LRC LESDA6V8AW5T1G_11

LESHAN RADIO COMPANY, LTD.
Low Capacitance Q uad Array for ESD Protection
General Description
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its integrated design provides very effective and
reliable protection for four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
LESDA6V8AW5T1G
Features
• ESD Protection: IEC61000−4−2: Level 4
•
•
•
•
•
•
MILSTD 883C − Method 3015−6: Class 3
Four Separate Unidirectional Configurations for Protection
Low Leakage Current < 1 A
Power Dissipation: 380 mW
Small SC−88A SMT Package
Low Capacitance
Pb−Free Package is Available
SC−88A/SOT−353
z AEC
Q101
Qualified
and PPAP
?AEC
Q101
Qualified
and Capable
PPAP Capable
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects the Line Against Transient Voltage Conditions in Either
Direction
Minimize Power Consumption of the System
Minimize PCB Board Space
•
•
Typical Applications
• Instrumentation Equipment
• Serial and Parallel Ports
• Microprocessor Based Equipment
• Notebooks, Desktops, Servers
• Cellular and Portable Equipment
ORDERING INFORMATION
Device
LESDA6V8AW5T1G
Marking
Shipping
6H
3000/Tape & Reel
Rev.O 1/4
LESHAN RADIO COMPANY, LTD.
LESDA6V8AW5T1G
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Power Dissipation
8 20 sec Double Exponential Waveform (Note 1)
PPK
20
W
Steady State Power − 1 Diode (Note 2)
PD
200
mW
327
3.05
°C/W
mW/°C
Thermal Resistance −
Junction−to−Ambient
Above 25°C, Derate
RJA
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Lead Solder Temperature − Maximum 10 Seconds Duration
TL
260
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Non−repetitive current pulse per Figure 1.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
VBR
6.4
6.8
7.1
V
Leakage Current (VRWM = 5.0 V)
IR
−
−
1.0
A
Clamping Voltage 1 (IPP = 1.6 A, 8 20 sec Waveform)
VC
−
−
13
V
Maximum Peak Pulse Current (8 20 sec Waveform)
IPP
−
−
1.6
A
Junction Capacitance − (VR = 0 V, f = 1 MHz)
− (VR = 3.0 V, f = 1 MHz)
CJ
−
−
12
6.7
15
9.5
pF
Characteristic
Breakdown Voltage (IT = 1 mA) (Note 3)
3. VBR is measured at pulse test current IT.
Rev.O 2/4
LESHAN RADIO COMPANY, LTD.
LESDA6V8AW5T1G
110
% OF RATED POWER OR IPP
Ppk, PEAK SURGE POWER (W)
100
10
10
100
90
80
70
60
50
40
30
20
10
0
1
1
100
1000
50
75
100
Figure 2. Power Derating Curve
150
14
0.14
0.12
0.10
0.08
0.06
0.04
0.02
12
TA = 25°C
10
8
6
4
2
0
0
−60 −40
0
20
40
60
80
100
2
3
4
5
Figure 3. Reverse Leakage versus
Temperature
Figure 4. Capacitance
70
60
HALF VALUE IRSM/2 @ 20 s
50
6
1
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 s
40
tP
20
1
BIAS VOLTAGE (V)
80
30
0
T, TEMPERATURE (°C)
PEAK VALUE IRSM @ 8 s
tr
90
−20
IF, FORWARD CURRENT (A)
100
0.1
0.01
10
0
125
Figure 1. Pulse Width
TYPICAL CAPACITANCE (pF)
1 MHz FREQUENCY
IR, REVERSE LEAKAGE (A)
25
TA, AMBIENT TEMPERATURE (°C)
0.16
% OF PEAK PULSE CURRENT
0
t, TIME (s)
TA = 25°C
0.001
0
20
40
60
80
0.6
0.8
1.0
1.2
1.4
1.6
t, TIME (s)
VF, FORWARD VOLTAGE (V)
Figure 5. 8 × 20 s Pulse Waveform
Figure 6. Forward Voltage
Rev.O 3/4
1.8
LESHAN RADIO COMPANY, LTD.
LESDA6V8AW5T1G
SC−88A/SOT−353
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
5
4
DIM
A
B
C
D
G
H
J
K
N
S
−B−
S
1
2
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
Rev.O 4/4