LMBR0520FT1G thru LMBR0540FT1G Schottky Barrier Rectifiers Reverse Voltage 20 to 40V Forward Current 0.5A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD123-FL/MINI SMA molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code LMBR0520FT1G LMBR0530FT1G LMBR0540FT1G 052 053 054 30 40 V Unit Maximum repetitive peak reverse voltage VRRM 20 Maximum RMS voltage VRMS 14 21 28 V Maximum DC blocking voltage VDC 20 30 40 V Maximum average forward rectified current at TA = 75°C IF(AV) 0.5 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A RθJA RθJC 110 40 °C/W Typical thermal resistance (Note 1) Operating junction temperature range storage temperature range –55 to +125 TJ –55 to +150 –65 to +175 TSTG °C °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol Maximum instantaneous forward voltage at(IF = 0.1 A, TJ = 25°C) (IF = 0.5 A, TJ = 25°C) Maximum DC reverse current at rated DC blocking voltage TA = 25℃ Tj = 100℃ Typical junction capacitance at 4.0V, 1MHz NOTES: 1. 8.0mm2 (.013mm thick) land areas symbol LMBR0520FT1G LMBR130FT1G LMBR0540FT1G Unit VF 0.3 0.385 0.375 0.450 0.55 V IR 0.25 8 0.130 10 0.04 10 mA CJ 160 PF LMBR0520FT1G thru LMBR0540FT1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load Peak forward surge current Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.5 0.25 TJ = TJ max 8.3ms Single Half Sine-wave 30 15 0 1 0 10 Tj=100 1.0 Tj=75 0.1 1.0 Tj=25 0.01 0.1 0.001 0.01 0.2 Transient thermal impedance(°C/W) Instantaneous Reverse Current (mA) TJ = 25°C Pulse width = 300µs 1% Duty Cycle Fig 4. – Typical Reverse Characteristics 10 100 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (V) Fig 6. – Typical Junction Capacitance Fig 5. –typical transient thermal impedance 1000 Junction Capacitance (pF) Instantaneous Forward Current (A) 0 100 25 50 75 100 125 150 175 Ambient Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics 10 Number of Cycles at 60Hz 10 1.0 TJ = 25°C f = 1.0 MHz Vsig = 100 10 0.1 0.1 0.01 0.1 1.0 10 t,Pulse duration,sec 100 1 10 Reverse Voltage (V) 100 LMBR0520FT1G thru LMBR0540FT1G 3. dimension: SOD123-FL DIM A B C D E H J K MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) LMBR0520FT1G thru LMBR0540FT1G 4.Packing information Unit：mm Item Symbol tolerance SOD123-FL Carrier width A 0.1 2.00 Carrier length B 0.1 3.85 Carrier depth C 0.1 1.10 Sprocket hole d 0.1 1.50 13" Reel outside diameter D 2.0 - 13" Reel inner diameter D1 min - 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 3.50 Punch hole pitch P 0.1 4.00 Spocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.23 Tape width W 0.3 8.00 Reel width W1 1.0 11.40 LMBR0520FT1G thru LMBR0540FT1G Reel packing PACKAGE SOD123-FL REEL SIZE 7" REEL COMPONENT (PCS) SPACING 3,000 (mm) 4.0 BOX INNER BOX REEL DIA. CARTON SIZE CARTON (pcs) (mm) (mm) (mm) (PCS) 30,000 183*183*123 178 382*262*387 240,000 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec Time maintained above: - Temperature (TL) 217℃ - Time(tL) 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) Ramp-down Rate Time 25℃ to Peak Temperature 10~30sec <6℃/sec <6minutes APPOX. GROSS WEIGHT (kg) 8.7 LMBR0520FT1G thru LMBR0540FT1G 6.High reliability test capabilities Item Test Condition Reference Solder Resistance at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" Solderability at 245±5℃ for 5 sec High Temperature Reverse Bias VR=80% rate at Tj=150℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life Rated average rectifier current TA=25℃ for 500hrs MIL-STD-750D METHOD-1027 Intermittent Operation Life TA=25℃，IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-4066-2 LMBR0520FT1G thru LMBR0540FT1G 7. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2013.04.03