http://www.luguang.cn Email: [email protected] 1 SCOPE This specification shall cover the characteristics of the ceramic fliter with the type LTCV10.7MS3. The LTCV10.7MS3 filters are small, high performance and very thin (1.5mm) chip devices consisting of 2 ceramic elements for communication equipment. They are designed on MgTiO3 ceramic cap package. 2 PART NO. PART NUMBER CUSTOMER PART NO. SPECIFICATION NO. LTCV10.7MS3 3 OUTLINE DRAWING AND STRUCTURE 3.1 Appearance No visible damage and dirt. 3.2 Dimensions 7. 1 3 S3 3. ±0.3 3 ① ② ③ range of frequency 2 3 2 3 2 3 ①:Input ②:Ground ③:output Unit:mm SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 http://www.luguang.cn Email: [email protected] 3.3 STRUCTURE O u tp u t/In p u t E le c t ro d e C e rm ic C over O s c il la tio n E le c tro d e g lu e C e r m ic S u b s tra te 4 ELECTRICAL SPECIFICATIONS 4.1 RATING Items Content Withstanding Voltage (V) 50 (DC，1min) Insulation Resistance Ri,（MΩ）min. 100 （100V，1min） Operating Temperature Range (℃) -25～+85 Storage Temperature Range (℃) -40～+85 4.2 ELECTRICAL SPECIFICATIONS Items Content Center Frequency(fo)(MHz) A:10.700±0.030 B:10.670±0.030 The center point of 3dB band width is defined as C:10.730±0.030 D:10.640±0.030 the center frequency and identified by the E:10.760±0.030 letters:A,B,C,D or E. 3dB Bandwidth(kHz) 180±40 20dB Bandwidth(kHz) max 470 Insertion Loss (dB) 4.0±2.0 (at minimum loss point) Ripple (dB) max 1.0 (within 3dB Bandwidth) Spurious Response (dB) min 35 (9MHz-12MHz) Input/Output Impedance(Ω) 330 SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 2 http://www.luguang.cn Email: [email protected] 5 TEST 5.1 Test Conditions Parts shall be tested under a condition (Temperature:+20℃±15℃， Humidity:65%±20%R.H.)unless the standard condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated to test. 5.2 Test Circuit: R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω C2=10 Pf (Including stray capacitance and capacitance of RF Voltmeter) 3 1 Rg 2 S.S.G:Output Voltmeter R2 S.S.G. C2 RF Voltmeter ①:Input ②:Ground ③:Output 6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS NO. 6.1 6.2 Item Low Temp Storage High Temp Storage 6.3 Humidity 6.4 Thermal Shock 6.5 Soldering Test 6.6 Solderability Condition of Test Stored in -40℃±3℃ for 96h，and left at room temp. for 1h before measurement. Stored in 85℃±2℃ for 96h，and left at room temp. for 1h before measurement. Stored at 40℃±2℃，in 90%～95%R.H. for 96h, and left at room temp. for 1h before measurement After temp. cycling of -40℃(30 minutes) to +85℃ (30min) was performed 5 times, filter shall be measured after being placed in natural condition for 1h. Passed through the reflow oven under the following condition for 2 times, and left at room temp. for 24h before measurement. Dipped in 235℃±5℃ solder bath for 3s±0.5s with rosin flux. Temp. at the surface of Time the substrate Preheat 150℃±5℃ 60s±10s Peak 235℃±5℃ 10s±3s Performance Requirment Meet Table 1 Meet Table 1 Meet Table 1 Meet Table 1 Meet Table 1 The terminals shall be at least 95% covered by solder SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 3 http://www.luguang.cn 6.7 Drop test 6.8 Vibration Email: [email protected] Free drop to the wood plate from the height of 70 Meet Table 1 cm for 3 times. Apply the vibration of sweep frequency 10 to 55Hz/minutes, amplitude 1.5mm, duration 2h in Meet Table 1 each direction of 3 planes. Mount on a glass-epoxy board( width=50 mm, thickness=1.6mm),then bend it to 1mm displacement(velocity 1mm/sec) and keep it for 5s. Mechanical damage such as break shall not occur Press Board Bending 20 Press Head R10 Support bar 5 45± 2 D.U.T 1.0± 0.2 6.9 45± 2 TABLE 1 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS Item Specification after test Insertion Loss Drift (dB) max 3dB Bandwidth Drift (kHz) max 20dB Bandwidth Drift (kHz) max ±2 ±25 ±60 Note ： The limits in the above table are referenced to the initial measurements. 7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS 7.1Recommended land pattern 2.9± 0.3 4.0± 0.3 2.9± 0.3 1.5± 0.3 1.5± 0.3 1.5± 0.3 SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 4 http://www.luguang.cn Email: [email protected] 7.2Recommended reflow soldering standard conditions Temperature(℃) within 10 sec 220~230℃ 200 150 100 Pre-heating within 80-120sec. within 20-40sec 8 PACKAGE To protect the products in storage and transportation ，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 http://www.luguang.cn NO. 1 2 3 4 5 6 7 Name Package Certificate of approval Label Tying Adhesive tape Belt Inner Box Email: [email protected] Quantity 1 1 1 2 1.2m 2.9m 10 Notes Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is vacuum packed for plastic bag (at 300 Torr of vacuum rate). Quantity of package Per plastic reel 4000 pieces of piezoelectric ceramic part Per inner box 1 reels Per package 10 inner boxes（40000 pieces of piezoelectric ceramic part ） Inner Packing Dimensions 1.UNIT: mm 1 Label 2 QC Label 3 Inner Box SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 6 http://www.luguang.cn Email: [email protected] Pars shall be packaged in box with hold down tape upside. Part No., quantity and lot No. 8.5Reel 2.0± 0.5 21± 0 ( 330± 3) 13.0± 0.5 .8 (Unit: mm) 120° 16.4min 22.4max. 7.5± 0.1 16.0± 0.2 4.0± 0.1 2.0± 0.1 1.5 0 7.5± 0.1 1.75± 0.1 8.6Taping Dimensions 1.5 0+0.1 (Unit:mm) Chip Filter 8.0± 0.1 3.5± 0.1 8.7Tape Characteristics Blank Pocket 10 Pitches End Loaded Pocket Blank Pocket 10 Pitches lead tape ...... ...... 150~200mm Feeding direction SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 7 http://www.luguang.cn 8.8Test Condition Of Peeling Strength T op T ape Email: [email protected] S tre n g t P e e lin g g h 2 0 -7 0 10° M ax C a rrie r T a p e 9 OTHER 9.1 Caution of use 9.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 9.1.2 The component may be damaged when an excess stress will be applied. 9.1.3 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 9.2 Notice 9.2.1 Please return one of this specification after your signature of acceptance. 9.2.2 When something gets doubtful with this specifications, we shall jointly work to get an agreement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 8