LUGUANG FM201

Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
2.0A Surface Mount General Purpose
Rectifiers - 50V-1000V
Package outline
Features
SMA
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
0.196(4.9)
0.180(4.5)
• Low profile surface mounted application in order to
•
•
•
•
•
0.012(0.3) Typ.
optimize board space.
High current capability.
High surge capability.
Glass passivated chip junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free parts, ex. FM201-H.
0.106(2.7)
0.091(2.3)
Mechanical data
0.068(1.7)
0.060(1.5)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
0.032(0.8) Typ.
MIL-STD-750, Method 2026
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
V R = V RRM T J = 125 OC
Diode junction capacitance
f=1MHz and applied 4V DC reverse voltage
Storage temperature
SYMBOLS
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
50
50
100
70
100
FM203
200
140
200
FM204
400
280
400
FM205
600
420
600
FM206
800
560
800
FM207
1000
700
1000
FM202
UNIT
IO
2.0
A
I FSM
50
A
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TEL:886-2-22696661
FAX:886-2-22696141
*4
VF
(V)
Operating
temperature
T J, ( OC)
MIN.
TYP.
5.0
IR
μA
125
30
CJ
T STG
35
FM201
MAX.
Symbol
pF
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
1.10
-55 to +150
Page 2
*4 Maximum forward [email protected] F=2.0A
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Rating and characteristic curves (FM201 THRU FM207)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
CHARACTERISTICS
AVERAGE FORWARD CURRENT,(A)
10
1
2.4
2.0
1.6
1.2
P.C.B. Mounted on
0.2" x 0.2" (5 mm x 5 mm)
Copper Pad Areas
0.8
0.4
0
0
20
40
60
TJ=25 C
80
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
Pulse Width 300us
1% Duty Cycle
.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
.01
.6
.8
1.0
1.2
1.4
1.6
1.8
2.0
FORWARD VOLTAGE,(V)
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
PEAK FORWAARD SURGE CURRENT,(A)
INSTANTANEOUS FORWARD CURRENT,(A)
100
50
40
8.3ms Single Half
TJ=25 C
Sine Wave
30
JEDEC method
20
10
0
1
100
5
50
10
100
10
FIG.5-TYPICAL JUNCTION CAPACITANCE
TJ=125 C
175
1.0
TJ=25 C
.1
.01
0
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (m
A)
NUMBER OF CYCLES AT 60Hz
NUMBER OF CYCLES AT 60Hz
150
125
100
75
50
25
20
40
60
80
100 120 140
PERCENTAGE RATED PEAK REVERSE VOLTAGE
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
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TEL:886-2-22696661
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Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FM201
FM202
FM203
FM204
FM205
FM206
FM207
A21
A22
A23
A24
A25
A26
A27
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMA
0.110 (2.80)
0.063 (1.60)
0.087 (2.20)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMA
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
5.00
1.90
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
Reel packing
PACKAGE
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
SMA
7"
2,000
4.0
20,000
183*170*183
178
382*356*387
160,000
16.0
SMA
13"
7,500
4.0
15,000
337*337*37
330
350*330*360
120,000
14.2
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7
Formosa MS
Chip Silicon Rectifier
FM201 THRU FM207
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
7. Temperature Cycling
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
MIL-STD-750D
METHOD-1051
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
9. Forward Surge
8.3ms single half sine-wave superimposed
on rated load, one surge.
MIL-STD-750D
METHOD-4066-2
10. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
8. Thermal Shock
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TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121107
2008/02/10
2010/03/09
D
7