http://www.luguang.cn Email: [email protected] 1. SCOPE This specification shall cover the characteristics of the ceramic resonator with the type ZTTCW24.0MX. 2. PART NO.: PART NUMBER CUSTOMER PART NO SPECIFICATION NO ZTTCW24.0MX 3. OUTLINE DRAWING AND DIMENSIONS: Appearance: No visible damage and dirt. Dimensions: NOTES: 1.All dimensions are in millimeters. 2.Marking: A and EIAJ Monthly Code. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 http://www.luguang.cn Email: [email protected] 4. STRUCTURE NO: Components Materials 1 Ceramic Substrate Insulation Substrate 2 Ceramic Substrate Piezoelectric Ceramics (PZT) 3 Ceramic Substrate Insulation Substrate 4 Adhesive Epoxy Resin 5 UV Ink for Marking 6 Outer Electrodes Top and Bottom Electrodes Ag+Ni(under plating)+Sn(over plating) Side Electrodes Ni+Cu+Ag(under plating)+Sn(over plating) 7 Electrode Cu+Ag SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 2 http://www.luguang.cn Email: [email protected] 5. ELECTRICAL SPECIFICATIONS: Requirements No Item 5.1 Oscillation Frequency Fosc （MHz） 24.0 Frequency Accuracy (%) ±0.5 Resonant Impedance Ro (Ω)max 40 Temperature Coefficient of ±0.2 (Oscillation Frequency Oscillation Frequency (%) max drift -25℃ to +85℃) Withstanding Voltage 50 VDC, 1 min Rating Voltage UR (V) (1) D.C. Voltage 6 VDC. (2) A.C. Voltage 15 Vp-p. 5.2 5.3 5.4 5.5 5.6 Insulation Resistance Ri,（MΩ）min 500 5.7 5.8 5.9 5.10 Operating Temperature (℃) Storage Temperature (℃) Aging Rate (%) max Loop Gain (dB) min -25～+85 -55～+85 ±0.2 (For 10 years) 12.0 6. MEASUREMENT: Measurement Conditions: Parts shall be measured under a condition ( Temp. ： 20±15 ℃ ,Humidity ： 65±20% R.H.) unless the standard condition(Temp. ： 25±3 ℃ ,Humidity ： 65±5% R.H.) is regulated to measure. Test Circuit: IC: 1/6 TC74HCU04P×2 X: Ceramic Resonator SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 3 http://www.luguang.cn Email: [email protected] 7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS No Item 7.1 Humidity 7.2 Vibration 7.3 Mechanical Shock 7.4 Soldering Test 7.5 Solder Ability 7.6 High Temperature Exposure Condition of Test Performance Requirements Keep the resonator at 60±2 ℃ and It shall fulfill the 90-95% RH for 96±4 hours. Then release specifications in Table the resonator into the room condition for 1 1. hour prior to the measurement. Subject the resonator to vibration for 2 It shall fulfill the hours each in x、y and z axis with the specifications in Table amplitude of 1.5mm, the frequency shall 1. be varied uniformly between the limits of 10Hz—55Hz. Drop the resonator randomly onto a It shall fulfill the wooden floor from the height of 100cm 3 specifications in Table times. 1. Passed through the re-flow oven under the It shall fulfill the following condition and left at room specifications in Table temperature for 1 hour before 1. measurement. Temperature at the Time surface of the substrate Preheat 150±5℃ 60±10 sec Peak 240±5℃ 10±3 sec Dipped in The terminals shall 230±5℃ solder be at least 95% bath for 3±0.5 sec covered by solder. seconds with rosin flux 25wt% ethanol solution. Subject the It shall fulfill the resonator to 85±5℃ specifications in for 96±4 hours. Table 1. Then release the resonator into the room conditions for 1 hour prior to the measurement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 4 http://www.luguang.cn Email: [email protected] 7. PHYSICAL AND ENVIRONMENAL CHARACTERISICS (Continued from the preceding page) No Item Condition of Test 7.7 Low Temperature Exposure 7.8 Temperature Cycling 7.9 Board Bending Subject the resonator to –25±5℃ for 96±4 hours. Then release the resonator into the room conditions for 1 hour prior to the measurement. Subject the resonator to -40℃ for 30 min. followed by a high temperature of 85℃ for 30 min. cycling shall be repeated 5 times with a transfer time of 15 sec. At the room temperature for 1 hour prior to the measurement. Mount a glass-epoxy board (Width=40mm,thickness=1.6mm), then bend it to 1mm displacement and keep It for 5 seconds. (See the following Figure) Performance Requirements It shall fulfill the specifications in Table 1. It shall fulfill the specifications in Table 1. Mechanical damage such as breaks shall not occur. PRESS PRESS HEAD D SUPPORT BAR TABLE 1 Item Specification Oscillation Frequency Change △Fosc/Fosc (%) max ±0.3 Resonant Impedance (Ω) max 60 8. REVIEW OF SPECIFICATIONS When something gets doubtful with this specifications, we shall jointly work to get an agreement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 http://www.luguang.cn Email: [email protected] 9. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS a) Recommended land pattern ：Land Pattern b) Recommended reflow soldering standard conditions within 10 sec ℃ Pre-heating within 80-120sec. within 20-40sec 10. PACKAGE To protect the products in storage and transportation ，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 6 http://www.luguang.cn a) Dimensions and Mark Email: [email protected] At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) b) NO. Name Quantity 1 Package 1 2 Certificate of approval 1 3 Label 1 4 Tying 2 5 Adhesive tape 1.2m 6 Belt 2.9m 7 Inner Box 10 Notes Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner boxes, each box has 6 reels (each reel for plastic bag). SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 7 c) http://www.luguang.cn Quantity of package Email: [email protected] Per plastic reel 3000 pieces of piezoelectric ceramic part Per inner box 6 reels Per package 12 inner boxes（216000 pieces of piezoelectric ceramic part ） d) Inner Packing Dimensions 1 Label 2 QC Label 3 Inner Box UNIT: mm Pars shall be packaged in box with hold down tape upside. Part No., quantity and lot No. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 8 http://www.luguang.cn e) Email: [email protected] Reel φ max f) Packing Method Sketch Map Blank Pocket 10 Pitches Loaded Pocket Leader 200mm Max Blank Pocket 10 Pitches g) Test Condition Of Peeling Strength T op T ape g th S tre n g n i l e Pe g 20-70 10° Max C a rrie r T a p e SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 9