http://www.luguang.cn 1． Email: [email protected] SCOPE This specification shall cover the characteristics of the ceramic fliter with the type LTCV10.7MA5. The LTCA10.7MS2 filters are small, high performance and very thin (1.5mm) chip devices consisting of 2 ceramic elements for communication equipment. They are designed on MgTiO3 ceramic cap package. 3. PART NO.: PART NUMBER CUSTOMER PART NO SPECIFICATION NO LTCV10.7MA5 4. OUTLINE DRAWING AND DIMENSIONS: Appearance: No visible damage and dirt. Dimensions: According to Figure 1. Figure 1. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 http://www.luguang.cn Email: [email protected] STRUCTURE Output/Input Electrode Cermic Cover Oscillation Electrode glue Cermic Substrate 5. ELECTRICAL SPECIFICATIONS: No. Items Center Frequency(fo)(MHz) Requirements The center point of 3dB band width is defined as the center frequency and identified by the letters:A,B,C,D or E. 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 5.10 5.11 3dB Bandwidth(kHz) 20dB Bandwidth(kHz) max Insertion Loss (dB) Ripple (dB) max Spurious Response (dB) min Input/Output Impedance(Ω) Withstanding Voltage Insulation Resistance (MΩ) min Operating temperature range(℃) Storage temperature range(℃) A:10.700±0.030 C:10.730±0.030 E:10.760±0.030 B:10.670±0.030 D:10.640±0.030 280±50 590 3.0±2.0 (at minimum loss point) 1.0 (within 3dB Bandwidth) 35 (9MHz-12MHz) 330 50V DC 1 min 100 (DC 10V) -25～+85 -40～+85 6. MEASUREMENT: Measurement Conditions: Parts shall be measured under a condition ( Temp. ： 20±15 ℃ ,Humidity ： 65±20% R.H.) unless the standard condition(Temp. ： 25±3 ℃ ,Humidity ： 65±5% R.H.) is regulated to measure. Test Circuit: Rg R2 S.S.G. C2 RF Voltmeter R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω ①:Input C2=10 Pf (Including stray capacitance ②:Ground and capacitance of RF Voltmeter) ③:Output S.S.G:Output Voltmeter SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 2 http://www.luguang.cn Email: [email protected] 7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS NO. 7.1 Item Low Temp Storage High Temp Storage Humidity 7.2 7.3 7.4 Thermal Shock 7.5 Soldering Test 7.6 Solderability 7.7 Drop test 7.8 Vibration 7.9 Board Bending Performance Requirment Stored in -40±3℃ for 96 hours，and left at room Meet Table 1 temp. for 1 hour before measurement. Stored in 85±2℃ for 96 hours，and left at room Meet Table 1 temp. for 1 hour before measurement. Stored at 40±2℃，in 90～95%R.H. for 96 hours, Meet Table 1 and left at room temp. for 1 hour before measurement.。 After temp. cycling of -40℃(30 minutes) to +85℃ Meet Table 1 (30 minutes) was performed 5 times, filter shall be measured after being placed in natural condition for 1 hour . Passed through the reflow oven under the Meet Table 1 following condition for 2 times, and left at room temp. for 24 hours before measurement. Condition of Test Dipped in 235±5℃ solder bath for 3±0.5 seconds with rosin flux. Temp. at the surface of Time the substrate Preheat 150±5℃ 60±10 sec Peak 235±5℃ 10±3sec Free drop to the wood plate from the height of 70 cm for 3 times. Apply the vibration of sweep frequency 10 to 55Hz/minutes, amplitude 1.5mm, duration 2 hours in each direction of 3 planes. Mount on a glass-epoxy board( width=50 mm, thickness=1.6mm),then bend it to 1mm displacement(velocity 1mm/sec) and keep it for 5 seconds. The terminals shall be at least 95% covered by solder Meet Table 1 Meet Table 1 Mechanical damage such as break shall not occur Press 20 R10 Support bar 5 45±2 D.U.T 1.0±0.2 Press Head 45±2 SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 3 http://www.luguang.cn Email: [email protected] TABLE 1 Item Specification Insertion Loss Drift (dB) max ±2 3dB Bandwidth Drift (kHz) max ±25 20dB Bandwidth Drift (kHz) max ±60 Note: The limits in the above table are referenced to the initial measurements. 8. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS Recommended land pattern 2.9±0.3 4.0±0.3 2.9±0.3 1.5±0.3 1.5±0.3 1.5±0.3 Recommended reflow soldering standard conditions Temperature(℃) within 10 sec 220~230℃ 200 150 100 Pre-heating within 80-120sec. within 20-40sec SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 4 http://www.luguang.cn Email: [email protected] 9. PACKAGE To protect the products in storage and transportation ，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) NO. 1 2 3 4 5 6 7 Name Package Certificate of approval Label Tying Adhesive tape Belt Inner Box Quantity 1 1 1 2 1.2m 2.9m 10 Notes SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 http://www.luguang.cn Email: [email protected] Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is vacuum packed for plastic bag (at 300 Torr of vacuum rate). Quantity of package Per plastic reel 4000 pieces of piezoelectric ceramic part Per inner box 1 reels Per package 10 inner boxes（40000 pieces of piezoelectric ceramic part ） Inner Packing Dimensions 1.UNIT: mm 1 Label 2 QC Label 3 Inner Box Pars shall be packaged in box with hold down tape upside. Part No., quantity and lot No. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 6 http://www.luguang.cn Email: [email protected] Reel 2.0±0.5 5 . 0 0 . 3 1 ? ± ) 3 0 3 3 ? ( ± 8 . 0 1 2 ? ± (Unit: mm) 120° 16.4min 22.4max. 7.5± 0.1 16.0± 0.2 4.0± 0.1 2.0± 0.1 1.5 0 7.5± 0.1 1.75± 0.1 Taping Dimensions 1.5 0+0.1 (Unit:mm) Chip Filter 8.0± 0.1 3.5± 0.1 Tape Characteristics Blank Pocket 10 Pitches End Loaded Pocket Blank Pocket 10 Pitches lead tape ...... ...... 150~200mm Feeding direction SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 7 http://www.luguang.cn Test Condition Of Peeling Strength T op T ape Email: [email protected] S tre n g t P e e li n g g h 2 0 -7 0 10° M ax C a rrie r T a p e 10 OTHER 10.1 Caution of use 10.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 10.1.2 The component may be damaged when an excess stress will be applied. 10.1.3 Conformal coating of the component is acceptable, However the resin materials ,curing temperature and other process conditions should be evaluated to conform stable electrical characteristics are maintained. 10.2 Notice 10.2.1 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 10.2.2 Please return one of this specification after your signature of acceptance. 10.2.3 When something gets doubtful with this specifications, we shall jointly work to get an agreement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 8