½ Cycle PDM VIH 0.65xVDD - 3.6 V 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B Parameter Symbol Conditions Min Typ Max Units -0.3 - 0.35xVDD V Logic Input Low VIL Logic Output High VOH IOUT = 1 mA 0.65xVDD - VDD V Logic Output Low VOL IOUT = 1 mA 0 - 0.35xVDD V SELECT (high) VDD -0.2 - 3.6 V SELECT (low) -0.3 - 0.2 V - 1 10 mA Short Circuit Current ISC Grounded DATA pin Output Load CLOAD - - 100 pF Clock Frequency FCLOCK 1.0 - 3.25 MHz 40 - 60 % - - 10 ns Clock Duty Cycle Clock Rise/Fall Time tEDGE 4,5 FCLOCK < 1 kHz - - 10 ms Wake-up Time4,6 FCLOCK ≥ 1 MHz - - 10 ms CLOAD = 13pf 18 - 60 ns 0 - 16 ns Fall-asleep Time Delay Time for Valid Data tDV Delay Time for High Z tDZ 1 100% tested. IDD varies with CLOAD according to: ΔIDD = 0.5*VDD*ΔCLOAD*FCLOCK. 3 Maximum specifications are measured at maximum VDD. Typical specifications are measured at standard test conditions. 4 Valid microphones states are: Powered Down Mode (mic off), Sleep Mode (low current, DATA = high-Z, fast startup), and Active Mode (normal operation). 5 Time from FCLOCK < 1 kHz to ISLEEP specification is met when transitioning from Active Mode to Sleep Mode. 6 Time from FCLOCK ≥ 1 MHz to all applicable specifications are met when transitioning from Sleep Mode to Active Mode. 2 Revision: E Sheet 3 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 3. MICROPHONE STATE DIAGRAM Active Mode Powered Down Mode Revision: E Sheet 4 of 13 Sleep Mode 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 4. FREQUENCY RESPONSE CURVE Sensitivity (dB) Typical Free Field Response Normalized to 1kHz 20 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 100 1,000 10,000 Frequency (Hz) Revision: E Sheet 5 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 5. INTERFACE CIRCUIT VDD VDD .1µf .1µf SELECT SELECT Mic (High) Mic (Low) DATA CLOCK Microphone SELECT Asserts DATA On Latch DATA On Mic (High) VDD Rising Clock Edge Falling Clock Edge Mic (Low) GND Falling Clock Edge Rising Clock Edge Note: All Ground pins must be connected to ground. Capacitors near the microphone should not contain Class 2 dielectrics. Detailed information on acoustic, mechanical, and system integration can be found in the latest SiSonicTM Design Guide application note. 6. TIMING DIAGRAM 1/FCLOCK VIH CLOCK tEDGE tEDGE VIL tDZ tDV DATA (SELECT = VDD) VOH Mic (High) Data VOL tDV tDZ DATA (SELECT = GND) Revision: E Sheet 6 of 13 High Z High Z VOH Mic (Low) Data VOL 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 7. MECHANICAL SPECIFICATIONS Item Dimension Tolerance Units Length (L) 4.00 ±0.10 mm Width (W) 3.00 ±0.10 mm Height (H) 1.06 ±0.10 mm Acoustic Port (AP) Ø0.65 ±0.05 mm Pin # Pin Name Type Description 1 VDD Power Power Supply 2 SELECT Non-Digital Input Lo/Hi (L/R) Select This pin is internally pulled low. 3 CLOCK Digital I Clock Input 4 DATA Digital O PDM Output 5 GROUND Power Ground 6 GROUND Power Ground 7 GROUND Power Ground 8 GROUND Power Ground Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified. Dimensions are in millimeters unless otherwise specified. Tolerance is ±0.15mm unless otherwise specified Revision: E Sheet 7 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 8. EXAMPLE LAND PATTERN 9. EXAMPLE SOLDER STENCIL PATTERN Notes: Dimensions are in millimeters unless otherwise specified. Further optimizations based on application should be performed. Revision: E Sheet 8 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 10. PACKAGING & MARKETING DETAIL Model Number Suffix Reel Diameter Quantity Per Reel SPK0415HM4H-B -7 13” 5,700 Pin 1 Alpha Character A: “S”: Knowles SiSonicTM Production “E”: Knowles Engineering Samples “P”: Knowles Prototype Samples “JIN NUMBER”: Unique Job Identification Number for product traceability Notes: Dimensions are in millimeters unless otherwise specified. Vacuum pickup only in the pick area indicated in Mechanical Specifications. Tape & reel per EIA-481. Labels applied directly to reel and external package. Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of 30°C, 70% R.H. Revision: E Sheet 9 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 11. RECOMMENDED REFLOW PROFILE tP TP Ramp-up Temperature TL tL TSMAX TSMIN tS Preheat Ramp-down 25°C Time Time 25°C to Peak Profile Feature Average Ramp-up rate (TSMAX to TP) Preheat • Temperature Min (TSMIN) • Temperature Max (TSMAX) • Time (TSMIN to TSMAX) (tS) Time maintained above: • Temperature (TL) • Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature Pb-Free 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max 8 minutes max Notes: Based on IPC/JDEC J-STD-020 Revision C. All temperatures refer to topside of the package, measured on the package body surface. Revision: E Sheet 10 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 12. ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 1. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage: • Do not board wash or clean after the reflow process. • Do not brush board with or without solvents after the reflow process. • Do not directly expose to ultrasonic processing, welding, or cleaning. • Do not insert any object in port hole of device at any time. • Do not apply over 30 psi of air pressure into the port hole. • Do not pull a vacuum over port hole of the microphone. • Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec. 13. MATERIALS STATEMENT Meets the requirements of the European RoHS directive, 2011/65/EC as amended. Meets the requirements of the industry-standard IEC 61249-2-21:2003 for halogenated substances and Knowles Green Materials Standards Policy section on Halogen-Free. Ozone depleting substances are not used in the product or the processes used to make the product including compounds listed in annex A, B, and C of the “Montreal Protocol on Substances that deplete the ozone Layer.” Revision: E Sheet 11 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 14. RELIABILITY SPECIFICATIONS Test Description Thermal Shock 100 cycles air-to-air thermal shock from -40oC to +125oC with 15 minute soaks. (IEC 68-2-4) High Temperature Storage 1,000 hours at +105oC environment (IEC 68-2-2 Test Ba) Low Temperature Storage 1,000 hours at -40oC environment (IEC 68-2-2 Test Aa) High Temperature Bias 1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba) Low Temperature Bias 1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa) Temperature / Humidity Bias 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B) Vibration ESD-HBM ESD-LID/GND ESD-MM 4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak acceleration lasting 12 minutes in X, Y, and Z directions. (Mil-Std-883E, Method 2007.2 A) 3 discharges of ±2 kV direct contact to I/O pins. (MIL 883E, Method 3015.7) 3 discharges of ±8 kV direct contact to lid while unit is grounded. (IEC 61000-4-2) 3 discharges of ±200 V direct contact to I/O pins. (ESD STM5.2) Reflow 5 reflow cycles with peak temperature of +260oC Mechanical Shock 3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea) Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate more than 3 dB from its initial value. Revision: E Sheet 12 of 13 6/18/2013 ©2013 Knowles Electronics SPK0415HM4H-B 15. SPECIFICATIONS REVISIONS Revision Specification Changes Date A Initial Release (C10113326) 2/17/12 B Remove sleep current footnote; update State Diagram Release in new format; update PSR, AOP, THD, sleep current, base thickness; correct carrier tape Pin 1 location (C10114279) Updated SNR, THD, AOP, PSRR, and PSR; new JIN designation; new RoHS statement (C10114438); updated humidity conditions and ESD descriptions (C10114466); move Shelf Life statement to Section 10; fixed typos in Reliability Section 14 (C10114690) 4/02/12 C D E Corrected PSRR units, Update CLOAD value for tDV (C10114972) 11/02/12 3/25/13 06/18/13 Information contained herein is subject to change without notice. It may be used by a party at their own discretion and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not to be taken as a license to operate under any existing patents. Revision: E Sheet 13 of 13 6/18/2013 ©2013 Knowles Electronics