DATA SHEET DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1678G 5 V-BIAS, +17.5 dBm OUTPUT, 2.0 GHz WIDEBAND Si MMIC AMPLIFIER DESCRIPTION The µPC1678G is a silicon monolithic integrated circuit designed as medium output power amplifier for high frequency system applications. Due to +17.5 dBm TYP. output at 2 GHz, this IC is recommendable for transmitter stage amplifier of L BAND wireless communication systems. This IC is packaged in 8-pin plastic SOP. This IC is manufactured using NEC’s 20 GHz fT NESAT™IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • Supply voltage : VCC = 4.5 to 5.5 V • Saturated output power : PO(sat) = +17.5 dBm TYP. @ f = 500 MHz with external inductor • Wideband response : fu = 2.0 GHz TYP. @ 3 dB bandwidth • Power gain : GP = 23 dB TYP. @ f = 500 MHz • Isolation : ISL = 35 dB TYP. @ f = 500 MHz APPLICATIONS • PA driver for high frequency system. ORDERING INFORMATION Part Number µPC1678G Package Marking 8-pin plastic SOP (225 mil) 1678 Supplying Form Plastic magazine case µPC1678G -E1 Embossed tape 12 mm wide. 1 pin is tape pull-out direction. Qty 2.5 kp/reel. µPC1678G -E2 Embossed tape 12 mm wide. 1 pin is tape roll-in direction. Qty 2.5 kp/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC1678G) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11491EJ4V0DS00 (4th edition) Date Published September 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1996, 1999 µPC1678G PIN CONNECTIONS Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 GND 5 OUTPUT 6 GND 7 GND 8 VCC (Top Veiw) 1 8 2 7 3 6 4 5 PRODUCT LINE-UP (TA = +25 °C, VCC = Vout = 5.0 V, ZL = ZS = 50 Ω) Part Number fu (GHz) PO(sat) (dBm) GP (dB) NF (dB) ICC (mA) µPC1678G 2.0 +17.5 23 6.0 49 8-pin plastic SOP (225 mil) µPC1678GV 2.0 +17.5 23 6.0 49 8-pin plastic SSOP (175 mil) Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. SYSTEM APPLICATION EXAMPLE RX ÷N SW TX PA 2 Package driver µ PC1678G/GV Data Sheet P11491EJ4V0DS00 PLL µPC1678G PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) 1 INPUT – 2 3 4 6 7 GND 5 OUTPUT 8 VCC 0 Function and Applications Internal Equivalent Circuit Signal input pin. A internal matching circuit, configured with resisters, enables 50 Ω connection over a wide band. A multi-negative feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as widely as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Voltage as same as VCC through external inductor Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. 4.5 to 5.5 Power supply pin, which biases the internal input transistors. This pin should be externally equipped with bypass capacitor to minimize its impedance. Data Sheet P11491EJ4V0DS00 8 VCC 5 OUT IN 1 6 7 GND 2 3 4 GND 2, 3, 4, 6 and 7 are shorted by a lead frame. 3 µPC1678G ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Rating Unit 6 V 360 mW Supply Voltage VCC TA = +25 °C, pin 5 and 8 Power Dissipation PD Mounted on double copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin +10 dBm TA = +25 °C RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −45 +25 +85 °C Notice The same voltage should be applied to pin 5 and 8 ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) Parameter Conditions MIN. TYP. MAX. Unit 40.0 49.0 60.0 mA Circuit Current ICC No signal Power Gain GP f = 500 MHz 21 23 25 dB Noise Figure NF f = 500 MHz − 6.0 8.0 dB 3 dB down below the gain at 0.1 GHz 1.7 2.0 − GHz Upper Limit Operating Frequency 4 Symbol fu Isolation ISL f = 500 MHz 30 35 − dB Input Return Loss RLin f = 500 MHz 11 14 − dB Output Return Loss RLout f = 500 MHz 1 4 − dB Saturated Output Power PO(sat) f = 500 MHz +15.5 +17.5 − dBm Data Sheet P11491EJ4V0DS00 µPC1678G TEST CIRCUIT VCC 1 800 pF L 8 50 Ω 1 IN 50 Ω 5 1 800 pF OUT 1 800 pF 2, 3, 4, 6, 7 L: 20.5 T, 2 mm I.D., φ 0.25 UEW (about 300 nH) INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 30 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 8) and output pin (pin 5). The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 800 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 800 pF capacitors are used in the test circuit. In the case of under 100 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 πRfc). Data Sheet P11491EJ4V0DS00 5 µPC1678G ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 1 µ PC1678G/79G Vcc Top View 8 7 6 5 1 2 3 4 IN C1 C3 L C2 OUT Mounting Direction COMPONENT LIST Value C1 to C3 1 800 pF L 300 nH Notes 1. 50 × 50 × 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E). 6 Data Sheet P11491EJ4V0DS00 µPC1678G TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 70 70 No Signal 60 Circuit Current ICC (mA) Circuit Current ICC (mA) 60 50 40 30 20 10 0 No Signal VCC = 5.0 V 50 40 30 20 10 0 1 2 3 4 Supply Voltage VCC (V) 5 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) 6 NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY INSERTION POWER GAIN vs. FREQUENCY 35 35 VCC = 5.0 V 7 6 5 30 Insertion Power Gain GP (dB) 8 VCC = 5.5 V 25 20 VCC = 5.0 V VCC = 4.5 V GP 15 VCC = 5.0 V 10 VCC = 5.5 V NF TA = –45 °C 25 20 TA = +25 °C TA = +85 °C 15 10 5 5 VCC = 4.5 V 4 0 0.01 0.03 0.1 0.3 Frequency f (GHz) 1.0 0 0.01 3.0 0.03 0.1 0.3 Frequency f (GHz) 1.0 3.0 INPUT RETURN LOSS AND OUTPUT RETURN LOSS vs. FREQUENCY ISOLATION vs. FREQUENCY +10 0 VCC = 5.0 V Input Rerurn Loss RLin (dB) –10 –20 –30 –40 –50 –60 0.01 0.03 0.1 0.3 Frequency f (GHz) 1.0 3.0 Output Rerurn Loss RLout (dB) VCC = 5.0 V Isolation ISL (dB) Noise Figure NF (dB) 9 Insertion Power Gain GP (dB) 30 0 RLout –10 –20 RLin –30 –40 0.01 Data Sheet P11491EJ4V0DS00 0.03 0.1 0.3 Frequency f (GHz) 1.0 3.0 7 µPC1678G OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +25 +25 f = 500 MHz VCC = 5.0 V f = 500 MHz +20 VCC = 5.5 V +15 VCC = 5.0 V VCC = 4.5 V +10 Output Power Pout (dBm) Output Power Pout (dBm) +20 –10 –5 0 Input Power Pin (dBm) +5 Saturated Output Power PO(sat) (dBm) TA = –45 °C VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V +10 +5 0.03 0.1 0.3 –10 –5 0 +5 +10 1.0 3.0 THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –70 f1 = 500 MHz f2 = 502 MHz –60 VCC = 5.5 V –50 –40 VCC = 5.0 V –30 VCC = 4.5 V –20 –10 0 –5 Frequency f (GHz) 8 –15 Input Power Pin (dBm) +20 0 0.01 TA = +25 °C +10 0 –20 +10 Third Order Intermoduration Distortion IM3 (dBc) –15 SATURATED OUTPUT POWER vs. FREQUENCY +25 Pin = +3 dBm +15 +15 +5 +5 0 –20 TA = +85 °C 0 +5 +10 Output Power of Each Tone PO(each) (dBm) Data Sheet P11491EJ4V0DS00 +15 µPC1678G S-PARAMETER (TA = +25 °C, VCC = Vout = 5.0 V) S11-FREQUENCY 1.0 G 3.0 G 0.1 G 2.0 G S22-FREQUENCY 3.0 G 0.1 G 2.0 G 1.0 G Data Sheet P11491EJ4V0DS00 9 µPC1678G TYPICAL S-PARAMETER VALUES (TA = +25 °C) µ PC1678G VCC = Vout = 5.0 V, ICC = 49 mA FREQUENCY S11 S21 S12 S22 K MHz MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG. 100.0000 0.078 −173.8 12.298 −4.0 0.023 −6.4 0.555 −3.2 1.40 200.0000 0.106 −179.1 12.891 −8.6 0.020 −7.3 0.593 −8.7 1.43 300.0000 0.140 166.3 13.625 −14.8 0.016 −4.7 0.630 −16.4 1.59 400.0000 0.176 150.2 14.453 −22.6 0.014 6.4 0.657 −25.3 1.53 500.0000 0.212 132.9 15.257 −31.5 0.014 23.1 0.673 −35.4 1.38 600.0000 0.246 115.5 15.663 −40.8 0.017 35.1 0.676 −45.1 1.05 700.0000 0.275 99.2 16.156 −51.3 0.020 41.0 0.669 −55.0 0.86 800.0000 0.304 83.2 16.291 −60.7 0.024 42.4 0.654 −64.0 0.71 900.0000 0.323 68.2 16.289 −71.0 0.027 41.8 0.627 −72.4 0.65 1000.0000 0.403 53.3 17.096 −80.2 0.030 47.1 0.660 −76.7 0.45 1100.0000 0.408 37.1 16.669 −90.7 0.036 43.0 0.646 −85.4 0.44 1200.0000 0.421 22.2 16.591 −100.7 0.036 41.3 0.639 −93.7 0.44 1300.0000 0.436 6.4 16.370 −111.2 0.041 36.5 0.660 −101.7 0.41 1400.0000 0.449 −8.4 16.056 −121.8 0.042 33.9 0.670 −109.8 0.40 1500.0000 0.463 −25.0 15.852 −131.6 0.045 28.3 0.690 −118.7 0.40 1600.0000 0.474 −41.5 15.332 −142.8 0.049 25.9 0.717 −127.0 0.41 1700.0000 0.472 −58.3 14.865 −154.2 0.048 22.1 0.734 −136.6 0.45 1800.0000 0.468 −76.1 14.169 −164.9 0.049 15.7 0.763 −146.9 0.48 1900.0000 0.457 −92.5 13.229 −176.8 0.048 13.7 0.783 −156.8 0.54 2000.0000 0.447 −109.6 12.144 172.6 0.048 8.1 0.806 −167.8 0.58 2100.0000 0.447 −126.4 10.947 162.7 0.049 4.0 0.830 −178.6 0.64 2200.0000 0.434 −142.6 9.853 153.4 0.047 −2.0 0.843 170.2 0.69 2300.0000 0.429 −158.5 8.796 146.3 0.044 −6.7 0.842 159.4 0.77 2400.0000 0.427 −173.0 7.894 139.7 0.040 −9.9 0.843 148.2 0.86 2500.0000 0.422 172.5 7.048 133.3 0.036 −12.5 0.825 137.4 0.99 2600.0000 0.419 158.3 6.363 128.8 0.027 −17.6 0.785 125.7 1.34 2700.0000 0.416 145.6 5.881 125.1 0.023 −17.2 0.744 117.2 1.71 2800.0000 0.400 136.1 5.387 121.3 0.018 4.5 0.701 109.7 2.34 2900.0000 0.402 126.2 5.223 116.2 0.018 11.0 0.681 103.0 2.53 3000.0000 0.406 118.1 5.030 113.5 0.020 28.2 0.645 96.5 2.45 3100.0000 0.397 109.8 4.675 107.3 0.022 35.3 0.616 90.7 2.47 10 Data Sheet P11491EJ4V0DS00 µPC1678G PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (Unit: mm) 8 5 detail of lead end P 4 1 A H F I G J S B C E D M L N K S M NOTE ITEM Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P11491EJ4V0DS00 MILLIMETERS A 5.2±0.2 B 0.85 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E F 0.1±0.1 1.57±0.2 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L M 0.6±0.2 0.12 N 0.10 P +7° 3° −3° 11 µPC1678G NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to keep mininum ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit : None IR35-00-3 VPS Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit : None VP15-00-3 Wave Soldering Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit : None WS60-00-1 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit : None – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 12 Data Sheet P11491EJ4V0DS00 µPC1678G [MEMO] Data Sheet P11491EJ4V0DS00 13 µPC1678G [MEMO] 14 Data Sheet P11491EJ4V0DS00 µPC1678G [MEMO] Data Sheet P11491EJ4V0DS00 15 µPC1678G NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8