AGILENT HMMC-3028

Agilent HMMC–3028
DC–12 GHz High Efficiency
GaAs HBT MMIC
Divide–by–8 Prescaler
1GC1-8008
Data Sheet
Features
• Wide Frequency Range:
0.2-12 GHz
• High Input Power Sensitivity:
On-chip pre- and post-amps
-20 to +10 dBm (1–8 GHz)
-15 to +10 dBm (8–10 GHz)
-10 to +5 dBm (10–12 GHz)
• Dual-mode Pout: (Chip Form)
0 dBm (0.5 Vp–p) @ 44 mA
-6.0 dBm (0.25 Vp–p) @ 34 mA
• Low Phase Noise:
-153 dBc/Hz @ 100 kHz Offset
• (+) or (-) Single Supply Bias
Operation
• Wide Bias Supply Range:
4.5 to 6.5 volt operating range
• Differential I/0 with on-chip
50 Ω matching
Description
The HMMC-3028 GaAs HBT MMIC
Prescaler offers dc to
12 GHz frequency translation
for use in communications
and EW systems incorporating highfrequency PLL oscillator circuits and
signal-path down conversion applications. The prescaler provides a
large input power sensitivity window
and low phase noise. In addition to
the features listed above the device
offers an input disable contact pad to
eliminate any self-oscillation condition.
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
1330 x 440 µm (52.4 x 17.3 mils)
± 10 µm (± 0.4 mils)
127 ± 15 µm (5.0 ± 0.6 mils)
70 x 70 µm (2.8 x 2.8 mils)
Absolute Maximum Ratings1
(@ TA = 25°C, unless otherwise indicated)
Symbol
Parameters/Conditions
Min.
Max.
Units
VCC
Bias supply voltage
+7
volts
VEE
Bias supply voltage
-7
VCC - VEE
Bias supply delta
0
+7
volts
VDisable
Pre-amp disable voltage
VEE
VCC
volts
VLogic
Logic threshold voltage
VCC -1.5
VCC -1.2
volts
Pin(CW)
CW RF input power
+10
dBm
VRFin
DC input voltage
(@ RFin or RFin ports)
VCC ±0.5
volts
volts
TBS2
Backside operating temperature
-40
+85
°C
Tst
Storage temperature
-65
+165
°C
Tmax
Maximum assembly temperature
(60 s max.)
310
°C
Notes
1. Operation in excess of any parameter limit (except TBS) may cause permanent damage to the device.
2. MTTF > 1 x 106 hours @ TBS ≤ 85°C. Operation in excess of maximum operating temperature (TBS) will degrade MTTF.
dc Specifications/Physical Properties
(TA = 25°C, VCC – VEE = 5.0 volts, unless otherwise listed)
Symbol
Parameters/Conditions
Min.
Typ.
Max.
Units
VCC – VEE
Operating bias supply difference1
4.5
5.0
6.5
volts
|ICC| or |IEE|
Bias supply current
(HIGH Output Power Configuration2: VPwrSel = VEE)
37
44
51
mA
Bias supply current
(LOW Output Power Configuration: VPwrSel = open)
29
34
39
mA
VRFin(q)
VRFout(q)
Quiescent dc voltage appearing at all RF ports
VLogic
Nominal ECL Logic Level
(VLogic contact self-bias voltage, generated on-chip)
VCC
VCC -1.45
VCC -1.32
volts
VCC -1.25
volts
Notes
1. Prescaler will operate over full specified supply voltage range, VCC or VEE not to exceed limits specified in Absolute Maximum Ratings section.
2. High output power configuration: Pout = 0 dBm (Vout = 0.5 Vp-p). Low output power configuration: Pout = -6.0 dBm (Vout = 0.25 Vp-p)
RF Specifications
(TA = 25°C, Z0 = 50 Ω, VCC – VEE = 5.0 volts)
(÷8)
Symbol
Parameters/Conditions
Min.
Typ.
12
14
ƒin(max)
Maximum input frequency of operation
ƒin(min)
Minimum input frequency of
(Pin = -10 dBm)
operation1
ƒSelf-Osc.
Output Self-Oscillation Frequency2
Pin
@ dc, (Square-wave input)
-15
> -25
+10
dBm
@ ƒin = 500 MHz, (Sine-wave input)
-15
> -20
+10
dBm
ƒin = 1 to 8 GHz
-15
> -20
+10
dBm
ƒin = 8 to 10 GHz
-10
> -15
+5
dBm
ƒin = 10 to 12 GHz
-5
> -10
-1
dBm
0.2
Max.
Units
GHz
0.5
1.7
GHz
GHz
RL
Small-Signal Input/Output Return Loss (@ ƒin < 12 GHz)
15
dB
S12
Small-Signal Reverse Isolation (@ ƒin < 12 GHz)
30
dB
φN
SSB Phase noise (@ Pin = 0 dBm, 100 kHz offset from a
ƒout = 1.2 GHz Carrier)
-153
dBc/Hz
Jitter
Input signal time variation @ zero–crossing
(ƒin = 10 GHz, Pin = -10 dBm)
1
ps
Tr or Tf
Output edge speed (10% to 90% rise/fall time)
70
ps
Notes
1. For sine-wave input signal. Prescaler will operate down to D.C. for square-wave input signal. Minimum divide frequency limited by input slew-rate.
2. Prescaler may exhibit this output signal under bias in the absence of an RF input signal. This condition may be eliminated by use of the Pre-amp
Disable ( VDisable) feature, or the Differential Input de-biasing technique.
2
RF Specifications (Continued)
(TA = 25°C, Z0 = 50 Ω, VCC – VEE = 5.0 volts)
Symbol
Parameters/Conditions
High Output Power Operating Mode1
Min.
Typ.
Max.
Pout
@ ƒout < 1 GHz
-2.0
0
dBM
@ ƒout = 1.25 GHz
-2.0
0
dBm
@ ƒout = 1.5 GHz
-2.25
-0.25
dBm
@ ƒout < 1 GHz
0.39
0.5
volts
@ ƒout = 1.25 GHz
0.39
0.5
volts
@ ƒout = 1.5 GHz
0.38
0.48
volts
ƒout power level appearing at RFin or RFin
(@ ƒin = 10 GHz, unused RFout or RFout unterminated)
-61
dBm
ƒout power level appearing at RFin or RFin
(@ ƒin = 10 GHz, both RFout & RFout terminated)
-81
dBm
Pfeedthru
Power level of ƒin appearing at RFout or RFout
(@ ƒin = 12 GHz, Pin= 0 dBm, referred to Pin (ƒin)
-30
dBc
H2
Second harmonic distortion output level
(@ ƒout = 1.5 GHz, referred to Pout (ƒout))
-30
dBc
|Vout(p–p)|
PSpitback
Units
Low Output Power Operating Mode2
Pout
|Vout(p–p)|
PSpitback
Pfeedthru
H2
@ ƒout < 1 GHz
-8.0
-6.0
dBm
@ ƒout = 1.25 GHz
-8.0
-6.0
dBm
@ ƒout = 1.5 GHz
-8.25
-6.25
dBm
@ ƒout < 1 GHz
0.20
0.25
volts
@ ƒout = 1.25 GHz
0.20
0.25
volts
@ ƒout = 1.5 GHz
0.19
0.24
volts
ƒout power level appearing at RFin or RFin
(@ ƒin 10 GHz, unused RFout or RFout unterminated)
-71
dBm
ƒout power level appearing at RFin or RFin
(@ ƒin = 10 GHz, both RFout & RFout terminated)
-91
dBm
Power level of ƒin appearing at RFout or RFout
(@ ƒin = 12 GHz, Pin = 0 dBm, referred to Pin (ƒin))
-30
dBc
Second harmonic distortion output level
(@ ƒout = 1.5 GHz, referred to Pout (ƒout))
-35
dBc
Notes
1. VPwrSel = VEE.
2. VPwrSel = Open Circuit.
3
Post Amplifier Stage
Input Preamplifier Stage
2
Figure 1. Simplified Schematic
Applications
The HMMC-3028 is designed for use in
high frequency communications, microwave instrumentation, and EW radar
systems where low phase-noise PLL
control circuitry or broad-band frequency
translation is required.
Operation
The device is designed to operate
when driven with either a single-ended
or differential sinusoidal input signal
over a 200 MHz to
12 GHz bandwidth. Below 200 MHz the
prescaler input is “slew-rate” limited,
requiring fast rising and falling edge
speeds to properly
divide. The device will operate at frequencies down to dc when driven with
a square-wave.
The device may be biased from either a
single positive or single negative supply bias. The backside of the device is
not dc
connected to any dc bias point
on the device.
For positive supply operation VCC is
nominally biased at any voltage in the
+4.5 to +6.5 volt range with VEE (or VEE
& VPwrSel) grounded. For negative bias
operation VCC
is typically grounded and a
negative voltage between -4.5
to -6.5 volts is applied to VEE
(or VEE & VPwrSel).
4
Several features are designed into this
prescaler:
1. Dual-Output Power Feature
Bonding both VEE and VPwrSel pads to
either ground (positive bias mode) or
the negative
supply (negative bias mode),
will deliver ~0 dBm [0.5 Vp–p]
at the RF output port while drawing
~40 mA supply current. Eliminating
the VPwrSel connection results in reduced output power and voltage swing,
-6.0 dBm
[0.25 Vp–p] but at a reduced current
draw of ~30 mA resulting in less overall power dissipation.
(NOTE: VEE must ALWAYS
be bonded and VPwrSel must
NEVER be biased to any
potential other than VEE
or open-circuited.)
2. VLogic ECL Contact Pad
Under normal conditions
no connection or external bias
is required to this pad and it
is self-biased to the on-chip ECL
logic threshold voltage
(VCC -1.35 V). The user can
provide an external bias to this pad
(1.5 to 1.2 volts less than VCC) to force
the prescaler to
operate at a system generated logic
threshold voltage.
3. Input Disable Feature
If an RF signal with sufficient signalto-noise ratio is present at the RF
input, the prescaler will operate and
provide a divided output equal to the
input frequency divided by the divide
modulus. Under certain “ideal” conditions where the input is well matched
at the right input frequency, the
device may “self-oscillate,” especially
under small signal input powers or
with only noise present at the input.
This “self-oscillation” will produce an
undesired output signal also known as
a false trigger. By applying an external
bias to the input disable contact pad
(more positive than VCC -1.35 V), the
input preamplifier stage is locked
into either logic “high” or logic “low”
preventing frequency division and any
self-oscillation frequency which may
be present.
4. Input dc Offset
Another method used to prevent false
triggers or self-oscillation
conditions is to apply a 20 to
100 mV dc offset voltage between
the RFin and RFin ports. This prevents
noise or spurious low level signals
from triggering
the divider.
Adding a 10 KΩ resistor between the
unused RF input to a contact point at
the VEE potential will result in an off-
set of ≈25 mV between the RF inputs.
Note however, that the input sensitivity
will be reduced slightly due to the
presence of this offset.
Assembly Techniques
Figure 3 shows the chip assembly
diagram for single-ended I/O operation through 12 GHz for either positive
or negative bias supply operation. In
either case the supply contact to the
chip must be capacitively bypassed to
provide good input sensitivity and low
input power feedthrough. Independent
of the bias applied to the device, the
backside of the chip should always be
connected to both a good RF ground
plane and a good thermal heat sinking
region on the mounting surface.
All RF ports are dc connected
on-chip to the VCC contact through
on-chip 50 Ω resistors. Under any
bias conditions where VCC is not dc
grounded, the RF ports should be ac
coupled via series capacitors mounted
on the thin-film substrate at each RF
port. Only under bias conditions where
VCC is dc grounded (as is typical for
negative bias supply operation) may
the RF ports be direct coupled to adjacent circuitry or in some cases, such
as level shifting to subsequent stages.
In the latter case the device backside
may be “floated” and bias applied as
the difference between VCC and VEE.
5
All bonds between the device and this
bypass capacitor should be as short
as possible to limit the inductance.
For operation at frequencies below 1
GHz, a large value capacitor must be
added to provide proper RF bypassing.
Due to on-chip 50 Ω matching resistors at all four RF ports, no external
termination is required on any unused
RF port. However, improved “Spitback” performance (~20 dB) and
input sensitivity can be achieved by
terminating the unused RFout port to
VCC through 50 Ω (positive supply) or
to ground via
a 50 Ω termination (negative
supply operation).
GaAs MMICs are ESD sensitive.
ESD preventive measures must be
employed in all aspects of storage,
handling, and assembly.
MMIC ESD precautions, handling
considerations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and
reliability.
Agilent application note #54, “GaAs
MMIC ESD, Die Attach and Bonding
Guidelines”
provides basic information
on these subjects.
Optional dc Operating Values/Logic Levels
(TA = 25°C)
Function
Symbol
Logic Threshold1
Conditions
Min
(volts/mA)
Typical
(volts/mA)
Max
(volts/mA)
VLogic
VCC-1.5
VCC-1.35
VCC-1.2
Input Disable
VDisable(High) [Disable]
VLogic+0.25
VLogic
VCC
Input Disable
VDisable(Low) [Enable]
VEE
VLogic
VLogic-0.25
Input Disable
IDisable
VD > VEE+3
(VDisable-VEE -3)/500
Input Disable
IDisable
VD < VEE+3
0
(VDisable-VEE -3)/500
0
(VDisable-VEE -3)/500
0
Note:
1. Acceptable voltage range when applied from external source.
Notes:
• All dimensions in micrometers.
• All Pad Dim: 70 x 70 µm
(except where noted).
• Tolerances: ± 10 µm
• Chip Thickness: 127 ± 15 µm
Figure 2. Pad locations and chip dimensions
6
Figure 3. Assembly diagrams
7
Figure 4. Typical input sensitivity window
Figure 5. Typical supply current & VLogic vs. supply voltage
Figure 6. Typical phase noise performance
Figure 7. Typical output power vs. output frequency, ƒout (GHz)
Figure 8. Typical “Spitback” power P(ƒout) appearing
at RF input port
8
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This data sheet contains a variety of
typical and guaranteed performance
data. The information supplied should
not be interpreted as a complete list of
circuit specifications. Customers
considering the use of this, or other
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In this data sheet the term typical
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Revised: May 7, 2007
Product specifications and descriptions
in this document subject to change
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© Agilent Technologies, Inc. 2007
Printed in USA, November 19, 2007
5989-7348EN