LUGUANG LTCV10.7MS3

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1 SCOPE
This specification shall cover the characteristics of the ceramic
fliter with the type LTCV10.7MS3. The LTCV10.7MS3 filters are small,
high performance and very thin (1.5mm) chip devices consisting of 2
ceramic elements for communication equipment. They are designed on
MgTiO3 ceramic cap package.
2 PART NO.
PART NUMBER
CUSTOMER PART NO.
SPECIFICATION NO.
LTCV10.7MS3
3 OUTLINE DRAWING AND STRUCTURE
3.1 Appearance
No visible damage and dirt.
3.2 Dimensions
7.
1
3
S3
3. ±0.3
3
①
②
③
range of frequency
2
3
2
3
2
3
①:Input
②:Ground
③:output
Unit:mm
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3.3 STRUCTURE
O u tp u t/In p u t
E le c t ro d e
C e rm ic
C over
O s c il la tio n
E le c tro d e
g lu e
C e r m ic
S u b s tra te
4 ELECTRICAL SPECIFICATIONS
4.1 RATING
Items
Content
Withstanding Voltage (V)
50 (DC,1min)
Insulation Resistance Ri,(MΩ)min.
100 (100V,1min)
Operating Temperature Range (℃)
-25~+85
Storage Temperature Range (℃)
-40~+85
4.2 ELECTRICAL SPECIFICATIONS
Items
Content
Center Frequency(fo)(MHz)
A:10.700±0.030
B:10.670±0.030
The center point of 3dB band width is defined as
C:10.730±0.030
D:10.640±0.030
the center frequency and identified by the
E:10.760±0.030
letters:A,B,C,D or E.
3dB Bandwidth(kHz)
180±40
20dB Bandwidth(kHz) max
470
Insertion Loss (dB)
4.0±2.0 (at minimum loss point)
Ripple (dB) max
1.0
(within 3dB Bandwidth)
Spurious Response (dB) min
35
(9MHz-12MHz)
Input/Output Impedance(Ω)
330
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5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃,
Humidity:65%±20%R.H.)unless
the
standard
condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated
to test.
5.2 Test Circuit:
R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω
C2=10 Pf (Including stray capacitance
and capacitance of RF Voltmeter)
3
1
Rg
2
S.S.G:Output Voltmeter
R2
S.S.G.
C2
RF
Voltmeter
①:Input
②:Ground
③:Output
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
NO.
6.1
6.2
Item
Low Temp
Storage
High Temp
Storage
6.3
Humidity
6.4
Thermal
Shock
6.5
Soldering
Test
6.6
Solderability
Condition of Test
Stored in -40℃±3℃ for 96h,and left at room
temp. for 1h before measurement.
Stored in 85℃±2℃ for 96h,and left at room
temp. for 1h before measurement.
Stored at 40℃±2℃,in 90%~95%R.H. for 96h,
and left at room temp. for 1h before measurement
After temp. cycling of -40℃(30 minutes) to +85℃
(30min) was performed 5 times, filter shall be
measured after being placed in natural condition
for 1h.
Passed through the reflow oven under the
following condition for 2 times, and left at room
temp. for 24h before measurement.
Dipped in 235℃±5℃ solder bath for 3s±0.5s
with rosin flux.
Temp. at the surface of
Time
the substrate
Preheat 150℃±5℃
60s±10s
Peak
235℃±5℃
10s±3s
Performance
Requirment
Meet Table 1
Meet Table 1
Meet Table 1
Meet Table 1
Meet Table 1
The terminals
shall be at
least 95%
covered by
solder
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6.7
Drop test
6.8
Vibration
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Free drop to the wood plate from the height of 70
Meet Table 1
cm for 3 times.
Apply the vibration of sweep frequency 10 to
55Hz/minutes, amplitude 1.5mm, duration 2h in Meet Table 1
each direction of 3 planes.
Mount on a glass-epoxy board( width=50 mm,
thickness=1.6mm),then
bend
it
to
1mm
displacement(velocity 1mm/sec) and keep it for 5s.
Mechanical
damage such
as break shall
not occur
Press
Board
Bending
20
Press Head
R10
Support bar
5
45± 2
D.U.T
1.0± 0.2
6.9
45± 2
TABLE 1 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS
Item
Specification after test
Insertion Loss Drift (dB) max
3dB Bandwidth Drift (kHz) max
20dB Bandwidth Drift (kHz) max
±2
±25
±60
Note : The limits in the above table are referenced to the initial measurements.
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1Recommended land pattern
2.9± 0.3
4.0± 0.3
2.9± 0.3
1.5± 0.3
1.5± 0.3
1.5± 0.3
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7.2Recommended reflow soldering standard conditions
Temperature(℃)
within 10 sec
220~230℃
200
150
100
Pre-heating
within
80-120sec.
within
20-40sec
8 PACKAGE
To protect the products in storage and transportation ,it is
necessary to pack them(outer and inner package).On paper pack, the
following requirements are requested.
Dimensions and Mark
At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
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NO.
1
2
3
4
5
6
7
Name
Package
Certificate of approval
Label
Tying
Adhesive tape
Belt
Inner Box
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Quantity
1
1
1
2
1.2m
2.9m
10
Notes
Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is
vacuum packed for plastic bag (at 300 Torr of vacuum rate).
Quantity of package
Per plastic reel
4000 pieces of piezoelectric ceramic part
Per inner box
1 reels
Per package
10 inner boxes(40000 pieces of piezoelectric
ceramic part )
Inner Packing Dimensions
1.UNIT: mm
1
Label
2
QC Label
3
Inner Box
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Pars shall be packaged in box with hold down tape upside. Part
No., quantity and lot No.
8.5Reel
2.0± 0.5
21± 0
( 330± 3)
13.0± 0.5
.8
(Unit: mm)
120°
16.4min
22.4max.
7.5± 0.1
16.0± 0.2
4.0± 0.1
2.0± 0.1
1.5 0
7.5± 0.1
1.75± 0.1
8.6Taping Dimensions
1.5 0+0.1
(Unit:mm)
Chip Filter
8.0± 0.1
3.5± 0.1
8.7Tape Characteristics
Blank Pocket
10 Pitches
End
Loaded Pocket
Blank Pocket
10 Pitches
lead tape
......
......
150~200mm
Feeding direction
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8.8Test Condition Of Peeling Strength
T op T ape
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S tre n g t
P e e lin g
g
h 2 0 -7 0
10° M ax
C a rrie r T a p e
9 OTHER
9.1 Caution of use
9.1.1 Do not use this product with bend. Please don’t apply excess
mechanical stress to the component and terminals at soldering.
9.1.2 The component may be damaged when an excess stress will be
applied.
9.1.3 This specification mentions the quality of the component as a
single unit. Please insure the component is thoroughly evaluated in your
application circuit.
9.2 Notice
9.2.1 Please return one of this specification after your signature of
acceptance.
9.2.2 When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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